JPS6233335Y2 - - Google Patents
Info
- Publication number
- JPS6233335Y2 JPS6233335Y2 JP15357882U JP15357882U JPS6233335Y2 JP S6233335 Y2 JPS6233335 Y2 JP S6233335Y2 JP 15357882 U JP15357882 U JP 15357882U JP 15357882 U JP15357882 U JP 15357882U JP S6233335 Y2 JPS6233335 Y2 JP S6233335Y2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- temperature compensation
- heat sink
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000003321 amplification Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案は温度補償用トランジスタ等の半導体素
子の取付装置に関する。[Detailed Description of the Invention] The present invention relates to a mounting device for semiconductor elements such as temperature compensation transistors.
従来のオーデイオアンプは、たとえば第１図に
示すように、温度補償用トランジスタ１、パワー
トランジスタ２等の電子回路部品を取付けたプリ
ント基板３を適宜の構造によりシヤーシ（図示せ
ず）に取付け、パワートランジスタ２をヒートシ
ンク４に熱的に結合させて取付けるとともに、温
度補償用トランジスタ１を半円筒状取付金具５に
よつてヒートシンク４に熱的に結合させて取付け
た構造である。 In a conventional audio amplifier, for example, as shown in FIG. 1, a printed circuit board 3 on which electronic circuit components such as a temperature compensation transistor 1 and a power transistor 2 are mounted is attached to a chassis (not shown) using an appropriate structure, and the power is In this structure, the transistor 2 is thermally coupled and attached to the heat sink 4, and the temperature compensating transistor 1 is thermally coupled and attached to the heat sink 4 using a semi-cylindrical mounting bracket 5.
以上の構造は、プリント基板３と温度補償用ト
ランジスタ１とが別々の取付構造で取付けられて
おり、また、そのために温度補償用トランジスタ
１の半田付部が破損しやすい欠点がある。 In the above structure, the printed circuit board 3 and the temperature compensation transistor 1 are mounted using separate mounting structures, and this also has the disadvantage that the soldered portion of the temperature compensation transistor 1 is easily damaged.
本考案はこのような従来欠点を改良したもの
で、以下図において説明する。図中、第１図の従
来例と同等部分には同一符号を付し、その説明は
省略する。 The present invention improves on these conventional drawbacks, and will be explained below with reference to the drawings. In the figure, parts equivalent to those of the conventional example shown in FIG. 1 are given the same reference numerals, and their explanations will be omitted.
第２図において説明すると、本考案は、プリン
ト基板３の温度補償用トランジスタ１の取付部近
傍の端部を外方へ突出させて取付部６を設け、温
度補償用トランジスタ１および取付部６をヒート
シンク４に当接させ、取付金具７をその平板状
（または半円筒状等）押え部７ａによつて温度補
償用トランジスタ１を押えてプリント基板３の取
付部６とともにネジ８によりヒートシンク４に取
付けた構造である。 Referring to FIG. 2, in the present invention, the end portion of the printed circuit board 3 near the mounting portion of the temperature compensation transistor 1 is provided with a mounting portion 6 by protruding outward, and the temperature compensation transistor 1 and the mounting portion 6 are connected to each other. Place the mounting bracket 7 in contact with the heat sink 4, press the temperature compensation transistor 1 with its flat (or semi-cylindrical, etc.) holding part 7a, and attach it to the heat sink 4 together with the mounting part 6 of the printed circuit board 3 using screws 8. It has a similar structure.
なお、本考案は温度補償用トランジスタ１だけ
でなく、放熱を必要とする信号増幅用トランジス
タ等の半導体素子に適用しうるものであり、ま
た、第３図に示すように、両側に押え部７ａ，７
ａを設けた取付金具７によつて２個の温度補償用
トランジスタ１，１を取付けるようにしてもよ
い。 Note that the present invention can be applied not only to the temperature compensation transistor 1 but also to semiconductor devices such as signal amplification transistors that require heat dissipation, and as shown in FIG. ,7
The two temperature compensating transistors 1, 1 may be mounted using a mounting bracket 7 provided with a.
以上のように、本考案は、取付金具７によつて
温度補償用トランジスタ１とプリント基板３とを
共に取付けるようにしたので、従来のようなプリ
ント基板３の取付構造が不要であり、部品点数が
減り安価になるばかりでなく、温度補償用トラン
ジスタ１の半田付部近傍の取付部６をヒートシン
ク４に取付固定するので、半田付部の破損が皆無
になる実用的な利点を有する。 As described above, in the present invention, since the temperature compensation transistor 1 and the printed circuit board 3 are mounted together using the mounting bracket 7, the conventional mounting structure for the printed circuit board 3 is not required, and the number of parts is reduced. Not only is the cost reduced because the temperature compensation transistor 1 is soldered, but since the mounting part 6 near the soldered part of the temperature compensation transistor 1 is fixed to the heat sink 4, there is a practical advantage that there is no damage to the soldered part.
第１図は従来の半導体素子取付装置の構造を示
す斜視図、第２図は本考案の半導体取付装置の構
造を示す斜視図、第３図は同、他の実施例を示す
斜視図である。
１は半導体素子、３はプリント基板、４はヒー
トシンク、６は取付部、７は取付金具、７ａは押
え部である。
FIG. 1 is a perspective view showing the structure of a conventional semiconductor device mounting device, FIG. 2 is a perspective view showing the structure of the semiconductor mounting device of the present invention, and FIG. 3 is a perspective view showing another embodiment of the same. . 1 is a semiconductor element, 3 is a printed circuit board, 4 is a heat sink, 6 is a mounting portion, 7 is a mounting bracket, and 7a is a holding portion.
Claims (1)
の上記半導体素子１取付部近傍の端部を外方へ突
出させて取付部６を設け、当該取付部６および半
導体素子１をヒートシンク４に当接させ、取付金
具７を当該取付金具７の押え部７ａによつて上記
半導体素子１を押えて上記取付部６とともにヒー
トシンク４に取付けた構造の半導体素子取付装
置。 Printed circuit board 3 with semiconductor element 1 attached to the end
A mounting part 6 is provided by protruding the end near the mounting part of the semiconductor element 1 to the outside, and the mounting part 6 and the semiconductor element 1 are brought into contact with the heat sink 4, and the mounting bracket 7 is pressed against the mounting bracket 7. A semiconductor device mounting device having a structure in which the semiconductor device 1 is held down by the portion 7a and mounted to the heat sink 4 together with the mounting portion 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15357882U JPS5958947U (en) | 1982-10-08 | 1982-10-08 | Semiconductor element mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15357882U JPS5958947U (en) | 1982-10-08 | 1982-10-08 | Semiconductor element mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5958947U JPS5958947U (en) | 1984-04-17 |
| JPS6233335Y2 true JPS6233335Y2 (en) | 1987-08-26 |
Family
ID=30339737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15357882U Granted JPS5958947U (en) | 1982-10-08 | 1982-10-08 | Semiconductor element mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5958947U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012160646A (en) * | 2011-02-02 | 2012-08-23 | Shindengen Electric Mfg Co Ltd | Electronic circuit device and manufacturing method thereof |
-
1982
- 1982-10-08 JP JP15357882U patent/JPS5958947U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012160646A (en) * | 2011-02-02 | 2012-08-23 | Shindengen Electric Mfg Co Ltd | Electronic circuit device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5958947U (en) | 1984-04-17 |
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