JPS6233733B2 - - Google Patents
Info
- Publication number
- JPS6233733B2 JPS6233733B2 JP6080082A JP6080082A JPS6233733B2 JP S6233733 B2 JPS6233733 B2 JP S6233733B2 JP 6080082 A JP6080082 A JP 6080082A JP 6080082 A JP6080082 A JP 6080082A JP S6233733 B2 JPS6233733 B2 JP S6233733B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- composite film
- capacitor
- aluminum
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Organic Insulating Materials (AREA)
- Inorganic Insulating Materials (AREA)
Description
本発明は金属フイルムの両面にプラスチツクフ
イルムによつて駆動用電解液(以後ペーストと略
す)を含浸させたセパレータを電極間に介在させ
てコンデンサ素子外装を行なつた内外リードの接
続部を複合フイルム内に設け複合フイルム端を熱
圧着した複合フイルム外装電解コンデンサに関す
る。
従来の電解コンデンサは一般的には電極箔間に
セパレータを介在し巻回してなるコンデンサ素子
にペーストを含浸し金属ケースに内蔵し開口部に
外部引出しリードを貫通させて封口ゴムパツキン
グを封着し構成されている。
このような電解コンデンサにおいて外部からの
水分その他コンデンサに有害な物質の浸入を阻止
するとともに内部に含有するペーストの蒸発拡散
を阻止する働きを外装ケースおよび封口体で行な
つている。
最近機器の小形化、薄形化が進められ電解コン
デンサにおいても部品の収納スペースに合せた従
来と異なつた形状の製品開発への要求に対応し電
解コンデンサの外装体としてプラスチツクラミネ
ートフイルムを使い密封外装することが開発され
た。この電解コンデンサは、シート状、角形、丸
形、楕円形、同心円状、三角形など自由な外観形
状を得ることができスペースの有効活用などによ
り機器の小形化薄形化に極めて効果が大きい。
しかしこのようなフイルム外装を用いた電解コ
ンデンサにおいてコンデンサ素子から引出したリ
ードと機器のプリント基板などへの実装のため半
田付可能なすず、亜鉛、銅、ニツケル、ハンダな
どの材質やこれらのメツキによるリードを使用し
なければならず、またこれらの金属はコンデンサ
素子に密着したり、ペーストが付着した場合には
コンデンサの電極がアルミであるため異種金属間
での電気化学的反応により電極が劣化したり、電
極上に金属が移動しシヨート状態になつたり、電
極やリードの溶解などの反応を生じガス発生や断
線が生じコンデンサとして作動できなくなるなど
の欠陥を生じるなどの欠点がある。そのためには
電極から引出される内部リードの材質は電極の材
質と同一のアルミしか使用できない。しかしアル
ミでは半田付が困難であり、むしろできないと云
つてよい。ぜがひでも必要な場合にはアルミハン
ダを使用し超音波溶接やアルミへのハンダメツキ
をしなければならず、非常に困難であり、作業性
が悪い。またメツキの場合はリードがもろくなつ
たり、時間もかかりまた外装に接する個所でメツ
キによりシヨートの原因になるなどの欠点があ
る。一方、内部リードにアルミを使い、外部には
半田付可能なリードとの溶接は当然考えられるが
溶接部がコンデンサ素子に接する内部に入れるこ
とが先に述べたようにできない。また外部に溶接
部を出す方式が考えられるが、これは外観上良く
なくまた外部よりの力で溶接部が力を受け切断な
どを生じたり、リボン状のアルミ板や角棒の内部
リードに半田付可能な半田メツキ板や丸棒すず、
メツキ鉄線を溶接してある場合は溶接部まではプ
リント基板の穴まで挿入できるがそれ以上は無理
であり、たとえ挿入しても半田付ができない。
フイルム外装電解コンデンサの従来例を第1図
に斜視図で示す。第2図は第1図X―X′線の断
面図を示す。図示のように内部アルミリード3と
半田付可能な外部リード5と外装複合フイルム1
の外で溶接したものである。
図において、2は熱圧着密着封止部、4はリー
ド接続部、8はコンデンサ素子、を示す。
第2図は内部アルミリード3に外部で半田可能
な金属をメツキしたものである。6はメツキリー
ドで半田付可能である。これらは先に述べたよう
に各種問題がある。
本発明は従来の欠点を除去し、内部リードと外
部リードの溶接部がコンデンサ素子に接しない外
装複合フイルム部分に設けられ、外部よりの力が
直接溶接部に及ばず、リード線の封口部の気密性
のすぐれた複合フイルム外装電解コンデンサを得
ることを目的とする。
本発明を図面に基いて説明する。
第4図に本発明の複合フイルム外装電解コンデ
ンサ(以下単に電解コンデンサという。)の斜視
図、第5図は第4図のY―Y′線の断面図、を示
す。図において、第1図〜第3図と同一符号は同
一部品、同一部分を示す。
本発明は第4図、第5図に示すように内部リー
ド3に半田付可能な外部リード5を接続し、外部
リード5がコンデンサ素子8と接しないように外
装複合フイルム1で内部アルミリード部3を熱圧
着挾持し、熱圧着密着封止部2―1を構成し、更
に半田付可能な外部リード5と内部リード3のリ
ード接続部4を覆い半田付可能な外部リード5を
外装複合フイルム端で熱圧着挾持密着封止し熱圧
着密着封止部2を設けて構成されている。
次に本発明の実施例、を説明すると共に従来の
電解コンデンサと比較説明する。
複合フイルム外装薄形コンデンサの複合フイル
ム材としてアルミ箔に一方にポリエチレンテレフ
タレートと他の面にはアイオノマー樹脂でラミネ
ートされたものを使用し熱圧着面としてアイオノ
マー樹脂側を使う。製品定格として16W.V1000μ
F、で比較品として第1図の形状のもので寸法30
mm×49mmの角形で厚さ1.5mm、リードとして内部
アルミリード板に0.6mm直径のCP線(鉄芯銅被覆
すずメツキ線)を溶接し外部のリードとした。
本発明の例として同一定格で第4図の形状で寸
法38mm×49mmの角形で厚さ1.5mm外部のリードと
して0.6mm直径のCP線を内部で溶接し複合フイル
ム端で再度熱圧着密着封止したものを使用した。
また、従来品として同一定格で、リード線同一
方向形アルミ同筒ケース、ゴム封口、0.6mm直径
CP線のリードで外形寸法12.5mm、直径25mm長さ
の製品を使用する。
各種比較試験の代表例として本発明の作用効果
の大きい半田耐熱試験と塩水噴霧試験の結果を次
に示す。試験個数は各30個づつ実施した。
半田耐熱試験として最近の実装技術面よりプリ
ント基板がスルーホール形で半田がリードの根本
まで上がることが生じ得るために350℃溶融半田
中にリードの根本まで5秒浸漬による試験を行な
つた。判定として封口部の気密性および初期特性
変化で行なつた。表1に示すように初期特性変化
ではすべて合格し問題はなかつたが外観上で外装
フイルムのリード挾持密着密封個所が熱により開
口ぎみのものが認められた。気密性試験としてエ
チレングリコール中にコンデンサを浸漬し10mm
Hgに減圧し5分後の気泡の発生で判定した。こ
の試験品はすべて試験前に減圧により気泡の発生
がないことを確認済みである。この封口部の気密
性が劣化し気泡を発生することは内部のペースト
の蒸発や外部から有害物質の浸入によりコンデン
サの寿命を短くし、信頼性を著しく低下すること
である。
表1で示すように本発明品ではリード部が二重
封口となつているため気密性においても問題がな
く信頼性が高くなり作用効果が極めて大きいこと
がわかる。
In the present invention, a composite film is used to connect the inner and outer leads of a capacitor element by interposing a separator in which both sides of a metal film are impregnated with a driving electrolyte (hereinafter referred to as paste) between the electrodes. The present invention relates to a composite film-clad electrolytic capacitor in which the ends of the composite film are thermocompression bonded. Conventional electrolytic capacitors are generally constructed by impregnating a wound capacitor element with paste with a separator between electrode foils, building it in a metal case, passing an external lead through the opening, and sealing it with rubber sealing packing. has been done. In such electrolytic capacitors, the outer case and the sealing body serve to prevent moisture and other harmful substances from entering the capacitor from entering the capacitor, and to prevent the paste contained inside from evaporating and diffusing. Recently, equipment has become smaller and thinner, and electrolytic capacitors are also required to develop products with a different shape than before to fit the storage space of parts.In response to this demand, plastic laminate film is used as the exterior of electrolytic capacitors for sealed exteriors. It was developed to This electrolytic capacitor can have any external shape such as sheet, square, round, oval, concentric, triangular, etc., and is extremely effective in making devices smaller and thinner by making effective use of space. However, in electrolytic capacitors using such a film exterior, the leads drawn out from the capacitor element and the solderable materials such as tin, zinc, copper, nickel, solder, etc., and the plating of these materials are used for mounting on the printed circuit board of the device. Leads must be used, and if these metals come into close contact with the capacitor element or paste adheres to them, the electrodes of the capacitor are made of aluminum, so electrochemical reactions between dissimilar metals can cause the electrodes to deteriorate. They also have drawbacks such as the metal moving onto the electrodes, resulting in a shot state, and reactions such as melting of the electrodes and leads, resulting in gas generation and disconnection, resulting in defects such as the inability to function as a capacitor. For this purpose, the internal lead drawn out from the electrode can only be made of aluminum, which is the same material as the electrode. However, it is difficult to solder aluminum, and in fact it is impossible to solder it. If it is absolutely necessary, it is necessary to use aluminum solder and perform ultrasonic welding or solder plating to aluminum, which is extremely difficult and has poor workability. Also, in the case of plating, there are disadvantages such as the lead becomes brittle, it takes time, and the plating can cause shoots at the parts where it comes into contact with the exterior. On the other hand, it is naturally possible to use aluminum for the internal leads and weld them with solderable external leads, but as mentioned above, it is not possible to insert the welded part inside where it contacts the capacitor element. Another option is to expose the welded part to the outside, but this is not good for the appearance, and the welded part may be damaged by force from the outside, or the internal lead of the ribbon-shaped aluminum plate or square bar may be soldered to the internal lead. Solder-plated plates and round tin bars that can be attached,
If the plated iron wire is welded, it can be inserted up to the welded part up to the hole in the printed circuit board, but it is impossible to go beyond that, and even if it is inserted, it cannot be soldered. A conventional example of a film-clad electrolytic capacitor is shown in a perspective view in FIG. FIG. 2 shows a sectional view taken along line XX' in FIG. 1. As shown in the figure, an internal aluminum lead 3, a solderable external lead 5, and an exterior composite film 1
It was welded outside. In the figure, 2 indicates a thermocompression sealing portion, 4 indicates a lead connection portion, and 8 indicates a capacitor element. FIG. 2 shows an internal aluminum lead 3 plated with a metal that can be soldered externally. 6 can be soldered with a matsuki lead. As mentioned above, these methods have various problems. The present invention eliminates the conventional drawbacks, and the welded part of the inner lead and the outer lead is provided in the part of the exterior composite film that does not touch the capacitor element, so that external force does not directly reach the welded part, and the sealing part of the lead wire is The purpose is to obtain a composite film-clad electrolytic capacitor with excellent airtightness. The present invention will be explained based on the drawings. FIG. 4 shows a perspective view of a composite film-clad electrolytic capacitor (hereinafter simply referred to as an electrolytic capacitor) of the present invention, and FIG. 5 shows a sectional view taken along the line Y--Y' in FIG. 4. In the figures, the same reference numerals as in FIGS. 1 to 3 indicate the same parts and parts. The present invention connects a solderable external lead 5 to an internal lead 3 as shown in FIGS. 3 are sandwiched by thermocompression to form a thermocompression sealing part 2-1, and further the solderable external lead 5 and the lead connection part 4 of the internal lead 3 are covered with an exterior composite film to cover the solderable external lead 5. The ends are tightly sealed by thermocompression clamping, and a thermocompression sealing part 2 is provided. Next, embodiments of the present invention will be described and compared with conventional electrolytic capacitors. The composite film material for the composite film exterior thin capacitor is made of aluminum foil laminated with polyethylene terephthalate on one side and ionomer resin on the other side, and the ionomer resin side is used as the thermocompression bonding surface. Product rating is 16W.V1000μ
F, a comparative product with the shape shown in Figure 1 and dimensions 30
It has a rectangular shape of mm x 49 mm and is 1.5 mm thick. CP wire (iron core copper coated tin wire) with a diameter of 0.6 mm is welded to the internal aluminum lead plate to serve as the external lead. As an example of the present invention, a CP wire with a diameter of 0.6 mm is internally welded as an external lead with the same rating and the shape shown in Figure 4, 38 mm x 49 mm in dimensions, 1.5 mm thick, and tightly sealed by thermocompression at the end of the composite film. I used the one I made. In addition, it has the same rating as the conventional product, lead wire in the same direction, aluminum cylindrical case, rubber seal, 0.6 mm diameter.
Use a CP wire lead with external dimensions of 12.5 mm and diameter of 25 mm. As representative examples of various comparative tests, the results of a solder heat resistance test and a salt spray test, both of which are highly effective in the present invention, are shown below. The number of tests was 30 each. As a solder heat resistance test, due to recent mounting technology, when the printed circuit board is a through-hole type, the solder may rise to the base of the leads, so a test was performed by immersing the base of the leads in molten solder at 350°C for 5 seconds. Judgment was made based on the airtightness of the sealing part and changes in initial characteristics. As shown in Table 1, all initial characteristic changes were passed and there were no problems; however, it was observed that the lead clamping and tightly sealed portions of the outer film were almost open due to heat. As an airtightness test, the capacitor was immersed in ethylene glycol for 10mm.
Judgment was made based on the generation of bubbles 5 minutes after reducing the pressure to Hg. All of these test items were checked to ensure that no air bubbles were generated by reducing the pressure before testing. When the airtightness of the sealing part deteriorates and bubbles are generated, the paste inside the capacitor evaporates and harmful substances enter from the outside, which shortens the life of the capacitor and significantly reduces its reliability. As shown in Table 1, in the product of the present invention, the lead portion is double sealed, so there is no problem with airtightness, the reliability is high, and the effect is extremely large.
【表】
次に塩水噴霧試験によりリード部の腐食試験し
た。試験条件としてJIS―C―5028に準拠し重量
比5%塩水35±2℃で試験品を各30個48時間塩水
噴霧を行ない判定を行なつた。リード端の切口で
のさびの発生は判定に除外する。
表2に示すように外部でリード接続部のある第
1図にあらわした形状の複合フイルム外装コンデ
ンサでは全数にさびおよび腐食発生が認められる
のに対して本発明品では全数ともさびや腐食の発
生が認められない。これはリード接続部が露出し
ていない本発明品の特徴である。[Table] Next, the lead portion was tested for corrosion using a salt spray test. The test conditions were based on JIS-C-5028, and the evaluation was made by spraying 5% salt water by weight at 35±2°C on each of 30 test pieces for 48 hours. Rust formation at the cut end of the lead is excluded from the judgment. As shown in Table 2, all of the composite film-clad capacitors with external lead connections and the shape shown in Figure 1 were found to have rust and corrosion, whereas all of the products of the present invention had rust and corrosion. is not recognized. This is a feature of the product of the present invention in which the lead connection portion is not exposed.
【表】
本発明においては前記の構成を具備するので、
半田付可能な外部リードのアルミと異なる金属と
内部コンデンサ素子と接することもなくなり、先
に述べたシヨートなどのコンデンサとして作動で
きなくなるなどの問題の発生もなくなる、プリン
ト基板への半田付も可能である、外部リード部を
固定してあるために内部リードと外部リードの溶
接などによる接続部に外部ストレスが加わらなく
なるので接続部が切断したりすることもない。内
部素子へのストレスも加わらず特性変化を生ずる
こともない。更には洗浄などによりリードの溶接
部に水分などが付着し電気化学反応により切断な
どが生じることも防止できる。また、品質特性上
ですぐれているのみならずリード接続部が内部に
あり外観上すぐれており商品価値が高い、また、
一方製造上においても半田メツキなどを行う必要
もなく、半田付可能なリードに溶接などで接続す
るのみでよく、形状もリボン状の内部リードと丸
棒やその他の各種形状の外部リードと自由に接続
すればよく、実装に適したリードが使用できるな
どの作用効果もある。さらに品質上でも複合フイ
ルム外装コンデンサにおいて封着部で最も信頼性
の低い個所としてリードを挾持密着封着個所であ
り本発明においてはその信頼性の低い個所を二重
に密着密封するため気密性が高くなり信頼性が高
いコンデンサが得られることとなる。
また、リード接続部が露出していないためにプ
リント基板に取付け後の洗浄や湿度などに対して
も極めて安定であることが容易に推定できる。ま
た振動などに対しても接続部が内部にあるためス
トレスが接続部に集中せず切断などが発生しなく
種々の面において本発明の複合フイルム外装コン
デンサは極薄形で形状も自由に作ることもできし
かも信頼性も高く実装面にも適しており産業上利
用し得る価値が大きい、などの作用効果を生ず
る。[Table] Since the present invention has the above configuration,
There is no need for the internal capacitor element to come into contact with a metal other than the aluminum of the solderable external lead, which eliminates the problem of not being able to operate as a short capacitor, etc., as mentioned earlier, and it can also be soldered to a printed circuit board. Since the external lead portion is fixed, no external stress is applied to the welded connection between the internal lead and the external lead, so the connection does not break. No stress is applied to internal elements and no changes in characteristics occur. Furthermore, it is also possible to prevent moisture from adhering to the welded portion of the lead due to cleaning or the like and causing breakage due to an electrochemical reaction. In addition, it not only has excellent quality characteristics, but also has a lead connection part inside, and has an excellent appearance and high commercial value.
On the other hand, in manufacturing, there is no need to perform soldering, etc., and it is only necessary to connect to solderable leads by welding, etc., and the shape can be freely changed to ribbon-shaped internal leads, round bars, or various other shapes. There are also advantages such as the ability to simply connect and use leads suitable for mounting. Furthermore, in terms of quality, the least reliable part of the sealed part in a composite film-wrapped capacitor is the part where the leads are sandwiched and tightly sealed, and in the present invention, this unreliable part is double-tightly sealed to ensure airtightness. This results in a capacitor with high cost and high reliability. Furthermore, since the lead connection portion is not exposed, it can be easily assumed that the device is extremely stable against cleaning and humidity after being attached to a printed circuit board. In addition, since the connection part is located inside, stress is not concentrated on the connection part and breakage does not occur due to vibrations, etc. The composite film capacitor of the present invention is extremely thin and can be made into any shape in various aspects. Moreover, it is highly reliable, suitable for mounting, and has great value for industrial use.
第1図、第2図は従来複合フイルム外装電解コ
ンデンサの、斜視図と断面図、第3図は第1図と
同じ従来例の斜視図、第4図は本発明の複合フイ
ルム外装電解コンデンサの斜視図、第5図は本発
明の第4図のY―Y線の横断面図、第6図は本発
明の第4図および第5図で表わした電解コンデン
サの一部を欠いて示す斜視図、を示す。
1:外装複合フイルム、2,2―1:熱圧着密
着封止部、3:内部リード、4:リード接続部、
5:外部リード、6:メツキリード、8:コンデ
ンサ素子。
Figures 1 and 2 are a perspective view and a sectional view of a conventional composite film-clad electrolytic capacitor, Figure 3 is a perspective view of the same conventional example as Figure 1, and Figure 4 is a composite film-clad electrolytic capacitor of the present invention. A perspective view, FIG. 5 is a cross-sectional view taken along the line Y--Y in FIG. 4 of the present invention, and FIG. 6 is a perspective view of the electrolytic capacitor shown in FIGS. 4 and 5 of the present invention, with a part cut out. The figure shows. 1: Exterior composite film, 2, 2-1: Thermocompression sealing part, 3: Internal lead, 4: Lead connection part,
5: External lead, 6: Metsuki lead, 8: Capacitor element.
Claims (1)
ミネートしたプラスチツクフイルムとからなる複
合フイルムでコンデンサ素子を覆うとともに複合
フイルムを熱圧着し前記コンデンサ素子を密着外
装しかつ前記コンデンサ素子から引出したアルミ
内部リードを前記複合フイルムで熱圧着挾持密着
封止しさらに前記アルミ内部引出しリードにハン
ダ付可能な外部リードを溶着し、前記外部リード
を前記複合フイルムの外端部で熱圧着挾持密着封
止し前記アルミ内部リードと半田付可能な外部リ
ードの溶着部を密封したことを特徴とする複合フ
イルム外装電解コンデンサ。1 Cover the capacitor element with a composite film consisting of a metal film and a plastic film laminated on both sides of the metal film, and bond the composite film by thermocompression to tightly sheath the capacitor element, and attach the aluminum internal lead drawn out from the capacitor element to the A composite film is used to clamp and tightly seal the aluminum internal lead, and a solderable external lead is welded to the aluminum internal lead. A composite film exterior electrolytic capacitor characterized by a sealed welded part of the solderable external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57060800A JPS58178517A (en) | 1982-04-12 | 1982-04-12 | Composite film exterior electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57060800A JPS58178517A (en) | 1982-04-12 | 1982-04-12 | Composite film exterior electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58178517A JPS58178517A (en) | 1983-10-19 |
| JPS6233733B2 true JPS6233733B2 (en) | 1987-07-22 |
Family
ID=13152754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57060800A Granted JPS58178517A (en) | 1982-04-12 | 1982-04-12 | Composite film exterior electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58178517A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004304010A (en) | 2003-03-31 | 2004-10-28 | Rubycon Corp | Flat aluminium electrolytic capacitor and its manufacturing method |
| JP2006108184A (en) * | 2004-09-30 | 2006-04-20 | Nippon Chemicon Corp | Electrolytic capacitor |
| JP4710049B2 (en) * | 2006-03-30 | 2011-06-29 | 日本ケミコン株式会社 | Electronic component and manufacturing method thereof |
-
1982
- 1982-04-12 JP JP57060800A patent/JPS58178517A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58178517A (en) | 1983-10-19 |
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