JPS623390Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a continuous surface treatment device suitable for continuously plating wire materials such as strips of aluminum, copper, etc. In addition to cleaning after plating, the purpose is to replenish the water in the plating solution, which usually evaporates at about 80°C, and to keep the concentration of the plating solution constant at all times.

Conventionally, the plating solution reaches a high temperature of about 80°C, which causes a large amount of water to evaporate, and it is necessary to replenish 20 to 30 liters of purified water every 2 to 3 hours, depending on changes in temperature. In this method of periodically replenishing purified water, the concentration of the plating solution changes significantly, being high before replenishment and low after replenishment.
This change in concentration affects the surface condition of the plating and may cause plating defects.

In order to improve the above-mentioned problems, the present invention is aimed at continuously replenishing purified water so as not to cause concentration changes, and at the same time, aims at the effect of washing the material to be plated.

The plating tank 1 in Fig. 1 has a rear wall 2 (wall on the post-process side).
A slit 3 is provided at the plating tank 1, and a receiving tray 4 is integrally formed behind the plating tank 1 (on the right side in the figure). A slit 6 similar to the slit 3 is also formed in the rear wall 5 of the saucer 4, and the slit 3,
A band plate 7 or strip of material to be plated passes through the plate 6 in the direction of arrow A. The strip plate 7 is held so as not to come into contact with the inner peripheral edges of the slits 3 and 6. The plating liquid 8 is contained in the plating tank 1 to a level higher than that of the strip plate 7, and the upper end of the collection pipe 9 is placed at the bottom of the receiving tray 4 so that the plating liquid flowing out from the slit 3 into the receiving tray 4 can be collected and circulated. is opened, the lower end of the pipe 9 is connected to a tank 10, and the tank 10 is communicated with the suction port of the circulation pump 11,
The discharge port of the pump 11 is a circulation pipe 12 (passage)
It is connected to plating tank 1 through.

A pair of rolls 14 is rotatably supported just before the rear wall 5 of the tray 4 (on the left side in FIG. 1), and both rolls 14, 14 are lightly pressed against the strip plate 7. Immediately in front of the roll, one or more nozzles 15 facing the strip 7 are provided, which are connected via pipes 16 to a supply pump 17 for purified water.

During the plating work, after the plated strip 7 of the material to be plated comes out from the plating tank 1, purified water is applied to the strip 7 from a nozzle 15 inside the saucer 4. As a result, the plating liquid adhering to the band plate 7 is washed off, and further squeezed by the rolls 14, 14, and dropped from the band plate 7 into the receiving tray 4 below. Therefore, the roll 14 prevents both the purified water and the plating liquid from being taken out. The distance L ₁ between the roll 14 and the nozzle 15 is suitably within 15 cm, and within this range, the water applied from the nozzle 15 will not dry before reaching the roll 14. The purified water sprayed from the nozzle 15 washes off the plating liquid adhering to the surface of the strip plate 7 and falls into the saucer 4. The fallen water is collected in the tank 10 together with the plating liquid that overflowed from the slit 3, and is further pressurized by the pump 11 and the plating liquid 8 in the plating tank 1 is collected.
It mixes with the whole and compensates for the evaporation of water in the liquid. Since the amount of water applied from the nozzle 15 varies depending on the air temperature, the amount of plating liquid reduced is checked in advance, and the amount is set to match the amount of reduction.

According to the present invention, the material to be plated, such as the strip plate 7, is always washed with clean water. Moreover, the amount of plating liquid that adheres to the surface of the strip plate 7 and is carried out is reduced. In other words, the amount of plating liquid consumed can be saved. Also, from the point of view of replenishment, water is first mixed with the plating solution in the saucer 4, then enters the plating solution tank 10, and from there is sent to the plating tank 1, so local and rapid changes in the plating solution concentration can be avoided. It disappears. When washing with hot water after plating, less plating solution is carried out by the material to be plated, which reduces contamination of hot water in the washing tank. Furthermore, since the hot water is not contaminated, the surface of the material to be plated becomes cleaner.

Conventionally, it is known to wash the material to be plated with water and to replenish the water that has been continuously reduced (the amount of water taken out is reduced due to evaporation). However, as in the present invention, by continuously pouring purified water to be replenished onto the plating material in the plating solution receiving tray 4, the plating material is primarily washed with water and the plating solution is replenished with water, which is new. . The effect is
Temporal changes in the concentration of the plating solution are greatly reduced, and contamination of water during subsequent washing with water or hot water is suppressed. Therefore, the practical effect of improving the surface condition of the material to be plated is expected.

Note that when embodying the present invention, a seal lip may be placed inside the receiving tray 4 of the slit 6 instead of the roll 14.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view of the device according to the invention. 1...Plating tank, 2...Rear wall, 3...Slit, 4...Saucer, 6...Slit (exit), 7
...Strip plate (material to be plated), 12...Pipe (passage), 14...Roll (sealing member), 15...Nozzle.

Claims (1)

[Scope of utility model registration request] A slit 3 through which the material to be plated 7 passes is provided in the plating tank 1 filled with a plating solution of a predetermined concentration, a saucer 4 is placed behind the slit 3, and the concentration of the plating solution is adjusted to a predetermined concentration in the saucer. A purified water nozzle 15 is provided that spouts purified water equivalent to the amount of replenishment water required for maintenance toward the material to be plated, and the mixed liquid of plating leakage in the saucer 4 and purified water is transferred to the plating tank 1.
1. A continuous surface treatment device for a wire material, characterized in that a passage 12 for returning the material to the surface of the wire material is provided.