JPS6234437Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a capacitor assembly having a large number of capacitor elements in a divisible manner.

For example, when it is necessary to adjust the capacitance of a capacitor after circuit mounting, such as in a crystal oscillator circuit for a wristwatch, trimmer-type ceramic capacitors have traditionally been used to perform variable capacitance adjustment. However, since trimmer-type ceramic capacitors have mechanically moving parts, the capacitance value tends to change due to vibrations after capacitance adjustment, resulting in a lack of reliability, high cost, large size, and equipment Due to drawbacks such as not being able to meet the demands for cost reduction and high-density packaging, recently, in place of the trimmer type ceramic capacitor, a structure in which the capacitance is adjusted to a predetermined value by trimming the exposed electrode has been developed. A magnetic capacitor has been proposed.

FIGS. 1 and 2 show partially cutaway perspective views of an example of such a ceramic capacitor. First, the ceramic capacitor shown in FIG. 1 is provided with an electrode 3 on the surface of a ceramic dielectric substrate 1 made of barium titanate, titanium oxide, etc., which pairs with an internal electrode 2 to form a capacitance adjustment electrode. By reducing the electrode area by sandblasting, diamond cutting, or laser beam,
This is to adjust the capacity. Porcelain dielectric substrate 1
is composed of a ceramic dielectric layer 101 serving as a capacitive layer with a thickness of about 50 to 100 μm and a reinforcing layer 102.
The reinforcing layer 102 is made of porcelain of the same quality as the porcelain dielectric layer 101, and is fired and sintered at the same time as the porcelain dielectric layer 101. 4,
Reference numeral 5 denotes extraction electrodes formed on two opposing sides, which are electrically connected to the internal electrode 2 and the electrode 3, respectively.

Next, the ceramic capacitor shown in FIG. 2 has a structure in which the electrode 3 is composed of a coarse capacitance adjustment part 3a and a fine capacitance adjustment part 3b, and the capacitance can be adjusted easily and with high precision. be.

The above-mentioned ceramic capacitor works as a fixed capacitor after the capacitance is adjusted by trimming the electrode 3, so it has very high reliability. Moreover, since the external shape is unified, small, and thin, it can fully satisfy the demands for automatic assembly and high-density packaging when mounted on a circuit.

However, if the finished size is, for example, 3×
Because it is very small and thin, about 5 mm, and therefore difficult to handle, because it is very thin, about 50 to 100 μm, and because the ceramic dielectric layer 101 is very thin and has low mechanical strength, it is necessary to form a laminated structure with a reinforcing layer 102 made of the same quality of ceramic as the ceramic layer 101, and further because it is necessary to form the internal electrode 2 and the serpentine electrode 3 within a narrow area of about 3 × 5 mm, etc., manufacturing, characteristic measurement work, and trimming work for capacitance adjustment are not easy.

Therefore, the present invention is easy to perform characteristic measurement work and trimming work, is suitable for high-density packaging, and has the following features:
To provide a capacitor assembly from which individual capacitors can be easily taken out, easy to handle, and convenient for storage.

In order to achieve the above object, a capacitor assembly according to the present invention is a flat capacitor assembly in which a plurality of capacitor elements are sequentially arranged in the length direction of a ceramic dielectric substrate, and each of the capacitor elements has the following features: The ceramic dielectric substrate has at least one pair of electrodes facing each other with a ceramic dielectric layer interposed therebetween in the thickness direction thereof, and has a pair of lead-out electrodes electrically connected to each of the pair of electrodes at both ends in the width direction. , in the adjacent capacitor elements, the lead-out electrodes are separated from each other by a cutout formed at both edges in the width direction of the ceramic dielectric substrate, and at least one surface of the ceramic dielectric substrate in the thickness direction It is characterized in that they are separated from each other by grooves formed on the top so as to bridge the gaps.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically explained in detail below with reference to the accompanying drawings, which are examples. Fig. 3 is a plan view of a capacitor assembly according to the present invention, and Fig. 4 is a _plan view of a capacitor assembly according to the present invention.
D ₁ cross-sectional view, Figure 5 is Figure 3 D ₂ - _{D 2}
It is a sectional view on the line. As shown in the figure, the capacitor assembly according to the present invention includes a plurality of capacitor elements Q ₁ to _{Q 8} in the length direction of a ceramic dielectric substrate 1.
It has a flat plate shape with sequentially arranged. Each of the capacitor elements Q ₁ to _{Q 8} includes a pair of electrodes 2 and 3 facing each other in the thickness direction of the ceramic dielectric substrate 1 with the ceramic dielectric layer 101 interposed therebetween, and electrodes 2 and 3 at both ends in the width direction. It has a pair of lead-out electrodes 4 and 5 that are electrically connected to each other. Of the pair of electrodes 2 and 3, electrode 3 is a trimmable capacitance adjustment electrode formed on the surface of the ceramic dielectric substrate 1.

Adjacent capacitor elements (Q ₁ and Q ₂ ), (Q ₂ and
Q ₃ ),……(Q ₇ and Q ₈ ) are the ceramic dielectric substrate 1
Missing portions 103,1 formed at both ends in the width direction of
04, the extraction electrodes 4-4 and 5-5 are separated from each other. Furthermore, on at least one surface of the ceramic dielectric substrate 1 in the thickness direction, a missing portion 103-1 is formed.
04 are separated from each other by a groove S formed to bridge between them.

As mentioned above, since the capacitor assembly according to the present invention has a plurality of capacitor elements Q ₁ to _{Q 8} arranged in sequence in the length direction of the ceramic dielectric substrate 1, the shape is smaller than that of a single capacitor element. grow bigger,
Convenient to handle and store.

Also, adjacent capacitor elements (Q ₁ and Q ₂ ) (Q ₂
and Q ₃ ), ...... (Q ₇ and Q ₈ ) are the missing portions 103 formed at both ends of the ceramic dielectric substrate 1 in the width direction,
Since the extraction electrodes 4-4 and 5-5 are separated from each other by 104, the capacitor elements Q ₁ to
Although Q ₈ share the ceramic dielectric substrate 1, they are electrically independent from each other. Therefore, it becomes possible to measure the capacitance characteristics of each of the capacitor elements Q ₁ to _{Q 8} independently from each other in the state of the capacitor assembly, making the characteristic measurement work easy. The trimming work of each electrode 3 of the capacitor elements Q ₁ to _{Q 8} can also be efficiently performed in this state of the capacitor assembly.

Furthermore, when configuring a circuit that requires a plurality of capacitor elements, the capacitor elements can be mounted on a circuit board in the form of a capacitor assembly to improve the mounting density.

Further, since a groove S is formed on at least one surface of the ceramic dielectric substrate 1 in the thickness direction so as to bridge the missing portions 103 and 104, the capacitor elements Q ₁ to _{Q 8} are placed in the groove S. By folding along and dividing, capacitor elements Q ₁ to Q ₈ can be taken out as individual pieces. Further, when mounting on a circuit board, it is possible to improve the circuit mounting density by dividing the capacitor at the groove S so as to form a capacitor assembly having the number of capacitor elements required for the circuit.

FIG. 6 is a partially cutaway plan view of another capacitor assembly used to obtain a capacitor assembly according to the present invention, FIG. 7 is a partially enlarged view, and FIG.
A cross-sectional view taken along the line _D3 - _D3 is shown. In the figure, 102 is a ceramic dielectric layer serving as a reinforcing layer;
01 is a ceramic dielectric layer which becomes a substantial capacitive layer. The porcelain dielectric layers 101 and 102 are both made of barium titanate or titanium oxide based porcelain having a high dielectric constant, and are fired and sintered in a laminated state. On the boundary surface of the ceramic dielectric 102 sintered to the ceramic dielectric layer 101, linear grooves S are carved in a lattice pattern, and the grooves S are defined by the grooves S. An internal electrode 2 having one end edge positioned above the groove S is provided in each region a ₁ to a _o .

Further, on the surface of the ceramic dielectric layer 101, linear grooves S are provided in a grid pattern at positions that coincide with the grooves S formed in the ceramic dielectric layer 102. Electrodes 3 for capacitance adjustment are provided in each of the thus divided regions b ₁ to b _o . Therefore, in each region (a ₁ -a _o ) and (b _{1 -bo} ), there are ceramic capacitor elements Q ₁ - having a structure in which a ceramic dielectric layer 101 is sandwiched between internal electrode 2 and electrode 3. Q _o will be constructed respectively.

On the groove S, conductive patterns 5 and 4, which are wider than the groove S and serve as lead-out electrodes, are formed. The conductive pattern 5 becomes an extraction electrode for the electrode 3,
The conductive pattern 4 serves as a lead-out electrode for the internal electrodes, as will be described later.

Further, at the intersection of the vertical groove S and the horizontal groove S, a through hole g ₁ is provided which penetrates the ceramic dielectrics 101 and 102 in the thickness direction. Through hole g ₁
are formed wider than the conductive patterns 4 and 5, as shown in FIG.

The porcelain dielectric layers 101 and 102 are fired and sintered to increase their hardness, and the grooves S have a lower mechanical strength than other areas, so they are more likely to break along the grooves S. There is. However, if the vertical groove S and the horizontal groove S are continuous even at the intersection, for example, even if you try to break it along the vertical groove S, it will also break against the horizontal groove S. Since bending force is applied, there are concerns that the force will be dispersed, making it difficult to fold, and that the cutting position will deviate from the groove S and dig into the area of other capacitor elements. However, if the through hole _g1 as described above is provided, the vertical groove S and the horizontal groove S will become discontinuous, and the connection between the capacitor elements at the intersection will be severed. It becomes possible to fold and divide almost exactly along S.

Note that the through hole g ₁ may be closed during the process of forming the conductive patterns 5 and 4. Furthermore, a groove S matching the groove S is provided on the lower surface of the ceramic dielectric 102, and conductive patterns 5 and 4 are formed thereon. In the above description, the porcelain dielectrics 101, 102
Although it is explained as if there is a boundary between them, since the porcelain dielectrics 101 and 102 are made of the same porcelain material by firing and sintering, there is no clear boundary, but an imaginary boundary. It is.

To remove the capacitor assembly according to the present invention shown in FIGS. 3 to 5 from the above-mentioned capacitor assembly, force is applied to both sides of the vertical groove S, as shown in FIG. 9a. Fold it as shown in Figure 9b.
It is sufficient to divide each column. Thereafter, as shown in FIG. 9c, by folding and dividing along the horizontal grooves S, the capacitor elements Q ₁ to Q _o separated by the horizontal grooves S are made into single pieces. It can be extracted as FIG. 10 is an enlarged perspective view of the capacitor taken out as described above.

In this case, since the porcelain dielectrics 101 and 102 are hard sintered materials, the groove S is mechanically weak, and there is a through hole _g1 , it is easy to move along the groove S. And it can be divided accurately.

Moreover, it is convenient to use because it can be assembled into a circuit board or the like immediately after being divided by simply adding a lead-out electrode.

Furthermore, since the capacitor element is larger in size than a single capacitor element, there is no risk of losing it, and it is easy to handle and store.

11a to 11f are manufacturing process diagrams of the capacitor assembly shown in FIG. 9.

First, as shown in FIG. 11a, a rectangular porcelain dielectric sheet 102 is made from a porcelain dielectric sheet before firing by punching or the like. This ceramic dielectric sheet 102 serves as a reinforcing layer, and is preferably formed relatively thick. As for the material, as mentioned above, it is desirable to use barium titanate or titanium oxide based porcelain.

Next, as shown in FIG. 11b, linear grooves S are provided in a grid pattern on the surface of the porcelain dielectric sheet 102, and at the same time, at the intersection of the vertical grooves S and the horizontal grooves, A rectangular through hole _g1 is provided so that the edge angle is reduced. The groove S and the through hole _g1 can be formed at the same time using a mold or the like. Further, at least one of the grooves S, for example, a vertical groove S, is provided so as to reach two opposing sides of the porcelain dielectric sheet 102, so that it can be easily divided along the groove S after sintering. Note that it is desirable that the grooves S be provided at the same position on the front and back sides of the ceramic dielectric sheet 102.

Next, as shown in FIG. 11c, the vertical groove S
and each area a ₁ ~ divided by the horizontal groove S
A conductive pattern 2, which will become an internal electrode, is printed and coated within _ao . Since the conductive pattern 2 needs to be electrically connected to the extraction electrode later, it is printed and coated so that one edge thereof is located on the vertical groove S. The conductive pattern 2 is formed by printing and applying a paste of a high melting point metal that can withstand the firing temperature, such as a noble metal paste such as platinum, palladium, or silver-palladium alloy.

Next, as shown in FIGS. 11c to 11d, a ceramic dielectric sheet 101 that acts as a substantial capacitor is laminated on the surface of the ceramic dielectric sheet 102, and A groove S that matches the groove S of the ceramic dielectric sheet 102 and a through hole g ₁ that matches the through hole g ₁ are cut in the porcelain dielectric sheet 102 . The porcelain dielectric sheet 101 is made of barium titanate or titanium oxide based porcelain, and is formed as an extremely thin flexible sheet with a thickness of about 50 to 100 μm, and when bonded onto the porcelain dielectric sheet 102. , the groove S on it can be seen through. Therefore, the groove S and the through hole _g1 of the ceramic dielectric sheet 101 are
Concave groove S and through hole g ₁ of ceramic dielectric sheet 102
It is easy to set it up according to the requirements.

Next, as shown in FIG. 11e, the laminate of the porcelain dielectric sheet 102 and the porcelain dielectric sheet 101 is fired and sintered by ordinary firing means. Then, the ceramic dielectric sheet 102 and the ceramic dielectric sheet 101 are sintered together to form a hard ceramic dielectric substrate in which the conductive patterns 2 serving as internal electrodes are embedded. Note that by sintering, the porcelain dielectric sheet 102,
101 has changed color to dark brown, but the groove S remains almost in its original shape, and the groove S can be visually confirmed.

After the firing process, as shown in Figure 11f,
Regions (b ₁ to b
_o ) The electrode 3 and the conductive patterns 5, 4 are printed and coated inside the groove S and on the groove S by screen printing or the like.

In addition, there is a concave groove S on the lower surface of the ceramic dielectric sheet 102.
Conductive patterns 5 and 4 are printed and applied along the lines. Through the above steps, a capacitor assembly having the form shown in FIG. 6 is obtained. Furthermore, a glass layer is printed and coated on the conductive patterns 5 and 4 appearing on the surface, and is fixed by baking. After fixing and forming a glass protective film, a finished product is obtained.

In addition, in the example, the porcelain dielectric sheet 1
02 and 101 have been separately provided with grooves S and through holes _g1 , but since the combined thickness of the porcelain dielectric sheets 102 and 101 is very thin, the porcelain dielectric sheets 102 and 101 are It is also possible to omit the groove S and provide a structure in which the groove S is provided only in the ceramic dielectric sheet 101. Further, the through holes g ₁ may be formed in the ceramic dielectric sheets 101 and 102 at the same time. Furthermore, an assembly of laminated ceramic capacitors having multiple layers of internal electrodes can be easily realized.

As explained in detail above, the capacitor assembly according to the present invention is a flat capacitor assembly in which a plurality of capacitor elements are sequentially arranged in the length direction of a ceramic dielectric substrate, and each of the capacitor elements is made of the ceramic dielectric substrate. The dielectric substrate is provided with at least a pair of electrodes facing each other with a ceramic dielectric layer interposed therebetween in the thickness direction of the dielectric substrate, and a pair of lead-out electrodes that are electrically connected to each of the pair of electrodes at both ends in the width direction. In the capacitor element, the lead-out electrodes are separated from each other by a cutout formed at both ends of the ceramic dielectric substrate in the width direction, and the extraction electrodes are separated from each other by a cutout formed on both edges in the width direction of the ceramic dielectric substrate, and Since the missing portions are separated from each other by the grooves formed so as to bridge them, the following effects can be obtained.

(b) Since multiple capacitor elements are arranged sequentially in the length direction of the ceramic dielectric substrate, the shape is larger than that of a single capacitor element, making it easier to handle and handle.
A capacitor assembly that is convenient to store is obtained.

(b) Adjacent capacitor elements have lead-out electrodes separated from each other by cutouts formed at both ends of the ceramic dielectric substrate in the width direction.
Although the capacitor elements share the ceramic dielectric substrate 1, they are electrically independent from each other. Therefore, the capacitance characteristics of each of the capacitor elements can be measured independently of each other in the state of the capacitor aggregate, and the characteristic measurement work is facilitated.

(c) The electrode trimming work of each capacitor element can be efficiently performed in this capacitor assembly state.

(d) When configuring a circuit that requires a plurality of capacitor elements, the capacitors can be mounted on a circuit board in the form of a capacitor assembly to improve the mounting density.

(e) Since grooves are formed on at least one surface of the ceramic dielectric substrate in the thickness direction so as to bridge the missing parts, the capacitor element can be folded along the grooves and divided into pieces. The element can be taken out as a single unit.

(F) When mounting on a circuit board, divide the capacitors at arbitrary grooves so that the capacitor assembly has the number of capacitor elements required for the circuit.
Circuit packaging density can be improved.

[Brief explanation of the drawing]

1 and 2 are perspective views of a trimmable ceramic capacitor, FIG. 3 is a plan view of a capacitor assembly according to the present invention, and FIG. 4 is a perspective view of _FIG .
Cross-sectional view on line _D1 , Fig. 5 is Fig. ₃ D2- _D2
FIG. 6 is a partially broken plan view of another capacitor assembly used to obtain the capacitor assembly of the present invention, FIG. 7 is a partially enlarged view of the same, FIG. 8 is a cross-sectional view taken along the line _D3 - _D3 of FIG. 7, FIG. 9a and FIG. 9c are diagrams for explaining how to handle the same, FIG. 10 is an enlarged perspective view of a divided capacitor unit, and FIG. 11a to FIG. 11f are diagrams showing the manufacturing process. 1: Porcelain dielectric substrate, 2, 3: Electrodes, 4,
5: Extraction electrode; 103, 104: Missing portion;
S...groove, _Q1 to _Q8 ...capacitor elements.

Claims (1)

[Claims for Utility Model Registration] (1) A flat capacitor assembly in which a plurality of capacitor elements are sequentially arranged in the length direction of a porcelain dielectric substrate, each of the capacitor elements being connected to the porcelain dielectric substrate. at least one pair of electrodes facing each other in the thickness direction with a ceramic dielectric layer interposed therebetween, and a pair of lead-out electrodes electrically connected to each of the pair of electrodes at both ends in the width direction, and adjacent capacitor elements The extraction electrodes are separated from each other by a cutout formed on both edges in the width direction of the ceramic dielectric substrate, and the cutout is formed on at least one surface of the ceramic dielectric substrate in the thickness direction. A capacitor assembly characterized in that the capacitor assembly is separated from each other by grooves formed to bridge the gaps. (2) The capacitor assembly according to claim 1, wherein one of the pair of electrodes is a capacitance adjustment electrode provided on the surface of the ceramic dielectric substrate.