JPS6235217Y2 - - Google Patents
Info
- Publication number
- JPS6235217Y2 JPS6235217Y2 JP13673780U JP13673780U JPS6235217Y2 JP S6235217 Y2 JPS6235217 Y2 JP S6235217Y2 JP 13673780 U JP13673780 U JP 13673780U JP 13673780 U JP13673780 U JP 13673780U JP S6235217 Y2 JPS6235217 Y2 JP S6235217Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- insulating substrate
- contact pattern
- pattern
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 26
- 238000000926 separation method Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
Landscapes
- Contacts (AREA)
Description
【考案の詳細な説明】
本考案はスイツチに関し、各種回転検出器、デ
ジタルコード発生用スイツチ等に好適な小型のス
イツチを提供することを目的とする。[Detailed Description of the Invention] The present invention relates to a switch, and an object of the present invention is to provide a small-sized switch suitable for various rotation detectors, digital code generation switches, etc.
最近、この種スイツチは小型化が要求される反
面、絶縁基板又はこれと摺接する接触子の可動範
囲内で出来るだけ多くの信号を発生することが要
求される。 Recently, this type of switch has been required to be miniaturized, and at the same time, it is also required to generate as many signals as possible within the movable range of the insulating substrate or the contacts that are in sliding contact with the insulating substrate.
例えば、従来の回転検出用のスイツチにおいて
は、第1、2図のように小径の円板形の絶縁基板
30の一面上に、コモン接点パターン31並びに
これから放射状に外方に延びた複数の接点パター
ン32……を印刷等によつて形成すると共に、両
接点パターン31,32とそれぞれ弾接する接触
子33,34を設け、絶縁基板30の回動に伴つ
て、接触子34からタイミングパルスを取出すよ
うになつている。ところが、前述したように絶縁
基板30の小径化が要求される(例えば直径10mm
前後)、且つ、絶縁基板30の1回転で多数のタ
イミングパルスを出すことが求められると、等間
隔に形成された前記接点パターン32……の間隔
が極めて小さくなり、接触子34が隣接接点パタ
ーン32,32に同時に接触するという危険性が
高まる。従つて、隣接接点パターン32,32の
接続を防止するため精度の高いパターン形成が要
求されると共に、接触子34の接点部34a形成
にも精緻な加工が要求され、製造の歩留りが悪い
上、高速回転によつて発生する微細な導電体紛3
5が、まれに第1図示のように接点パターン3
2,32に存在すると、該隣接接点パターン3
2,32間が接続され、誤信号を発生するという
事態も招来した。このため、絶縁基板30上に形
成される接点パターン32……の数は自ずと限定
を受けるものであつた。 For example, in a conventional rotation detection switch, as shown in FIGS. 1 and 2, a common contact pattern 31 and a plurality of contacts extending radially outward from the common contact pattern 31 are provided on one surface of a small-diameter disk-shaped insulating substrate 30. Patterns 32... are formed by printing or the like, and contacts 33 and 34 are provided that come into elastic contact with both contact patterns 31 and 32, respectively, and timing pulses are taken out from the contacts 34 as the insulating substrate 30 rotates. It's becoming like that. However, as mentioned above, there is a need to reduce the diameter of the insulating substrate 30 (for example, a diameter of 10 mm).
(back and forth), and when it is required to output a large number of timing pulses in one rotation of the insulating substrate 30, the intervals between the contact patterns 32 formed at equal intervals become extremely small, and the contacts 34 are connected to adjacent contact patterns. The risk of coming into contact with 32 and 32 at the same time increases. Therefore, highly accurate pattern formation is required to prevent connection between adjacent contact patterns 32, 32, and precise processing is also required to form the contact portion 34a of the contactor 34, resulting in poor manufacturing yields. Fine conductive powder generated by high-speed rotation 3
5 is rarely the contact pattern 3 as shown in the first diagram.
2, 32, the adjacent contact pattern 3
This also led to a situation where the terminals 2 and 32 were connected, causing an erroneous signal. Therefore, the number of contact patterns 32 formed on the insulating substrate 30 is naturally limited.
本考案は上記の点に鑑み成されたもので、以
下、その詳細を第3図〜第7図示の1実施例によ
つて説明する。 The present invention has been developed in view of the above points, and its details will be explained below with reference to one embodiment shown in FIGS. 3 to 7.
図において、1はアセタール樹脂等の絶縁性合
成樹脂よりなる円板形の絶縁基板で、直径を10mm
〜12mm程度に設定してある。12は良導電性の薄
板金属よりなる金属円板で、その平板部3を絶縁
基板1に埋設されている。 In the figure, 1 is a disc-shaped insulating substrate made of insulating synthetic resin such as acetal resin, with a diameter of 10 mm.
It is set to ~12mm. Reference numeral 12 denotes a metal disc made of a highly conductive thin metal plate, and its flat plate portion 3 is embedded in the insulating substrate 1.
上記金属円板2の表裏にはエンボス加工によつ
て突出・形成した接点パターンが設けてあり(第
3、4図参照)、その表側には、コモン接点パタ
ーン4並びに外周部に等間隔に形成した接点パタ
ーン5……が設けてあると共に、その裏面の外周
部にも等間隔に接点パターン6が設けてある。上
記表裏の接点パターン5……並びに6……は同
数、同一形状に形成され、且つ、互いの間隙を補
填するように交互に形成されていると共に、接点
パターン5と接点パターン6との各間隔も等しく
設定してある。 Contact patterns protruding and formed by embossing are provided on the front and back of the metal disk 2 (see Figures 3 and 4), and on the front side, common contact patterns 4 are formed at equal intervals on the outer periphery. Contact patterns 5 are provided, and contact patterns 6 are also provided at equal intervals on the outer periphery of the back surface. The contact patterns 5 and 6 on the front and back sides are formed in the same number and in the same shape, and are alternately formed so as to compensate for the gaps between each other, and each gap between the contact patterns 5 and 6 is are also set equal.
そして、前記金属円板2は、その表裏の各接点
パターン4,5,6が絶縁基板1の表裏と同一平
面で露呈するように、基板1に埋設され(第6図
参照)、金属円板2の表裏の樹脂は、金属円板2
の中心孔7並びに小孔8(第3図参照)によつて
相互に確実に密着している。なお、該実施例にお
いては、前記金属円板2は、0.4mm厚のリン青銅
板又は洋白板を用いており、接点パターンの高さ
を0.2mm、接点パターンの最小幅を0.2mmに設定し
てあり、必要に応じて接点パターンには貴金属メ
ツキが施こされる。 The metal disk 2 is embedded in the substrate 1 so that the contact patterns 4, 5, and 6 on the front and back surfaces of the metal disk 2 are exposed on the same plane as the front and back surfaces of the insulating substrate 1 (see FIG. 6). The resin on the front and back of 2 is metal disk 2.
The center hole 7 and the small hole 8 (see FIG. 3) ensure that they are in close contact with each other. In this embodiment, the metal disk 2 is made of phosphor bronze plate or nickel silver plate with a thickness of 0.4 mm, the height of the contact pattern is set to 0.2 mm, and the minimum width of the contact pattern is set to 0.2 mm. The contact pattern is plated with precious metal if necessary.
9,10A,10Bは、リン青銅板等の良導電
性金属薄板から形成した弾性ある接触子で、その
接点部には適宜貴金属メツキを施こしてあり、絶
縁基板1の表側に配設した接触子9は前記コモン
接点パターン4と常時接触し、接触子10Aは接
点パターン5……上を摺接する。又、絶縁基板1
の裏面側に配設した接触子10Bは、接点パター
ン6……上を摺接し、該接触子10Aと前記接触
子10Bとは互いに電気的に接続され、絶縁基板
1の回転に伴つて、該対をなす接触子10A,1
0Bの出力端子から出力信号が取出されるように
なつている。 Reference numerals 9, 10A, and 10B are elastic contacts formed from a thin metal plate with good conductivity such as a phosphor bronze plate, and the contact portions thereof are appropriately plated with precious metal. The child 9 is always in contact with the common contact pattern 4, and the contact 10A is in sliding contact with the contact pattern 5. In addition, the insulating substrate 1
The contactor 10B disposed on the back side of the insulating substrate 1 slides on the contact pattern 6, and the contactor 10A and the contactor 10B are electrically connected to each other, and as the insulating substrate 1 rotates, Pair of contacts 10A, 1
The output signal is taken out from the 0B output terminal.
即ち、前記絶縁基板1は、例えば第7図示のよ
うに超小型プリンタの活字輪軸11に固着され、
モータ12駆動で回動する活字輪軸11の回動位
置、換言するなら活字輪軸11と一体回転する活
字輪13の回転位置を検出する。 That is, the insulating substrate 1 is fixed to the type spindle 11 of a micro-compact printer, for example as shown in FIG.
The rotational position of the type wheel shaft 11 rotated by the drive of the motor 12, in other words, the rotational position of the type wheel 13 that rotates integrally with the type wheel shaft 11 is detected.
この場合、前記接点パターン5……と6……と
を加えた数が、活字輪13外周の活字の数と対応
しており、活字輪13の1活字相当分の回動毎
に、前記接触子10Aと接点パターン5、又は、
接触子10Bと接点パターン6とが交互に導通し
て出力信号(タイミングパルス)が導出されるよ
うになつている。 In this case, the sum of the contact patterns 5... and 6... corresponds to the number of printed characters on the outer periphery of the printing wheel 13, and each time the printing wheel 13 rotates for one printed character, the contact pattern child 10A and contact pattern 5, or
The contactor 10B and the contact pattern 6 are alternately brought into conduction to derive an output signal (timing pulse).
上記実施例においては、タイミングパルス発生
用のスイツチを例にとつて説明したが、第8図示
のように所謂エンコーダ用スイツチにも本願考案
は適用可能で、第8図示の構成においては、コモ
ン接点パターン21並びに表裏のドツト状接点パ
ターン22……,23……を多層配線技術で形成
してあり、各放射線上に配設された接点パターン
22……および23……は、絶縁基板1内部で互
いに導通していると共にコモン接点パターン21
とも導通している。従つて、基板20の表裏にお
いて対をなした各接触子24A,24B,25
A,25B,26A,26B,27A,27Bの
各出力端には、接触子28からコモン接点パター
ン21を介して供給された電圧が選択的に導出さ
れ、各出力端の信号の組合せによつて所定の2進
コード信号が取出せる。なお、上述した2つの実
施例は、共に回転形スイツチを例にとつたが、本
願考案が所謂直線摺動形のスイツチにも適用し得
ることは勿論である。 In the above embodiment, a switch for generating timing pulses was explained as an example, but the present invention can also be applied to a so-called encoder switch as shown in FIG. 8. In the configuration shown in FIG. The pattern 21 and the dot-shaped contact patterns 22 . . . , 23 . They are mutually conductive and the common contact pattern 21
It is also connected. Therefore, each contactor 24A, 24B, 25 forming a pair on the front and back sides of the substrate 20
A, 25B, 26A, 26B, 27A, and 27B output terminals are selectively derived from the voltage supplied from the contactor 28 through the common contact pattern 21, and are determined by the combination of the signals at each output terminal. A predetermined binary code signal can be extracted. Although the above-mentioned two embodiments both take a rotary type switch as an example, it goes without saying that the present invention can also be applied to a so-called linear sliding type switch.
叙上のように本願考案によれば、絶縁基板の表
裏に交互に配設した接点パターンを、互いに電気
的に接続した対をなす接触子と接離させる構成の
ため、絶縁基板の各表面上の接点パターン間隔を
大きくすることができ、接触信頼性が高まる。加
えて、基板の表裏を利用しているため、全体とし
て多数の接点パターンを形成しても基板を小型化
することがなく、小型の回転検出用スイツチ、或
いはデジタルコード発生用のスイツチに用いて好
適であるという実用上顕著な効果を奏する。 As described above, according to the present invention, since the contact patterns arranged alternately on the front and back sides of the insulating substrate are connected to and separated from the contact patterns that are electrically connected to each other, the contact patterns are arranged on each surface of the insulating substrate. The contact pattern spacing can be increased, increasing contact reliability. In addition, since the front and back sides of the board are used, there is no need to downsize the board even if a large number of contact patterns are formed as a whole, making it suitable for use in small rotation detection switches or digital code generation switches. It has a remarkable practical effect of being suitable.
第1図及び第2図は従来例に係り、第1図は平
面図、第2図は要部断面図、第3図〜第7図は本
考案の1実施例に係り、第3図は金属円板の平面
図、第4図は第3図のA−A′線に沿つた展開
図、第5図は絶縁基板と接触子とを示す平面図、
第6図は第5図のB−B′線に沿つた展開断面図、
第7図は使用状態を示す説明図、第8図は本考案
の他の実施例を示す説明図である。
1……絶縁基板、2……金属円板、4……コモ
ン接点パターン、5……接点パターン、6……接
点パターン、9,10A,10B……接触子。
1 and 2 are related to a conventional example, FIG. 1 is a plan view, FIG. 2 is a sectional view of a main part, FIGS. 3 to 7 are related to an embodiment of the present invention, and FIG. A plan view of the metal disk, FIG. 4 is a developed view taken along line A-A' in FIG. 3, and FIG. 5 is a plan view showing an insulating substrate and a contact.
Figure 6 is a developed cross-sectional view along line B-B' in Figure 5;
FIG. 7 is an explanatory diagram showing the state of use, and FIG. 8 is an explanatory diagram showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Insulating substrate, 2...Metal disk, 4...Common contact pattern, 5...Contact pattern, 6...Contact pattern, 9, 10A, 10B...Contactor.
Claims (1)
れ、該絶縁基板上に設けられた複数個の接点パタ
ーンと、該接点パターン上に摺接され、該接点パ
ターンと接離を繰り返す接触子とから成り、該接
触子が前記接点パターン上を摺接することによつ
て所定の信号を発生するスイツチにおいて、前記
絶縁基板の表裏に互いに電気的に接続した対をな
す接触子を設け、この対をなす接触子のうち一方
の接触子が摺接する前記絶縁基板の表側の各接点
パターン間に位置するように、前記絶縁基板の裏
面に接点パターンを形成し、この裏面の接点パタ
ーンに前記対をなす接触子のうち他方の接触子を
摺接させるように構成したことを特徴とするスイ
ツチ。 An insulating substrate, a plurality of contact patterns that are electrically connected to each other inside the insulating substrate and provided on the insulating substrate, and a contact that is in sliding contact with the contact pattern and repeats contact and separation with the contact pattern. In a switch that generates a predetermined signal by the contactors sliding on the contact pattern, a pair of contacts electrically connected to each other is provided on the front and back sides of the insulating substrate, and the pair of contactors are electrically connected to each other. A contact pattern is formed on the back surface of the insulating substrate such that one of the contacts is located between each contact pattern on the front side of the insulating substrate to which one of the contacts slides, and the contact pattern on the back surface is connected to the paired contact pattern. A switch characterized in that the other of the contacts is configured to make sliding contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13673780U JPS6235217Y2 (en) | 1980-09-26 | 1980-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13673780U JPS6235217Y2 (en) | 1980-09-26 | 1980-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5760328U JPS5760328U (en) | 1982-04-09 |
| JPS6235217Y2 true JPS6235217Y2 (en) | 1987-09-08 |
Family
ID=29496840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13673780U Expired JPS6235217Y2 (en) | 1980-09-26 | 1980-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6235217Y2 (en) |
-
1980
- 1980-09-26 JP JP13673780U patent/JPS6235217Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5760328U (en) | 1982-04-09 |
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