JPS6235541A - Semiconductor integrated circuit - Google Patents
Semiconductor integrated circuitInfo
- Publication number
- JPS6235541A JPS6235541A JP17480785A JP17480785A JPS6235541A JP S6235541 A JPS6235541 A JP S6235541A JP 17480785 A JP17480785 A JP 17480785A JP 17480785 A JP17480785 A JP 17480785A JP S6235541 A JPS6235541 A JP S6235541A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wirings
- aluminum wiring
- chip
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 24
- 230000001788 irregular Effects 0.000 abstract 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体集積回路（以下、■ａ）のアルミ配線
の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of aluminum wiring for semiconductor integrated circuits (hereinafter referred to as ``a'').
ＩＣウェハー上のチップを、オートプロパーにより、自
動的に検査する場合、チップの正確な位置を知る几めＫ
、チップ間の境界となるスクライブラインを認識する必
要がある。When automatically inspecting chips on an IC wafer using autoproper, there is no way to know the exact location of the chip.
, it is necessary to recognize the scribe lines that form the boundaries between chips.
本発明は、ＩＣのアルミ配線の構造において、ＩＣウェ
ハー上のスクライブラインに対して、平行なアルミ配線
に凹凸をも比すことにより、アルミ配線をスライプライ
ンと誤認識することを防ぎ工０の正確な検査を行なえる
ようにし几ものである。In the structure of the aluminum wiring of an IC, the present invention prevents the aluminum wiring from being mistakenly recognized as a slide line by comparing the unevenness of the aluminum wiring parallel to the scribe line on the IC wafer. It is a method that allows for accurate testing.
従来の工Ｃチップのアルミ線は、ｆ８２図に示スように
、スクライブラインと平行な場合でも、一定の幅をもっ
た直線であっ友。As shown in figure f82, the aluminum wire of the conventional C-chip is a straight line with a constant width even when it is parallel to the scribe line.
〔発明が解決しようとする問題点及び目的〕しかし、前
述の従来技術は、スクライブラインと平行に走るアルミ
配線をいずれか一定幅である為に、スクライブラインと
誤認識してしまうおそれ６”−ある。[Problems and objects to be solved by the invention] However, in the above-mentioned conventional technology, since the aluminum wiring running parallel to the scribe line has a certain width, there is a risk that it may be mistakenly recognized as a scribe line. be.
そのなめ、ＩＣチップの正しい位置が、認識されず、工
Ｏの検査において、良品を不良品と判定することがある
。Therefore, the correct position of the IC chip may not be recognized, and a good product may be determined to be a defective product during a factory inspection.
そこで、本発明は、このような問題点を解決するもので
あり、その目的とするところは、工Ｃの誤っ九検査が、
行なわれることを防ぐアルミ配線を提供するところにあ
る。Therefore, the present invention is intended to solve such problems, and its purpose is to solve the problem that engineering C's error nine inspection
The purpose is to provide aluminum wiring that prevents damage from occurring.
本発明の半導体集積回路は、ウェハー上のスクライブラ
インと平行に走るアルミ配線に凹凸をつけたことを特徴
とする。The semiconductor integrated circuit of the present invention is characterized in that the aluminum wiring running parallel to the scribe line on the wafer has irregularities.
工Ｃの検査を行なう定めには、ウェハー上の１つのチッ
プの正確な位置を検出する必要がある。The requirements for testing process C require detecting the exact location of a single chip on a wafer.
１枚のウェハー上のチップとチップの間は、スクライブ
ラインといわれる一定の幅をもった直線によって区切ら
れている。Chips on a single wafer are separated by straight lines with a constant width called scribe lines.
そこで、この°スクライブラインを知ることによってウ
ェハー上のチップの正確な位置がわかる。Therefore, by knowing this scribe line, the exact location of the chip on the wafer can be determined.
一般に、機械によって、自動的にスクライブラインを検
出する場合、レーザー光線をウェハー表面に放ち、その
反射光によって、ウェハー上の段差が認識できる。Generally, when a scribe line is automatically detected by a machine, a laser beam is emitted onto the wafer surface, and a step difference on the wafer can be recognized by the reflected light.
第１図は１本発明の実施例における工Ｃウェハーの平面
図であって、１．２はアルミ線で、３けスクライブライ
ンである。FIG. 1 is a plan view of a processed C wafer in an embodiment of the present invention, in which reference numerals 1 and 2 are aluminum wires and three scribe lines.
この構造によれば、アルミ配線のもつ抵抗値や浮遊容量
は、アルミ配線の幅に依存するため、アルミ配線の幅の
大小により異なるｈ″−１総合的に従来と同等の特性で
ある。According to this structure, since the resistance value and stray capacitance of the aluminum wiring depend on the width of the aluminum wiring, h''-1, which varies depending on the width of the aluminum wiring, has overall characteristics equivalent to those of the conventional one.
しかも、アルミ配線のもつ凹凸により、スクライブライ
ンと誤認識されることがなく、ウェノ・−上のチ９プの
正しい位置をｇ識することができる。Moreover, the unevenness of the aluminum wiring prevents it from being mistakenly recognized as a scribe line, and the correct position of the chip on the wire can be determined.
尚、本実施例は、スクライブラインに平行に２本のアル
ミ配線／ｌ”−存在し、その形状は相互に凹凸をもつも
のであるが、アルミ配線の本数は、何本でもよく、その
形状は一定の幅をもっていなければどんな形状でもよい
。In this example, there are two aluminum wires/l"- in parallel to the scribe line, and the shape is uneven. However, the number of aluminum wires may be any number, and the shape can be of any shape as long as it does not have a certain width.
又、本発明の場合、スクライブラインの形状は変えず、
アルミ配線の形状を変え之ｂ；、逆にアルミ配線の形状
を変えずに、スクライブラインの形状を変え、機械の側
の判定条件をそのスクライブラインにあわせることによ
って、チップの正確な位置を知ることもできる。In addition, in the case of the present invention, the shape of the scribe line is not changed;
By changing the shape of the aluminum wiring, and conversely, changing the shape of the scribe line without changing the shape of the aluminum wiring and adjusting the judgment conditions on the machine to the scribe line, the exact position of the chip can be determined. You can also do that.
本発明は、以上述べ之ように、単にアルミ配線の構造を
かえることにより、ウェハー上のＩＣチップのゆ査を正
確に行えるという効果を有する。As described above, the present invention has the effect that IC chips on a wafer can be precisely scanned simply by changing the structure of the aluminum wiring.
Ｉ！１図は、本発明の実施例としてのアルミ配線の平面
図。
第２図社）は、ウェハ一平面図、第２図（ｂ）は、従来
のアルミ配線の平面図。
１、２．５．６ ・・・・・・アルミ配線３・・・・
・・スクライブライン
４・・・・・・ウェハー
以 上I! FIG. 1 is a plan view of aluminum wiring as an example of the present invention. Fig. 2(b) is a plan view of a wafer, and Fig. 2(b) is a plan view of a conventional aluminum wiring. 1, 2.5.6 ... Aluminum wiring 3 ...
・・・Scribe line 4・・・Wafer or more
Claims (1)
に走るアルミ配線に凹凸をつけたことを特徴とした半導
体集積回路。A semiconductor integrated circuit is characterized by uneven aluminum wiring that runs parallel to the scribe lines on the semiconductor integrated circuit wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17480785A JPS6235541A (en) | 1985-08-08 | 1985-08-08 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17480785A JPS6235541A (en) | 1985-08-08 | 1985-08-08 | Semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6235541A true JPS6235541A (en) | 1987-02-16 |
Family
ID=15985005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17480785A Pending JPS6235541A (en) | 1985-08-08 | 1985-08-08 | Semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6235541A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396471A (en) * | 1989-09-06 | 1991-04-22 | Daifuku Co Ltd | Electric car for carriage |
| KR100892338B1 (en) | 2007-10-31 | 2009-04-08 | 주식회사 하이닉스반도체 | Semiconductor device |
-
1985
- 1985-08-08 JP JP17480785A patent/JPS6235541A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396471A (en) * | 1989-09-06 | 1991-04-22 | Daifuku Co Ltd | Electric car for carriage |
| KR100892338B1 (en) | 2007-10-31 | 2009-04-08 | 주식회사 하이닉스반도체 | Semiconductor device |
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