JPS6235570Y2 - - Google Patents

Description

[Detailed description of the invention] This invention is very effective when removing solder using a desoldering device, etc., which has a hollow soldering iron tip placed at the end of a suction path that generates negative pressure using a pump, etc. This is about a soldering iron chip.

Conventionally, this type of soldering iron chip has a first
A cylindrical type as shown in Fig. 2 is used.

In the figure, 1 is a printed board, 2 is a lead wire,
3 is a through hole, and 4 is a cylindrical soldering iron chip. In addition, 1a is the component mounting surface of the printed board, 4a is the hole of the cylindrical soldering iron chip, and 5
is solder.

In the device shown in Fig. 1, a heated cylindrical soldering iron chip 4 is applied to the through hole 3 to melt the solder, and then a pump or the like is used to apply air pressure on the side of the cylindrical soldering iron chip hole 4a to the printed board component mounting surface. The solder is removed from the through-hole 3 by making the lead wire 2 lower than the side 1a, but as shown in the figure, if the lead wire 2 is pressed against the inner wall of the through-hole 3 due to spring properties, etc. Since the solder 5 remains, the solder cannot be sufficiently removed from the through hole 3, resulting in disadvantages such as difficulty in removing the lead wire 2.

Furthermore, as shown in FIG. 2, when the lead wire 2 is corrected to the center of the through hole 3 using the soldering iron chip 4, the soldering iron chip 4 covers a part of the through hole 3, so the solder 5 must be removed. It was difficult.

Furthermore, if the solder was not removed sufficiently, heating and desoldering would have to be repeated, which could potentially damage the through-holes 3.

The present invention solves these drawbacks and provides a soldering iron chip that removes solder with high efficiency and safety.

This invention adds a structure/mechanism to the hollow soldering iron chip to straighten the lead wires of the components, thereby concentrically arranging the hollow soldering iron chips, the lead wires of the components, and the component mounting holes. To provide a soldering iron chip that removes solder uniformly and efficiently.

Next, specific embodiments of the present invention will be described with reference to the drawings. FIG. 3 is a partial sectional view showing a specific embodiment of the present invention, which is composed of a cylindrical soldering iron chip 4 and a heat-resistant plate, for example, a metal plate 6. The metal plate 6 is fixed to the inner surface of the soldering iron chip 4 by means such as welding so as to form a projection of an arbitrary size.

FIG. 4 is a sectional view illustrating a state in which solder is removed according to the specific embodiment of the present invention shown in FIG. 3, in which 1 is a printed board, 2 and 2' are lead wires,
A metal plate 6 is fixed with a through hole 3 and cylindrical solder iron chips 4 and 4'. Also, 1
4a is a cylindrical solder tip hole. The cylindrical soldering iron chip 4 is connected to a suction path by a heating device, a pump, etc. (Not shown) As shown in FIG. 4, the metal plate 6 connects the cylindrical soldering iron chip 4' to the lead wire 2' which is pressed against the inner wall of the through-hole 3 due to its spring property. Apply it to the position where it touches. After the solder is melted by the heated cylindrical soldering iron chip 4', the lead wire 2' is corrected to the position 2 by horizontally moving the cylindrical soldering iron chip 4' to position 4. , the solder in the through hole 3 can be easily removed. Furthermore, when the cylindrical soldering iron tip 4 is removed from the through hole 3 after removing the solder, the leads 2 return to the position 2' due to their spring properties, but since enough solder has been removed, the lead wires can be easily removed. It can be installed from through hole 3.

As explained above, the present invention has a structure and structure for straightening component lead wires in a hollow soldering iron chip.
By adding a mechanism, even when the lead wire is pressed against the inner wall of the component mounting hole due to spring properties, the hollow soldering iron chip, the component lead wire, and the component mounting hole can be arranged concentrically, uniformly,
Moreover, it has the effect of efficiently removing solder.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views showing a conventional method of removing solder using a soldering iron chip, FIG. 3 is a partial cross-sectional view of a specific embodiment of the present invention, and FIG. 4 is a cross-sectional view of the present invention shown in FIG. 3. FIG. 3 is a cross-sectional view showing a state in which solder is removed according to a specific embodiment of the present invention. In addition, in the figure, 1...printed board, 2,
2'...Lead wire, 3...Through hole, 4,
4'... Cylindrical soldering iron chip, 5... Solder, 6... Metal plate. Further, 1a... printed board component mounting surface, 4a... cylindrical soldering iron chip hole.

Claims (1)

[Scope of utility model registration request] A soldering iron chip having a hollow portion with an open tip and formed in the axial direction is provided with a heat-resistant member extending from the inner surface of the hollow portion in a direction substantially perpendicular to the axial direction, near the tip. Soldering iron chips.