JPS6235572Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a solder replenishing device for a solder bath that performs soldering by submerging a printed circuit board in a flow of molten solder.

As is well known, the molten solder in the solder bath is not only soldered to the printed circuit board but also removed by oxidation and reduced in size. For this reason, solid solder has been supplied manually or by an automatic solder supply device.

However, when replenishing manually, it takes time and labor costs, and when replenishing with an automatic solder replenishing device, solid solder is stacked high in a hopper and stored, and then slid from a high place onto the surface of the molten solder. Since a slide is provided as an inclined part for soldering, the height of the entire device becomes large and large, and there are disadvantages such as contact with the smoke exhaust hood installed at the top of the soldering device. Ta.

This idea was made in order to eliminate the above-mentioned drawbacks, and when replenishing solid solder, the slide that slides the solid solder and throws it into the molten solder in the solder bath can be moved from a horizontal position to an inclined position. The present invention provides a solder replenishing device formed to have the following properties. This idea will be explained below.

Fig. 1 is a partially cutaway side view showing an embodiment of this invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1,
FIG. 3 is a sectional view taken along line B--B in FIG. 1.
In these figures, reference numeral 1 indicates the entire solder supply device, and reference numeral 2 indicates plate-shaped solid solder, which is stored in a hopper 3 in a stacked manner. Reference numeral 4 designates a replenishment port for the solid solder 2 provided at the lower part of the hopper 3, and 5 designates a first driving device for pushing out the solid solder 2 in the horizontal direction, which is formed by a cylinder 6 and a rod 7. 8 is an extrusion plate provided at the tip of the rod 7; 9
10 is a contact piece, 10 is a first limit switch that is activated by the contact piece 9 of the rod 7 coming into contact with the drive device 5, 11 is an inclined surface on which the solid solder 2 slides and falls, and 12 is the inclined surface 11. The slide is located in a horizontal position to receive the solid solder 2 that slides down and falls, has a long hole 13 at one end, and is pivotally supported by a support shaft 14 in a loosely fitted state. 1
5 is a bearing for the support shaft 14; 16 is a second drive device for driving the slide 12;
7. It is formed by a rod 18. 19 is a pin that rotatably connects the slide 12 and the rod 18; 20 is a second limit switch that comes in contact with the slide 12 when it is in a horizontal position; 21 is a solder bath; 22 is molten solder; 23
is a float above the liquid surface of the molten solder 22,
Reference numeral 24 denotes a float switch which is turned off by lowering the float 23 when the molten solder 22 decreases and the liquid level drops.

Next, the operation will be explained.

When the liquid level of the molten solder 22 decreases, the float 23 descends from the position indicated by the solid line in FIG. 1 to the position indicated by the two-dot chain line, and when the float switch 24 is turned on, the rod 7 of the drive device 5 is pushed out in the direction of arrow C.
At this time, the slide 12 is in a horizontal position and the limit switch 20 is turned on, so the drive device 5 is ready to operate. Then, the extrusion plate 8 pushes the solid solder 2 at the bottom of the hopper 3 onto the inclined surface 11.
push it out. The extruded solid solder 2 falls while sliding on the slope 11 and is received into the slide 12. At this time, the contact piece 9 of the drive device 5 turns on the limit switch 10 and operates the drive device 16, causing the rod 18 to rise. As shown in FIG. 4, the slide 12 rotates around the support shaft 14, so one side, that is, the side opposite to the solder bath 21, rises to an inclined position, and the solid solder 2 in the slide 12 slides. The solder is poured onto the surface of the molten solder 22 in the solder bath 21 . As the solid solder 2 melts and the liquid level of the molten solder 22 rises, the float 23 also rises and returns to the position indicated by the solid line in FIG. 1, turning off the float switch 24.

FIG. 5 is a circuit diagram showing an example of the system of the solder replenishing device of this invention. In this figure, the same reference numerals as in Figs. 1 to 3 indicate the same parts, and 25
is a relay, and has a relay contact 26 that is a b contact and a relay contact 27 that is an a contact. 28 is a timer, which causes the float 23 to rise and fall as the surface of the molten solder 22 swings, turning on the float switch 24.
This is provided to prevent the timer 28 from operating and the timer contact 29, which is the a-contact, from turning on while the off operation is repeated. 30 is a timer, and the timer 30 is activated while the slide 12 is tilted.
This is provided so that the timer contact 31 will not be turned off by operating the timer contact 31. E ₁ and E ₂ are power supply terminals. The limit switch 10, which is always off, is turned on by the operation of the drive device 5, and the limit switch 20, which is always on, is turned off by the operation of the drive device 16.

In this way, the float switch 24 → relay contact 26 → limit switch 20 → timer 28 is connected between terminals E ₁ and E ₂ , and the timer contact 29 → is connected between the connection point of float switch 24 and relay contact 26 and terminal E ₂ . Drive devices 5 are connected in series. Furthermore, a timer contact 31 → limit switch 10 → drive device 16 is connected between the terminals E ₁ and E ₂ , and a connection point between the timer switch 31 and the limit switch 10 and the terminal
Relay contact 27→timer 30 is connected between _E2 . Further, a relay 25 is connected between the connection point between the limit switch 10 and the drive device 16 and the terminal _E2 .
Further, a connection point between the relay contact 27 and the timer 30 and one end of the relay 25 are connected.

Next, the operation will be explained.

First, each contact of the solder supply device 1 is in the state shown in FIG.

When there is a predetermined amount of molten solder 22, the float switch 24 and limit switch 10 are turned off, and the entire solder replenishing device 1 does not operate.

Next, when the molten solder 22 decreases and the liquid level drops, the float 23 descends and the float switch 2
4 starts to turn on. By the way, molten solder 22
At this position, float 2 is floating because the liquid level is oscillating.
3 repeats rising and falling, so the float switch 24 also repeats on and off operations. Therefore, even if the timer 28 is activated by turning on the float switch 24, the float switch 24 is immediately turned off and the timer 28 returns to the starting point, so the timer contact 29 does not turn on, so the drive device 5 does not operate.

Next, even if the liquid level of the molten solder 22 falls further and the float 23 moves up or down due to fluctuations in the liquid level, the operation of the timer 28 continues when the float switch 24 remains in the always-on state. After a predetermined period of time has elapsed, timer contact 29 is turned on. Note that the relay contact 26 is on, and the limit switch 20 is also on because the slide 12 is in the horizontal position.

Next, by turning on the timer contact 29, the drive device 5
operates and pushes out the solid solder 2 onto the slide 1.
Drop to 2. At this point, the contact piece 9 of the drive device 5 turns on the limit switch 10.

Next, when the limit switch 10 is turned on,
The drive device 16, relay 25, and timer 30 operate.

The operation of the relay 25 turns off the relay contact 26 and turns on the relay contact 27.

The operation of the drive device 16 causes the slide 12 to move to the fourth position.
Since the solder is tilted as shown in the figure, the solid solder 2 is thrown into the molten solder 22 in the solder bath 21, and the limit switch 20 is turned off.

Next, the timer 28 returns to the starting point by turning off the relay contact 26 and turning off the limit switch 20, so the timer contact 29 turns off and the drive device 5
performs a return operation, the push-out plate 8 and the contact piece 9 return to their original positions, and the limit switch 10 is turned off. However, while the timer 30 is operating, the timer contact 31 is on, so the relay 25 is working and the relay contact 27 is on. While the timer 30 is operating, the drive device 16 continues to operate to hold the slide 12 in the inclined position.

Next, when the set time of the timer 30 has elapsed, the timer contact 31 is turned off.

Next, when timer contact 31 turns off, relay 2
5 returns, the relay contact 26 is turned on and the relay contact 27 is turned off, and the drive device 16 performs a return operation to return the slide 12 to the horizontal position and turn on the limit switch 20.

Next, the timer contact 31 is turned on to return to the initial state.

This completes the step of replenishing one piece of solid solder 2.

Note that even if one solid solder 2 is replenished, if the molten solder 22 does not reach the specified amount and is insufficient, the above steps are repeated again to replenish more solid solder 2.

As explained above, this idea consists of a float switch that turns the float above the molten solder in the solder bath on and off at a predetermined level, and when the float switch is turned on, it pushes out the solid solder in the hopper. a first driving device that causes the solid solder to drop, a slide that receives the falling solid solder in a horizontal position, a first limit switch that is turned on by the operation of the first driving device, and a first limit switch that is turned on by the operation of the first driving device; a second driving device that lifts the side of the slide opposite to the solder bath from a horizontal position and rotates and tilts it to drop the solid solder into the solder bath; and while the slide is rotating and tilting, the first drive device A second limit switch is provided to turn off the solder so that it does not operate, and the operation of introducing solid solder onto the surface of the molten solder and the operation of returning are all performed automatically. The height of the soldering device is lower and the soldering device is smaller, and it does not come into contact with the smoke exhaust hood of the soldering device, making it easier to install and operate.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway side view showing an embodiment of this invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1,
Fig. 3 is a sectional view taken along line B-B in Fig. 1, Fig. 4 is a sectional view showing the slide in Fig. 3 in an inclined state, and Fig. 5 shows an example of the system of the solder replenishing device of this invention. It is a circuit diagram. In the figure, 1 is a solder supply device, 2 is solid solder,
3 is a hopper, 4 is a supply port, 5 and 16 are drive devices,
6 and 17 are cylinders, 7 and 18 are rods, 8 is an extrusion plate, 9 is a contact piece, 10 and 20 are limit switches, 11 is an inclined surface, 12 is a slide, 13 is a long hole, 14 is a support shaft, and 15 is a bearing , 19 is pin, 2
1 is a solder bath, 22 is molten solder, 23 is a float, 24 is a float switch, 25 is a relay, 2
6 and 27 are relay contacts, 28 and 30 are timers, 2
9 and 31 are timer contacts.

Claims (1)

[Scope of utility model registration request] a float switch that turns on a float above a liquid level of molten solder in a solder bath at a predetermined liquid level; a first drive device that pushes out solid solder in a popper and causes it to fall when the float switch is turned on; a slide that receives the falling solid solder in a horizontal position; a first limit switch that is turned on by the operation of the first driving device;
When the first limit switch is turned on, a second driving device that lifts the side of the slide opposite to the solder bath from a horizontal position and rotates and tilts the solid solder to drop the solid solder into the solder bath, and a second drive device that rotates and tilts the slide. and a second limit switch that turns off the first drive device so as not to operate it while the solder is being soldered.