JPS6236573U - - Google Patents

Info

Publication number
JPS6236573U
JPS6236573U JP1985126563U JP12656385U JPS6236573U JP S6236573 U JPS6236573 U JP S6236573U JP 1985126563 U JP1985126563 U JP 1985126563U JP 12656385 U JP12656385 U JP 12656385U JP S6236573 U JPS6236573 U JP S6236573U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
pair
heat dissipation
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985126563U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985126563U priority Critical patent/JPS6236573U/ja
Publication of JPS6236573U publication Critical patent/JPS6236573U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第１実施例の一部断面図、第
２図は従来例の一部断面図第３図は他の従来例の
一部断面図、第４図は本考案の第２実施例の一部
断面図、第５図は第１実施例と従来例との耐サー
ジ特性を示すグラフである。 ２２，２３……端子、４１，４２……端子、２
４……ダイオード、２７，４３，４４……放熱面
、２９……プリント基板、３０……導体膜。 FIG. 1 is a partial cross-sectional view of the first embodiment of the present invention, FIG. 2 is a partial cross-sectional view of a conventional example, FIG. 3 is a partial cross-sectional view of another conventional example, and FIG. 4 is a partial cross-sectional view of a conventional example. FIG. 5, which is a partial sectional view of the second embodiment, is a graph showing the surge resistance characteristics of the first embodiment and the conventional example. 22, 23... terminal, 41, 42... terminal, 2
4... Diode, 27, 43, 44... Heat radiation surface, 29... Printed circuit board, 30... Conductor film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パターン形成された導体膜を有するプリント基
板と、両端にアノードとカソードとにそれぞれ接
続された一対の端子を有するダイオードとの取付
構造において、前記一対の端子の少なくとも一方
に放熱面を形成し、該放熱面をプリント基板の導
体膜に接触させて固定したことを特徴とするダイ
オードの取付構造。 In the mounting structure of a printed circuit board having a patterned conductor film and a diode having a pair of terminals connected to an anode and a cathode at both ends, a heat dissipation surface is formed on at least one of the pair of terminals, A diode mounting structure characterized by fixing the heat dissipation surface in contact with the conductive film of the printed circuit board.
JP1985126563U 1985-08-21 1985-08-21 Pending JPS6236573U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985126563U JPS6236573U (en) 1985-08-21 1985-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985126563U JPS6236573U (en) 1985-08-21 1985-08-21

Publications (1)

Publication Number Publication Date
JPS6236573U true JPS6236573U (en) 1987-03-04

Family

ID=31020482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985126563U Pending JPS6236573U (en) 1985-08-21 1985-08-21

Country Status (1)

Country Link
JP (1) JPS6236573U (en)

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