JPS6236573U - - Google Patents
Info
- Publication number
- JPS6236573U JPS6236573U JP1985126563U JP12656385U JPS6236573U JP S6236573 U JPS6236573 U JP S6236573U JP 1985126563 U JP1985126563 U JP 1985126563U JP 12656385 U JP12656385 U JP 12656385U JP S6236573 U JPS6236573 U JP S6236573U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pair
- heat dissipation
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/341—Dispositions of die-attach connectors, e.g. layouts
- H10W72/347—Dispositions of multiple die-attach connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の第１実施例の一部断面図、第
２図は従来例の一部断面図第３図は他の従来例の
一部断面図、第４図は本考案の第２実施例の一部
断面図、第５図は第１実施例と従来例との耐サー
ジ特性を示すグラフである。 ２２，２３……端子、４１，４２……端子、２
４……ダイオード、２７，４３，４４……放熱面
、２９……プリント基板、３０……導体膜。
２図は従来例の一部断面図第３図は他の従来例の
一部断面図、第４図は本考案の第２実施例の一部
断面図、第５図は第１実施例と従来例との耐サー
ジ特性を示すグラフである。 ２２，２３……端子、４１，４２……端子、２
４……ダイオード、２７，４３，４４……放熱面
、２９……プリント基板、３０……導体膜。
Claims (1)
- パターン形成された導体膜を有するプリント基
板と、両端にアノードとカソードとにそれぞれ接
続された一対の端子を有するダイオードとの取付
構造において、前記一対の端子の少なくとも一方
に放熱面を形成し、該放熱面をプリント基板の導
体膜に接触させて固定したことを特徴とするダイ
オードの取付構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985126563U JPS6236573U (ja) | 1985-08-21 | 1985-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985126563U JPS6236573U (ja) | 1985-08-21 | 1985-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236573U true JPS6236573U (ja) | 1987-03-04 |
Family
ID=31020482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985126563U Pending JPS6236573U (ja) | 1985-08-21 | 1985-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236573U (ja) |
-
1985
- 1985-08-21 JP JP1985126563U patent/JPS6236573U/ja active Pending