JPS6236892A - laminate board - Google Patents

laminate board

Info

Publication number
JPS6236892A
JPS6236892A JP17632285A JP17632285A JPS6236892A JP S6236892 A JPS6236892 A JP S6236892A JP 17632285 A JP17632285 A JP 17632285A JP 17632285 A JP17632285 A JP 17632285A JP S6236892 A JPS6236892 A JP S6236892A
Authority
JP
Japan
Prior art keywords
laminate
polyester
base material
spinning
aromatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17632285A
Other languages
Japanese (ja)
Inventor
杉本 宏明
早津 一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP17632285A priority Critical patent/JPS6236892A/en
Publication of JPS6236892A publication Critical patent/JPS6236892A/en
Pending legal-status Critical Current

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  • Reinforced Plastic Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はプリント配線基板用の積層板に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a laminate for a printed wiring board.

(従来の技術) 電子機器の発展に伴い、プリント回路板の需要は年毎に
増加し、昨今ではプリント回路板を使用しない電子機器
は皆無といって良い程広く普及している。
(Prior Art) With the development of electronic devices, the demand for printed circuit boards is increasing year by year, and these days, electronic devices that do not use printed circuit boards have become so widespread that it can be said that there are no such devices.

これら電子機器等に使用される積層板(代表的なものと
しては銅張積層板やスクリーン印刷回路積層板)には、
基本的な電気特性、耐熱性、耐薬品性、耐水性等の各特
性が要求され、さらに又、近年の電子機器の高性能化、
より一層の小型化、薄肉化、軽量化に伴い、これらの要
求はますます厳しくなってきている。
The laminates (typically copper-clad laminates and screen printed circuit laminates) used in these electronic devices, etc.
Basic electrical properties, heat resistance, chemical resistance, water resistance, and other properties are required, and in addition, the high performance of electronic devices in recent years,
These requirements are becoming increasingly strict as devices become smaller, thinner, and lighter.

現在、プリント配線基板用の積層板としては、ガラス繊
維から成る布基材にエポキシ樹脂を含浸させ、積層成形
し硬化させて得られるエポキシ−ガラス系積層板と、乾
性油変性フェノール樹脂を紙基材に含浸させ、積層成形
し、硬化させて得られるフェノール−紙糸が用いられて
いる。
Currently, laminates for printed wiring boards include epoxy-glass laminates obtained by impregnating a cloth base material made of glass fiber with epoxy resin, laminating and curing it, and paper-based laminates made of dry oil-modified phenolic resin. Phenol-paper yarn is used, which is obtained by impregnating a material, laminating it, and curing it.

(発明が解決しようとする問題点) エポキシ−ガラス系積層板の大きな問題はガラス繊維の
密度が大きいことであり、軽量化の目的で用いるには限
界がある。他方、フェノール−紙糸は、電気特性、吸水
性に問題がある。最近、軽量化を目的として、アラミド
繊細から形成されろ布基材を用いることも検討されてい
るが吸水性が大きく、このため、電気的特性に問題があ
って、十分に使われていない。
(Problems to be Solved by the Invention) A major problem with epoxy-glass laminates is that the density of glass fibers is high, and there is a limit to their use for the purpose of weight reduction. On the other hand, phenol-paper yarns have problems in electrical properties and water absorption. Recently, for the purpose of weight reduction, the use of a filter cloth base material made of fine aramid material has been considered, but it has high water absorption and therefore has problems with electrical characteristics, so it has not been used satisfactorily.

本発明の目的は、以上述べたような問題を克服し、軽量
で、非吸水性で、電気的特性に優れるプリント配線基板
用の積層板を提供することである。
An object of the present invention is to overcome the above-mentioned problems and provide a laminate for a printed wiring board that is lightweight, non-water-absorbent, and has excellent electrical characteristics.

(問題点を解決するtこめの手段) 本発明は溶融時に異方性を示す芳香族ポリエステルを溶
融紡糸して得られる繊細から形成されろ布基材に、熱硬
化性樹脂を含浸させ、積層成形し硬化させることにより
、得られるプリント配線基板用の積層板に関するもので
ある。
(Comprehensive means for solving the problem) The present invention involves impregnating a thermosetting resin into a filter cloth base material obtained by melt-spinning an aromatic polyester that exhibits anisotropy when melted, and laminating the filter cloth base material with a thermosetting resin. The present invention relates to a laminate for printed wiring boards obtained by molding and curing.

本発明における溶融時に異方性を示すポリエステルとは
、90°直交した2枚の偏光板の間における加熱試料台
上にポリエステル試料粉末を置いて昇温しでいった時に
、流動可能な温度域において、光を透過しうる性質を有
するものを意味している。
In the present invention, polyester that exhibits anisotropy when melted means that when a polyester sample powder is placed on a heated sample stage between two polarizing plates crossed at 90° and heated, in a temperature range where it can flow. It means something that has the property of transmitting light.

このような芳香族ポリエステルとしては、特公昭56−
18016号や同55−20008号等に示される芳香
族ジカルボン酸、芳香族ジ」−ル及び/又は芳香族ヒド
ロキシカルボン酸やこれらの誘導体から成るもので、場
合により、これらと脂環族ジカルボン酸、脂環族ジオー
ル、脂肪族ジオールやこれらの誘導体との共重合体も含
まれる。
As such aromatic polyester,
It consists of aromatic dicarboxylic acids, aromatic diols and/or aromatic hydroxycarboxylic acids shown in Nos. 18016 and 55-20008, and derivatives thereof, and in some cases, these and alicyclic dicarboxylic acids. , alicyclic diols, aliphatic diols, and copolymers with these derivatives.

ここで芳香族ジカルボン酸としてはテレフタル酸、イソ
フタル酸、4 、4’−ジカルボキシジフェニル、2,
6−ジカルボキシナフタレン、1.2−ビス(4−カル
ボキシフェノキシ)エタン等やこれらのアルキル、アリ
ールアルコキシ、ハロゲン基の核置換体があげられる。
Here, the aromatic dicarboxylic acids include terephthalic acid, isophthalic acid, 4,4'-dicarboxydiphenyl, 2,
Examples include 6-dicarboxynaphthalene, 1,2-bis(4-carboxyphenoxy)ethane, etc., and their alkyl, arylalkoxy, and halogen group-substituted products.

芳香族ジオールとしてはヒドロキノン、レゾルシン、4
 、4’−ジヒドロキシジフェニル、4.4′−ジヒド
ロキシベンゾフェノン、4゜4′−ジヒドロキレジフェ
ニルメタン、4 、4’−ジヒドロキシジフェニルエタ
ン、2.2−ビス(4−ヒドロキシフェニル)プロパン
、4.4′−ジヒドロキシジフェニルエーテル、4.4
′−ジヒドロキシジフェニルスルホン、4.4′−ジヒ
ドロキシジフェニルスルフィド、2.6−ジヒドロキシ
ナフタレン、l、5−ジヒドロキシナフタレン等やこれ
らのアルキル、アリール、アルコキシ、ハロゲン基の核
置換体があげられる。
Aromatic diols include hydroquinone, resorcinol, 4
, 4'-dihydroxydiphenyl, 4.4'-dihydroxybenzophenone, 4°4'-dihydroxyldiphenylmethane, 4,4'-dihydroxydiphenylethane, 2.2-bis(4-hydroxyphenyl)propane, 4.4' -dihydroxydiphenyl ether, 4.4
Examples include '-dihydroxydiphenylsulfone, 4,4'-dihydroxydiphenylsulfide, 2,6-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, and their alkyl, aryl, alkoxy, and halogen-substituted products.

芳香族ヒドロキレカルボン酸としてはp−ヒドロキシ安
息香酸、m−ヒドロキシ安息香酸、2−ヒドロキシナフ
タレン−6−カルボン酸、1−ヒドロキシナフタレン−
5−カルボン酸等やこれらのアルキル、アリール、アル
コキシ、ハロゲン基の核置換体があげられる。
Aromatic hydroxybenzoic acids include p-hydroxybenzoic acid, m-hydroxybenzoic acid, 2-hydroxynaphthalene-6-carboxylic acid, and 1-hydroxynaphthalene-6-carboxylic acid.
Examples thereof include 5-carboxylic acid, etc., and nuclear substituted products of these alkyl, aryl, alkoxy, and halogen groups.

脂環族ジカルボン酸としてはtrans −1。The alicyclic dicarboxylic acid is trans-1.

4−ジカルボキシシクロヘキサン、cls−1゜4−ジ
カルボキシシクロヘキサン等やこれらのアルキル、アリ
ール、ハロゲン基の置換体があげられる。
Examples include 4-dicarboxycyclohexane, cls-1°4-dicarboxycyclohexane, and substituted products of these with alkyl, aryl, and halogen groups.

脂環族及び脂肪族ジオールとしてはtrsns−1,4
−ジヒドロキシシクロヘキサン、cls−1,4−ジヒ
ドロキシシクロヘキサン、エチレングリコール、1.4
−ブタンジオール、キシリレンジオール等があげられる
。
As alicyclic and aliphatic diols, trsns-1,4
-dihydroxycyclohexane, cls-1,4-dihydroxycyclohexane, ethylene glycol, 1.4
-butanediol, xylylene diol, etc.

これらの組合せの内で本発明の対象として好ましい芳香
族ポリエステルとしては、例えば(1)p−ヒドロキシ
安息香酸残基40ル7030モル饅と芳香族ジオール残
基15〜30モル係から成るコポリエステル、 (2)テレフタル酸及び/又はイソフタル酸とクロルヒ
ドロキノン、フェニルヒドロキノン、及び/又はヒドロ
キノンから成るコポリエステル、 (3)p−ヒドロキシ安息香酸残基20ル80ボン酸残
基20〜80モル優から成るコポリエステルなどがあげ
られる。
Among these combinations, preferred aromatic polyesters for the present invention include (1) copolyesters consisting of 40 to 7,030 moles of p-hydroxybenzoic acid residues and 15 to 30 moles of aromatic diol residues; (2) A copolyester consisting of terephthalic acid and/or isophthalic acid and chlorohydroquinone, phenylhydroquinone, and/or hydroquinone, (3) Consisting of 20 to 80 moles of p-hydroxybenzoic acid residues and 20 to 80 bonic acid residues. Examples include copolyester.

これらの出発原料を用い、本発明の目的とするポリエス
テルに至るには、そのままであるいは脂肪族もしくは芳
香族モノカルボン酸又はそれらの誘導体、脂肪族アルコ
ールもしくはフェノール類又はそれらの誘導体等による
エステル化により、重縮合反応を行なう。
These starting materials can be used as they are or by esterification with aliphatic or aromatic monocarboxylic acids or derivatives thereof, aliphatic alcohols or phenols or derivatives thereof, etc. , carry out a polycondensation reaction.

重縮合反応としては既知の塊状重合、溶液重合、懸濁重
合法等を採用することができ、150〜360℃で常圧
又は10〜0.1 torrの減圧下に、St)、Tl
、Gθ 化合物等の重合触媒、リン系化合物等の安定剤
、TiO、caco、 、りルク等の充てん剤等を場合
により添加して行なうことができる。
As the polycondensation reaction, known bulk polymerization, solution polymerization, suspension polymerization, etc. can be adopted.
, a polymerization catalyst such as a Gθ compound, a stabilizer such as a phosphorus-based compound, a filler such as TiO, caco, 2, 3, or the like can be optionally added.

得られたポリマーはそのままで、あるいは粉体上で不活
性気体中、又は減圧下に熱処理して紡糸用試料とする。
The obtained polymer is used as it is or as a powder by heat treatment in an inert gas or under reduced pressure to prepare a sample for spinning.

あるいは、一度押出機により造粒して用いることもでき
る。
Alternatively, it can also be used after being granulated once using an extruder.

本発明における溶融紡糸に用いる装置としては既知のス
クリュー型押出機を使うことができる。押出機のシリン
ダ一温度としては先端部(最高温度)が280〜420
℃、特に300〜400℃が好ましい。
A known screw type extruder can be used as an apparatus for melt spinning in the present invention. The cylinder temperature of the extruder is 280 to 420 at the tip (maximum temperature).
℃, especially 300 to 400℃ is preferred.

紡糸した繊維はそのままで、又は油剤を付°aさせ巻取
るなり、引落す。巻取り、又は引落しの速度は10〜1
0,000講/min  であるが、生産性や安定紡糸
からみて100〜2.000m/minが好ましい。得
られる繊細の太さや断面形状は強度や弾性率からすると
、1〜10デニールの太さの糸径が好ましい。得られる
繊維はそのままでも使用できるが、熱処理や延伸やこれ
らの組合せの処理を施してやることにより、さらに高強
度、高弾性化することができる。
The spun fibers are rolled up as they are, or coated with an oil and then rolled up. Winding or drawing speed is 10-1
The speed is preferably 0,000 m/min, but from the viewpoint of productivity and stable spinning, the speed is preferably 100 to 2,000 m/min. From the viewpoint of strength and elastic modulus, it is preferable that the thickness and cross-sectional shape of the obtained fine thread be 1 to 10 deniers. The obtained fibers can be used as they are, but they can be further increased in strength and elasticity by being subjected to heat treatment, stretching, or a combination of these treatments.

本発明で用いる繊維の強度はlfl/d以ヒ、好ましく
は20 y/c1 以上、弾性率は500 y / d
以上、好ましくは700.9/d以上がSMまれる。
The strength of the fiber used in the present invention is lfl/d or more, preferably 20 y/c1 or more, and the elastic modulus is 500 y/d.
Above, preferably 700.9/d or more is SM.

本発明におけろ布基材とは、上で述べた繊細を織ったり
、編んだり、不織布としたりすることにより形成された
布状加工品をいう。
In the present invention, the filter cloth base material refers to a cloth-like processed product formed by weaving, knitting, or making into a nonwoven fabric the above-mentioned delicate fabric.

また厚さをもった2次元布状加工品や3次元構造体も含
まれる。
It also includes thick two-dimensional cloth-like products and three-dimensional structures.

織りの形式は平織、朱子織等、通常の手法を用いること
ができるし、編みの形式もメリヤス編み、素編み等を採
用することができる。
Usual weaving methods such as plain weave and satin weave can be used, and knitting methods such as stockinette knitting and plain knitting can be used.

紡糸直後に風を吹きつけて、切断しながら金網の所で不
織布としたり、短繊維として紙状にして用いることもで
きる。
Immediately after spinning, it can be blown with wind and cut into a non-woven fabric using a wire mesh, or it can be used as short fibers in the form of paper.

得られた布基材に含浸させる熱硬化樹脂として好ましい
ものはエポキシ樹脂、フェノール樹脂、不飽和ポリエス
テル樹脂、ポリイ【ド樹脂、ポリアミドイミド樹脂等で
ある。吸水性がなく、電気的特性の点からは、エポキシ
樹脂が特に好ましい。そして、これらの変性樹脂も用い
ることができる。例えば、ブタジェン変性レゾール樹脂
、ニトリル変性エポキシ樹脂も効果がある。
Preferred thermosetting resins to be impregnated into the obtained cloth base material include epoxy resins, phenol resins, unsaturated polyester resins, polyide resins, and polyamideimide resins. Epoxy resins are particularly preferred from the viewpoint of having no water absorption and electrical properties. These modified resins can also be used. For example, butadiene-modified resol resins and nitrile-modified epoxy resins are also effective.

これらの熱硬化樹脂はモノマー、オリゴマーそのままで
、または溶液、スラリー状で布基材に含浸させることが
できる。あるいはフィルム又はシートを形成し、布基材
をはさみサンドインチ成形して含浸させることもできる
。
These thermosetting resins can be impregnated into the fabric base material as monomers or oligomers as they are, or in the form of a solution or slurry. Alternatively, it is also possible to form a film or sheet and impregnate it by sandwich-molding the fabric substrate.

こうして熱硬化樹脂を含浸させた布基材を熱圧縮成形し
、積層板を作る。
The fabric base material impregnated with thermosetting resin is then thermocompression molded to produce a laminate.

このあと、さらに必要であれば、加熱したり、スクリー
ン印刷で回路を書きこむ。
After this, if further circuitry is necessary, heat it up or write a circuit on it by screen printing.

なお、繊維及び布基材は熱硬化性樹脂の含浸前に、電気
特性を損なわず、熱硬化樹脂との接着性を上げるため表
面処理する事はより好ましい。
In addition, it is more preferable to surface-treat the fibers and cloth base materials before impregnating them with the thermosetting resin in order to improve the adhesiveness with the thermosetting resin without impairing the electrical properties.

(発明の作用および効果) 溶融時に異方性を示す芳香族ポリエステルを溶融紡糸し
て得られる繊維は高強度、高弾性率であり、かかる繊維
から形成されろ布基材を用いたプリント配線基板用積層
板は軽量、高強度で非吸水性および電気的性質に優れる
。
(Operations and Effects of the Invention) Fibers obtained by melt-spinning aromatic polyester that exhibits anisotropy when melted have high strength and high elastic modulus, and a printed wiring board formed from such fibers and using a filter cloth base material. The laminate is lightweight, has high strength, is non-water absorbent, and has excellent electrical properties.

そして本発明の積層板は、軽量化、薄板化、短小化する
電子機器類に広く用いることができる。
The laminate of the present invention can be widely used in electronic devices that are becoming lighter, thinner, and shorter.

(実施例) 以下に本発明の詳細な説明するために参考例、実施例お
よび比較例を示すが、これらはあくまで例示的なもので
あり、これらに限定するものではない。
(Example) Reference examples, examples, and comparative examples are shown below in order to explain the present invention in detail, but these are merely illustrative and are not limited thereto.

なお、例中の繊細の引張り試験はインストロン社万能試
験機Nn、1130を用い、試験間隔20■、引張り速
度0.5隅y’ m l nで測定した。
In addition, the delicate tensile test in the example was carried out using an Instron universal testing machine Nn, 1130, with a test interval of 20 cm and a tensile speed of 0.5 corners y'ml n.

また光学異方性の測定は加熱ステージ上に試料を置いて
、偏光下、25℃/minで昇温しで肉眼観察により行
なった。
The optical anisotropy was measured by placing the sample on a heating stage, raising the temperature at 25° C./min under polarized light, and observing it with the naked eye.

電気特性測定の試料状態の「乾」は20℃、651RH
で96時間放置後の測定を示し、「湿」は「乾」 での
測定後50℃の水中で48時間浸漬し、とりだした後、
積層板表面をガーゼでふいて測定した。吸水率は「乾」
「湿Jの試料の重量変化から求めた。
The "dry" sample state for measuring electrical properties is 20℃, 651RH
``Wet'' means ``dry'' measurement, then immersed in water at 50°C for 48 hours, taken out,
Measurements were made by wiping the surface of the laminate with gauze. Water absorption rate is "dry"
"It was determined from the weight change of the wet J sample.

体積固有抵抗、表面抵抗はJIS  K6911−5−
13により、タケダ理研製超高絶縁針Model  T
R−450を用い、電圧500vを印加して求めた。
Volume resistivity and surface resistance are JIS K6911-5-
13, Takeda Riken ultra-high insulation needle Model T
It was determined using R-450 and applying a voltage of 500v.

絶縁破壊電圧は J I S  K6911−5−11
−3により求めた。
Dielectric breakdown voltage is JIS K6911-5-11
-3.

誘電特性は JIS K6911−5−14  により
相互誘導ブリッジ法で求めた。
The dielectric properties were determined by the mutual induction bridge method according to JIS K6911-5-14.

参考例1 p−アセトキシ安息香酸7.2011(40モル)、テ
レフタル酸2.49Kf(15モル)、イソフタル酸0
.839(5モル) 、4 、4’−ジアセトキシジフ
ェニル5.459(20,2モル)をくし型攪拌翼をも
つ重合槽に仕込み、窒素ガス雰囲気下で攪拌しながら昇
温し、330℃で3時間重合した。この間、生成する酢
酸を除去し、強力な攪拌で重合を行ない、その後徐々に
冷却し、200℃で重合体を系外へ取出した。
Reference example 1 p-acetoxybenzoic acid 7.2011 (40 mol), terephthalic acid 2.49 Kf (15 mol), isophthalic acid 0
.. 839 (5 mol) and 5.459 (20.2 mol) of 4,4'-diacetoxydiphenyl were charged into a polymerization tank with comb-shaped stirring blades, and the temperature was raised while stirring under a nitrogen gas atmosphere to 330°C. Polymerization was carried out for 3 hours. During this time, the acetic acid produced was removed and polymerization was carried out with strong stirring, after which it was gradually cooled and the polymer was taken out of the system at 200°C.

重合体の収量は11.00)fで理論収量の98.2チ
であった。これを線用ミクロン社のハンマー【ルで粉砕
し、2.5m以下の粒子とした。
The yield of the polymer was 11.00 f, which was 98.2 h of the theoretical yield. This was crushed with a hammer made by Wire Micron Co., Ltd. into particles of 2.5 m or less.

これをロータリーキルン中で窒素雰囲気下に280℃で
5時間処理したところ、350℃以上で光学異方性が観
察された。
When this was treated in a rotary kiln at 280° C. for 5 hours under a nitrogen atmosphere, optical anisotropy was observed at 350° C. or higher.

このポリエステルを30m径のスクリュー型押出機を用
い溶融紡糸を行なった。用いたノズルは孔径0.07m
、孔長0.14m1孔数308である。
This polyester was melt-spun using a screw extruder with a diameter of 30 m. The nozzle used had a hole diameter of 0.07m.
, the hole length is 0.14 m and the number of holes is 308.

380℃のシリンダー先端温度、360℃の紡糸頭温度
で紡糸を行なったところ、紡出は極めて安定に行なわれ
、淡黄色の透明繊維が得られた。仁の繊維を320℃で
3時間窒素中で処理したところ、3.21デニール、強
度29.11i/d1伸度2.9%、弥生率1,010
 、F/dであった。
When spinning was carried out at a cylinder tip temperature of 380° C. and a spinning head temperature of 360° C., spinning was carried out extremely stably, and pale yellow transparent fibers were obtained. When the kernel fiber was treated in nitrogen at 320°C for 3 hours, it had a denier of 3.21, a strength of 29.11i/d1, an elongation of 2.9%, and a Yayoi ratio of 1,010.
, F/d.

実施例1 参考例1の繊細を用い、津田駒工業社製自動織機で平織
りの織物を作製した。たて糸、横糸ともに、糸密度を1
1本/amとした。この織物をl0CIIXIOQIに
切断し、住友化学工業製エポキシ樹脂ス【エポキシES
A−011とア【ン開始剤のメチルセロソルブ溶液(工
ポキシ樹脂100.F、ア【ン系開始剤4g、メチルセ
ロソルブ40g)中に浸漬し、取出した後、風乾し、1
30℃で10分おいて、半硬化させた。ξのプリプレグ
を重ねあわせて、160℃で30分、50Kf/cm2
の圧力で積層圧縮成形し、成形後、160℃で1時間、
後硬化させ、繊維体積分率50%の厚さ2〜3mの成形
品を多数作製した。
Example 1 Using the delicate material of Reference Example 1, a plain-woven fabric was produced using an automatic loom manufactured by Tsudakoma Kogyo Co., Ltd. Thread density for both warp and weft is 1
It was set as 1 piece/am. This fabric was cut into 10CIIXIOQI pieces, and the epoxy resin [Epoxy ES] manufactured by Sumitomo Chemical Industries was used.
It was immersed in a methyl cellosolve solution of A-011 and an initiator (engineered poxy resin 100.F, 4 g of an initiator, and 40 g of methyl cellosolve), taken out, and air-dried.
It was left at 30° C. for 10 minutes to semi-cure. Layer ξ prepregs and heat at 160℃ for 30 minutes at 50Kf/cm2
Laminate compression molding at a pressure of 160°C for 1 hour after molding
After curing, a large number of molded products with a thickness of 2 to 3 m and a fiber volume fraction of 50% were produced.

この積層板についての密度、吸水率、電気特性を表1に
示した。比較として、鐘紡製アラミド繊維Kevlar
■49の平織物K −281(1,140デニールの糸
を用い、糸密度は、たて、横ともに6.8本/ C11
)と、日車紡績製のカ5 スmWAla物WEA−18
に−105−BZ−2とを用い、上と同条件、同方法で
作った積層板の物性値を表1に示した。
Table 1 shows the density, water absorption, and electrical properties of this laminate. For comparison, aramid fiber Kevlar manufactured by Kanebo Co., Ltd.
■49 plain woven fabric K-281 (using 1,140 denier thread, thread density is 6.8 threads/C11 for both warp and width)
) and Nichisha Boseki's Ka5smWAla product WEA-18.
Table 1 shows the physical properties of a laminate made using -105-BZ-2 under the same conditions and method as above.

表1から、本発明に基くポリエステル繊維の布基材から
作られた積層板がアラミド繊細、ガラス繊維から作られ
たものに比べ、軽量で、吸水率も低く、電気的性質がす
ぐれていることがわかる。
Table 1 shows that the laminate made from the polyester fiber fabric base material according to the present invention is lighter, has lower water absorption, and has better electrical properties than those made from aramid fiber and glass fiber. I understand.

参考例2 数平均分子[1230、シス1,4構造70俤以上、ビ
ニル構造3優以下の物性を持つ液状ポリブタジェン10
01をp−ノニルフェノール3011フエノール120
y1)ルエン501とBF、・フェノール崎塩0.5I
の混合物に加え80℃で反応させ液状ポリブタジェン1
分子あたり平均5.5分子のフェノール基及びp−ノニ
ルフェノール基が付加している組成物fAlを得た。
Reference Example 2 Liquid polybutadiene 10 with physical properties of number average molecule [1230, cis 1,4 structure of 70 or more, vinyl structure of 3 or less]
01 p-nonylphenol 3011 phenol 120
y1) Luene 501 and BF, phenol saki salt 0.5I
liquid polybutadiene 1 was added to the mixture and reacted at 80°C.
A composition fAl was obtained in which an average of 5.5 molecules of phenol groups and p-nonylphenol groups were added per molecule.

仁の得られた組成物(Al 10011に対してパラホ
ルムアルデヒド16.OF、ヘキサメチレンテトラ鳳ン
3.0.F1溶媒としてトルエン64y1イソプロピル
アルコール16/を加えて80℃で2時間反応させた後
誠圧漢縮した後トルエンを使用して樹脂分50重ff1
%の均一透明なLB変性レゾールワニスを製造した。
The resulting composition (Al 10011, paraformaldehyde 16.OF, hexamethylenetetra-OF 3.0.F1, toluene 64y1 isopropyl alcohol 16/F1 as a solvent was added, and the mixture was reacted at 80°C for 2 hours. After compression, use toluene to reduce the resin content to 50 weight ff1
% of uniformly transparent LB modified resol varnish was produced.

実施例2 実施例1で用いた本発明に基くポリエステルの繊維の布
基材に参考例2のワニスを含浸し、乾燥後、積層し、1
60℃、100 Kf/cs2Gで40分間加圧した。
Example 2 The cloth base material of the polyester fiber according to the present invention used in Example 1 was impregnated with the varnish of Reference Example 2, and after drying, it was laminated.
Pressure was applied at 60° C. and 100 Kf/cs2G for 40 minutes.

得られた積層板中の繊細体積分率は45チであった。こ
の積層板の物性を表2に示す。
The fines volume fraction in the resulting laminate was 45 inches. Table 2 shows the physical properties of this laminate.

参考例3 参考例1の装置を用い、同様の方法で2゜5−ジアセト
キシジフェニルとテレフタル酸とのポリエステルを合成
した。後処理も同様である。このポリエステルは335
℃以上で光学異方性が観察された。このポリエステルを
用い、シリンダ一温度365℃、紡糸頭温度350℃で
溶融紡糸を行ない、黄色透明繊細を得た。この繊細を3
20℃、3時間、窒素中で処理したところ、4.26デ
ニール、強度24.9y/d、伸度3.2襲、弾性率7
86 Ii/d  となった。
Reference Example 3 A polyester of 2°5-diacetoxydiphenyl and terephthalic acid was synthesized using the apparatus of Reference Example 1 and in the same manner. The same applies to post-processing. This polyester is 335
Optical anisotropy was observed above ℃. Using this polyester, melt spinning was carried out at a cylinder temperature of 365°C and a spinning head temperature of 350°C to obtain a yellow, transparent and delicate product. This delicate 3
When treated in nitrogen at 20°C for 3 hours, the result was 4.26 denier, strength 24.9 y/d, elongation 3.2 strokes, and elastic modulus 7.
It became 86 Ii/d.

実施例3 参考例3のポリエステル繊細から実施例1と同様に平織
織物を作り、実施例1と同方法で、エポキシ樹脂含浸積
層板を作製した。
Example 3 A plain weave fabric was made from the fine polyester of Reference Example 3 in the same manner as in Example 1, and an epoxy resin-impregnated laminate was made in the same manner as in Example 1.

積層板の物性を表3に示す。なお、積層板中の繊維体積
分率は52%であった。
Table 3 shows the physical properties of the laminate. Note that the fiber volume fraction in the laminate was 52%.

Claims (1)

【特許請求の範囲】[Claims] 溶融時に異方性を示す芳香族ポリエステルを溶融紡糸し
て得られる繊維から形成される布基材に、熱硬化性樹脂
を含浸させ積層成形し、硬化させることにより得られる
プリント配線基板用積層板
A laminate for printed wiring boards obtained by impregnating a fabric base material made from fibers obtained by melt-spinning aromatic polyester that exhibits anisotropy when melted with a thermosetting resin, laminating and curing the material.
JP17632285A 1985-08-09 1985-08-09 laminate board Pending JPS6236892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17632285A JPS6236892A (en) 1985-08-09 1985-08-09 laminate board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17632285A JPS6236892A (en) 1985-08-09 1985-08-09 laminate board

Publications (1)

Publication Number Publication Date
JPS6236892A true JPS6236892A (en) 1987-02-17

Family

ID=16011554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17632285A Pending JPS6236892A (en) 1985-08-09 1985-08-09 laminate board

Country Status (1)

Country Link
JP (1) JPS6236892A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110064U (en) * 1987-01-08 1988-07-15
EP0603745A1 (en) * 1992-12-24 1994-06-29 Granmont Incorporated Composite printed circuit board substrate and process for its manufacture
WO1996015306A1 (en) * 1994-11-15 1996-05-23 Mitsubishi Gas Chemical Company, Ltd. Sheet material for laminate of printed circuit and laminate for printed circuit using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110064U (en) * 1987-01-08 1988-07-15
EP0603745A1 (en) * 1992-12-24 1994-06-29 Granmont Incorporated Composite printed circuit board substrate and process for its manufacture
US5346747A (en) * 1992-12-24 1994-09-13 Granmont, Inc. Composite printed circuit board substrate and process for its manufacture
WO1996015306A1 (en) * 1994-11-15 1996-05-23 Mitsubishi Gas Chemical Company, Ltd. Sheet material for laminate of printed circuit and laminate for printed circuit using the same
US5692940A (en) * 1994-11-15 1997-12-02 Mitsubishi Gas Chemical Company, Ltd. Sheet material for laminate of printed circuit and laminate for printed circuit using the same

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