JPS6237440U - - Google Patents
Info
- Publication number
- JPS6237440U JPS6237440U JP12049886U JP12049886U JPS6237440U JP S6237440 U JPS6237440 U JP S6237440U JP 12049886 U JP12049886 U JP 12049886U JP 12049886 U JP12049886 U JP 12049886U JP S6237440 U JPS6237440 U JP S6237440U
- Authority
- JP
- Japan
- Prior art keywords
- saw element
- mount structure
- saw
- coaxial connector
- element mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は従来例を示す原理図、第２図乃至第５
図はいずれも本考案実施例を示す斜視図である。
１……ＳＡＷ素子、２〜５……電極、６……表
面弾性波、７，８……同軸形コネクター、９……
金属基板、１０〜１３……ボンデイングワイヤー
、１４……スリツト、１５……エツジ、１６……
金属ケース蓋、１７……樹脂モールド。
Figure 1 is a principle diagram showing a conventional example, Figures 2 to 5
Each figure is a perspective view showing an embodiment of the present invention. 1... SAW element, 2-5... Electrode, 6... Surface acoustic wave, 7, 8... Coaxial connector, 9...
Metal substrate, 10-13... bonding wire, 14... slit, 15... edge, 16...
Metal case lid, 17...Resin mold.
Claims (1)
上にＳＡＷ素子が固定され、上記同軸形コネクタ
ーと上記ＳＡＷ素子がボンデイングワイヤーで直
接結ばれてなることを特徴とするＳＡＷ素子マウ
ント構造。 (2) 上記同軸形コネクターの表面と上記ＳＡＷ
素子の表面とが同一高さに形成されてなることを
特徴とする実用新案登録請求の範囲第１項記載の
ＳＡＷ素子マウント構造。 (3) 上記金属基板が金属ケース蓋で覆われかつ
全体が樹脂モールドされてなることを特徴とする
実用新案登録請求の範囲第１項及び第２項記載の
ＳＡＷ素子マウント構造。[Claims for Utility Model Registration] (1) A SAW element is fixed on a metal substrate to which a coaxial connector is attached, and the coaxial connector and the SAW element are directly connected with a bonding wire. SAW element mount structure. (2) The surface of the above coaxial connector and the above SAW
The SAW element mount structure according to claim 1, wherein the SAW element mount structure is formed at the same height as the surface of the element. (3) The SAW element mount structure according to claims 1 and 2, wherein the metal substrate is covered with a metal case lid and is entirely molded with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12049886U JPS6237440U (en) | 1986-08-05 | 1986-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12049886U JPS6237440U (en) | 1986-08-05 | 1986-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237440U true JPS6237440U (en) | 1987-03-05 |
Family
ID=31008867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12049886U Pending JPS6237440U (en) | 1986-08-05 | 1986-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237440U (en) |
-
1986
- 1986-08-05 JP JP12049886U patent/JPS6237440U/ja active Pending
Non-Patent Citations (1)
| Title |
|---|
| PROCEEDINGS OF THE IEEE=1970 * |