JPS6350136U - - Google Patents

Info

Publication number
JPS6350136U
JPS6350136U JP1986144649U JP14464986U JPS6350136U JP S6350136 U JPS6350136 U JP S6350136U JP 1986144649 U JP1986144649 U JP 1986144649U JP 14464986 U JP14464986 U JP 14464986U JP S6350136 U JPS6350136 U JP S6350136U
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor pellet
heat dissipation
land portion
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986144649U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986144649U priority Critical patent/JPS6350136U/ja
Publication of JPS6350136U publication Critical patent/JPS6350136U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導板装置のリードフレ
ームの平面図、第２図は上記リードフレームより
製造された半導体装置の全体斜視図、第３図及び
第４図は従来のリードフレームの平面図、第５図
は従来の半導体装置の平面図、第６図は第５図の
側断面図、第７図及び第８図は半導体装置の側面
図である。 １ａ……ランド部、１ｂ……放熱タブ、２……
リード、４……半導体ペレツト、５……金属細線
、６……外装樹脂材、１１……穴、１２……リー
ドフレーム、１３……半導体装置。 FIG. 1 is a plan view of a lead frame of a semiconductor board device according to the present invention, FIG. 2 is an overall perspective view of a semiconductor device manufactured from the lead frame, and FIGS. 3 and 4 are views of a conventional lead frame. 5 is a plan view of a conventional semiconductor device, FIG. 6 is a side sectional view of FIG. 5, and FIGS. 7 and 8 are side views of the semiconductor device. 1a...land part, 1b...heat radiation tab, 2...
Lead, 4... Semiconductor pellet, 5... Fine metal wire, 6... Exterior resin material, 11... Hole, 12... Lead frame, 13... Semiconductor device.

Claims (1)

【実用新案登録請求の範囲】 放熱タブを有する金属製のリードフレームのラ
ンド部上に半導体ペレツトを固着マウントし、上
記ランド部の近傍まで延設された複数のリードの
先端部と半導体ペレツトとを金属細線で電気的に
接続して、上記半導体ペレツトを含む主要部分を
外装樹脂材でモールドした半導体装置に於いて、 上記放熱タブの折曲予定部位に複数の穴を形成
したことを特徴とする半導体装置。[Claim for Utility Model Registration] A semiconductor pellet is fixedly mounted on a land portion of a metal lead frame having a heat dissipation tab, and the semiconductor pellet is connected to the tips of a plurality of leads extending to the vicinity of the land portion. The semiconductor device is electrically connected by a thin metal wire and the main part including the semiconductor pellet is molded with an exterior resin material, characterized in that a plurality of holes are formed in the bending portion of the heat dissipation tab. Semiconductor equipment.
JP1986144649U 1986-09-19 1986-09-19 Pending JPS6350136U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986144649U JPS6350136U (en) 1986-09-19 1986-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986144649U JPS6350136U (en) 1986-09-19 1986-09-19

Publications (1)

Publication Number Publication Date
JPS6350136U true JPS6350136U (en) 1988-04-05

Family

ID=31055448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986144649U Pending JPS6350136U (en) 1986-09-19 1986-09-19

Country Status (1)

Country Link
JP (1) JPS6350136U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564243A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Semiconductor device and assembly method thereof
JPS5623765A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Molded type electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564243A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Semiconductor device and assembly method thereof
JPS5623765A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Molded type electronic device

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