JPS6237728Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a metal-clad fiber-reinforced laminate used for printed wiring board substrates of electronic devices, etc.

[Technical background of the invention]

Conventionally, a wide variety of metal-clad fiber-reinforced laminates have been used as substrates for printed wiring boards of electronic devices. As these fiber-reinforced members, prepreg sheets in which a single fiber such as glass fiber, paper, synthetic fiber, or aromatic polyamide fiber is impregnated with a thermosetting resin have been used depending on the purpose. For example, substrates for printed wiring boards of electronic equipment mounted on artificial sanitary vehicles, missiles, and other flying objects have mechanical properties such as distortion and warpage, electrical insulation properties, heat resistance properties, and other lightweight properties. ization has been required. For this reason, prepreg sheets of aromatic polyamide fibers, which have a low specific gravity and satisfy the above-mentioned properties, have been used. Then, a plurality of prepreg sheets of aromatic polyamide fibers are stacked one on top of the other and then hot-press molded to form a flat laminate, and a conductive metal plate, such as a copper plate, is adhered to the outer surface of this laminate. A copper-clad aromatic polyamide fiber-reinforced laminate was used.

[Problems with background technology]

However, although the copper-clad aromatic polyamide fiber-reinforced laminate formed with the above-mentioned structure is excellent in mechanical strength such as tensile strength and elasticity, it is significantly inferior in machinability. For this reason, when a copper plate is etched using a photo-etching method or the like to provide a circuit pattern and used as a printed wiring board, the through holes for inserting electrical components and the through holes for through holes must be machined, for example, cut. However, this cutting process was extremely difficult. For example, even if drilling is performed by a punching method using a carbide tool for metal processing, the tool is severely worn and difficult. Furthermore, even if holes could be formed, burrs and peeling of the aromatic polyamide fibers would occur around the formed through holes, making it unsuitable for practical use as a printed wiring board. In addition, cutting tools with special shapes specifically designed for aromatic polyamide fibers are commercially available, but even when drilling holes using these cutting tools, it is difficult to form a machined surface that can withstand practical use as a printed wiring board. It was hot. Furthermore, laser machining is adopted as the most suitable hole-drilling method. However, this method requires large-scale equipment and has the disadvantage that the high heat during processing burns the area around the hole being drilled, reducing electrical insulation.

[Purpose of invention]

The present invention provides a metal-clad fiber-reinforced laminate that solves the above-mentioned difficulties and drawbacks.

[Summary of the idea]

The present invention uses a glass fiber-reinforced layer as a suppressing member to suppress the occurrence of spalling and plucking of aromatic polyamide fibers when machining, for example, cutting an aromatic polyamide fiber-reinforced laminate. By interposing it between the metal plate and the metal plate, it is possible to reduce the weight and facilitate machining.

[Example of idea]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

1 is an aromatic polyamide fiber reinforced layer. This aromatic polyamide fiber reinforced layer 1 is formed by stacking a plurality of prepreg sheets 2 of aromatic polyamide fibers. A first glass fiber reinforced layer 4 is formed on one surface of the aromatic polyamide fiber 1 by stacking a predetermined number of glass fiber prepreg sheets 3 on top of each other. The glass fibers in the first glass fiber reinforced layer 4 are formed so that the volume content of the fibers in the laminate to be finally formed is 3% or more and 30% or less. Further, on the other side of the aromatic polyamide fiber reinforced layer 1 , a second glass fiber prepreg sheet 5 is laminated so as to have the same fiber volume content as the first glass fiber reinforced layer 4 . A glass fiber reinforced layer 6 is formed. Then, conductive metal plates such as copper plates 7a and 7b are provided on the outer surfaces of the first and second glass fiber reinforced layers 4 and 6 , respectively, and then a flat plate is formed by thermoforming, such as a hot press (not shown). It is integrally molded into a shape.

[Effect of idea]

With the above configuration, each of the glass fibers in the first and second glass fiber reinforced layers 4 and 6 is
Because the fiber volume content in the final laminate is limited to 3% to 30%, it is lighter than a laminate made by laminating prepreg sheets of glass fiber, paper, synthetic fiber, etc. alone. It can be measured.

When the copper plates 7a and 7b are etched by photoetching to form circuit patterns for use as printed wiring boards, a hole drilling process is required to form holes for inserting electronic components and through holes.
Since each of No. 4 and No. 6 acts as an inhibitor for suppressing the generation of burrs and pull-outs in the aromatic polyamide fiber, it has become possible to easily perform drilling with a carbide tool or the like that is normally used in metal processing.

Furthermore, as described above, since it is lightweight and has excellent machinability, it can also be used as a structural member of electronic equipment mounted on flying objects such as artificial satellites and aircraft.

It should be noted that this invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without changing the gist.

[Brief explanation of the drawing]

The figure is a side view for explaining the metal-clad fiber-reinforced laminate according to the present invention. 1 ...Aromatic polyamide fiber reinforced layer, 2...Aromatic polyamide fiber prepreg sheet, 3,5
...Glass fiber prepreg sheet, 4 ...First glass fiber reinforced layer, 6 ...Second glass fiber reinforced layer, 7a, 7b...Copper plate.

Claims (1)

[Scope of utility model registration request] An aromatic polyamide fiber-reinforced layer is formed by stacking a plurality of prepreg sheets of aromatic polyamide fibers and heat-press molding them, and a predetermined number of prepreg sheets of glass fibers are stacked on one side of this aromatic polyamide fiber-reinforced layer. A predetermined number of prepreg sheets made of the same glass fiber as the first glass fiber reinforced layer are overlaid on the other side of the first glass fiber reinforced layer and the aromatic polyamide fiber reinforced layer, which are molded under heat, and then hot pressed. A metal-clad fiber-reinforced laminate comprising a molded second glass fiber-reinforced layer and a conductive metal plate provided on the outer surfaces of the first and second glass fiber-reinforced layers.