JPS6237760Y2 - - Google Patents

Description

[Detailed description of the invention] This invention is an abrasive pattern in which a scale pattern or a plurality of independent circular patterns are exposed by polishing on the surface of various plate-like substrates such as plastic films, plastic plates, metal foils, and metal plates. The present invention relates to a mounting device.

Its purpose is to have a simple structure, lightweight movable parts, energy-saving drive, and general-purpose use that can pattern the surface of various plate-like substrates, from large to small film thicknesses. The object of the present invention is to provide an abrasive patterning device that is highly versatile.

Conventionally, a device for making scale patterns or the like appear on the surface of a metal plate base material by grinding is known, for example, from Japanese Patent Publication No. 52-12438. The device of this known invention is equipped with an intermittent feeding device that intermittently transfers a metal plate, and a plurality of rotating shafts arranged in a line at predetermined intervals on a metal plate transfer path and each having a patterned grindstone at its lower end. a patterning device, a drive device that rotates the rotating shafts of the device all at once, a lifting mechanism that moves each grindstone of the patterning device up and down on the path of the metal plate, and a drive device that moves each grindstone of the patterning device every time the intermittent feeding device operates. This is a metal plate patterning device consisting of a horizontal swing mechanism that reciprocates sideways by a distance of 1/2 of the distance between grinding wheels. Since this device moves the grindstone back and forth laterally, it is necessary to swing the patterning device itself laterally together with the lifting mechanism. Therefore, the weight of the movable parts increases, and sufficient consideration must be given to the strength of each member including the mounting base, and furthermore, the power interlocking mechanism becomes complicated.
Furthermore, the large weight of the movable part is not applicable when the grinding wheel and the substrate to be ground are thin and have low surface strength, for example, in the case of plastic film.

In addition, the above-mentioned known device uses a "grinding wheel" as a grinding means and uses a spring to adjust the contact pressure with the base material to be ground, but such a mechanism does not work when the base material to be ground is a metal plate. only valid. That is, as mentioned above, the weight of the movable parts of this device is large, and it is difficult to finely adjust the contact pressure by using a spring.Furthermore, since the grinding wheel itself has no elasticity, it is difficult to finely adjust the contact pressure using a spring. When applied to a thin film such as a plastic film or a material with low surface strength, there is a risk that the film may be torn.

The present inventors investigated various devices that could apply polishing patterns even to thin plastic films using a simple method, and as a result, they came up with a completely different idea from the above-mentioned known devices: ``Swing the base material to be polished laterally.'' Adopting a mechanism,
In addition, the device of the present invention was completed by using an ``abrasive cloth'' instead of a ``grinding stone'' as a pattern forming means.

That is, the apparatus of the present invention has an intermittent feed mechanism that intermittently transports the base material to be polished, and a rotating shaft 21 that rotates independently on the transport path for the base material to be polished, arranged in a line at predetermined intervals, A patterning mechanism each having an abrasive cloth 22 at its lower end, a drive mechanism configured to rotate each rotating shaft 21 of the patterning mechanism at the same time by a single chain 35, and a patterning mechanism having each abrasive cloth 22 of the patterning mechanism covered. An elevating mechanism that moves up and down onto the path of the polishing base material, a buffer mechanism provided with a damper 52 to prevent impact contact between the polishing cloth 22 and the base material to be polished when the patterning mechanism descends, and a buffer mechanism fixed to the base. A polishing patterning machine comprising a drive device 62 and a lateral swinging mechanism equipped with a substrate holding frame 65 that reciprocates the substrate to be polished by a fixed distance in the lateral direction each time the intermittent feed mechanism operates. It is a device.

In the present invention, plastic films, plastic plates, metal foils, metal plates, etc. can be used as the substrate to be polished, regardless of the film thickness or surface strength. When targeting films or foils with a thickness of 1 mm or less, in order to give them smoothness and to facilitate their transfer, place a plastic or metal plate under the substrate to be polished. It is desirable to have it installed.

The abrasive cloth used in this invention is made by cutting out a disc-shaped material by adhering diamond sand to a non-woven fabric made of nylon or the like, and it itself has elasticity. be.

The apparatus of the present invention will be explained as follows based on the drawings.

The intermittent feed mechanisms 11 to 17 have a drive device 11 attached to a base, and a drive device 11 that moves vertically in the vertical direction.
Feed dog 12 that reciprocates in pitch increments;
A feed rod 15 is held by a bearing 17 so as to be movable in the vertical direction guided by a guide rod 14 fixed to a base, and a hinge (not shown) is attached to one end of the feed rod 15. A mating rod 13 that meshes with the feed dog 12, which is connected to the feed dog 12 so as to be able to move up and down, and a base material contact plate 16 that is fixed to the feed rod 15 and presses one end of the base material to be polished. be done.

A plurality of patterning mechanisms 21 to 23 are arranged in a row in the lateral direction of the material to be polished, and include a rotating shaft 21 having an abrasive cloth 22 at the lower end, and an elevating mechanism 41 that supports this rotary shaft 21 .
It is composed of bearings 23 attached to mounting plates 44 of ~45.

The drive mechanisms 31 to 35 include a prime mover 31, a reducer 32 connected by a belt, and pulleys 33, 34.
A single chain 35 is driven through the patterning mechanism, and this chain is configured to drive the rotating shaft 21 of the patterning mechanism.

The lifting and lowering mechanisms 41 to 45 are supported by columns 4 fixed to the base.
1, a cylinder 42 fixed within the support 41,
It is composed of a piston 43 that moves within the cylinder 42, and a mounting plate 44 that is supported by a bearing on a guide rod 45 that is fixed to the base and support column 41.

The buffer mechanisms 51 to 52 are composed of a damper 51 fixed to the support column 41 and a contact plate 52 fixed to the mounting plate 44.

The lateral swing mechanisms 61 to 66 include a drive device 62 fixed to a base, a feed rod 61 that is reciprocated by a fixed distance in the lateral direction, and the feed rod 6.
The contact frame 64 has a concave cross section and is fixed to the contact frame 64, and the base material holding frame 65 is fixed to the left and right upper ends of the contact frame 64.

The drive device 62 operates so that the feed rod 61 is reciprocated by a predetermined distance each time the intermittent feed mechanism is operated. In the figure, 66 is a bearing provided on the base so that the communication frame 64 can be moved back and forth smoothly.

The device of the present invention assembled by the above-mentioned mechanisms places the material to be polished so as to be held by the material holding frame 65 and the base material holding plate 16, and the patterning mechanisms 21 to
23 and its drive mechanisms 31 to 35 are operated, and then the elevating mechanisms 41 to 45 are lowered, and the buffer mechanism 5 is lowered.
1 to 52, the loose abrasive cloth 22 and the base material to be polished are brought into contact with each other to impart a first-stage abrasive pattern.

Next, the elevating mechanisms 41 to 45 are activated and raised, and at the same time, the intermittent feeding mechanisms 11 to 17 and the lateral swing mechanisms 61 to 66 are activated to move the substrate to be polished in the vertical and horizontal directions, and then the elevating mechanisms 41 to 45 are activated. It is activated and lowered, and similar to the first stage, it applies the second stage polishing pattern. Thereafter, by sequentially repeating the above steps, a polishing pattern is imparted to the substrate to be polished. The base material to be polished, which has been given the polishing pattern, is transferred to a pedestal, and this pedestal is also equipped with the same lateral swing mechanism as the lateral swing mechanism in the base, and the base material to be polished is moved in the lateral direction. Prevents bending.

Note that by adjusting the operations of the intermittent feeding mechanisms 11 to 17 and the lateral shaking mechanisms 61 to 66, it is possible to make the polishing pattern appear circular, scaly, or a combination thereof.

Since the device according to the present invention has a mechanism for horizontally swinging the substrate to be polished, there is no need to horizontally swing the patterning device itself together with the lifting mechanism, and the device is extremely lightweight compared to conventionally known devices, and the overall structure is The power required to drive the horizontal swing mechanism, intermittent feed mechanism, and lifting mechanism is reduced.
This can meet the demand for energy conservation.

In addition, since the device of the present invention uses abrasive cloth, its elasticity can be utilized, and it can be applied to plastic films, plastic plates, metal foils, metal plates, etc., regardless of the film thickness or surface strength. Nevertheless, it has become possible to apply abrasive patterns to various substrates to be polished, and the use of an abrasive cloth has also made it possible to reduce the weight of the pattern forming apparatus.

As described above, the device of the present invention can create scale patterns, circular patterns, or combinations thereof on the surface of various substrates by polishing, and is lightweight, simple in structure, and highly versatile. It is of extremely high practical value.

[Brief explanation of the drawing]

Figure 1 is a front view of the device of the present invention, Figure 2 is a partially cutaway plan view of the device of the present invention, Figure 3 is a partially cutaway side view of the device of the present invention, and Figure 4 is a diagram of the device of the present invention. A sectional view taken along line A-A' in FIG. 3 is shown.

Claims (1)

[Scope of utility model registration request] An intermittent feed mechanism for intermittently transporting the base material to be polished, and rotating shafts 21 that rotate independently onto the transport path for the base material to be polished are provided in a row at predetermined intervals, and each has an abrasive cloth 22 at its lower end. The patterning mechanism has a patterning mechanism, and each rotating shaft 21 of the patterning mechanism is connected to one chain 35.
a driving mechanism capable of rotating the abrasive cloths 22 all at once; a lifting mechanism capable of causing each abrasive cloth 22 of the patterning mechanism to emerge and retract onto the path of the substrate to be polished; A buffer mechanism provided with a damper 52 to prevent impact contact between the base material 22 and the substrate to be polished, and a drive mechanism 6 fixed to the base.
2; and a lateral swinging mechanism comprising a base material holding frame 65 for reciprocating the base material to be polished by a fixed distance in the lateral direction each time the intermittent feeding mechanism operates.