JPS6237930U - - Google Patents
Info
- Publication number
- JPS6237930U JPS6237930U JP1985129228U JP12922885U JPS6237930U JP S6237930 U JPS6237930 U JP S6237930U JP 1985129228 U JP1985129228 U JP 1985129228U JP 12922885 U JP12922885 U JP 12922885U JP S6237930 U JPS6237930 U JP S6237930U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- wire bonding
- glass sealing
- recess
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例につき、第２図、第３
図は従来例につき、それぞれワイヤボンデイング
作業後の状況を示す要部断面図である。
１…リードフレーム、２…ワイヤ、３…パツケ
ージ半体、４…ガラス封止部分、５…半導体素子
、１０…リードフレーム（本考案）、１１…凹部
。
Figure 1 shows an embodiment of the present invention, Figures 2 and 3
The figures are sectional views of main parts of conventional examples showing the state after wire bonding work. DESCRIPTION OF SYMBOLS 1... Lead frame, 2... Wire, 3... Package half body, 4... Glass sealing part, 5... Semiconductor element, 10... Lead frame (this invention), 11... Recessed part.
Claims (1)
、リードフレームの先端部に、ワイヤボンデイン
グ用の凹部を設けたことを特徴とする半導体装置
用リードフレーム。 A lead frame for a semiconductor device, characterized in that the lead frame for a glass sealing case is provided with a recess for wire bonding at the tip of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985129228U JPS6237930U (en) | 1985-08-23 | 1985-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985129228U JPS6237930U (en) | 1985-08-23 | 1985-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237930U true JPS6237930U (en) | 1987-03-06 |
Family
ID=31025618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985129228U Pending JPS6237930U (en) | 1985-08-23 | 1985-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237930U (en) |
-
1985
- 1985-08-23 JP JP1985129228U patent/JPS6237930U/ja active Pending