JPS6237957A - Manufacture of thick film resistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing a thick film resistor produced on a ceramic substrate by drawing or printing.

BACKGROUND OF THE INVENTION In recent years, as electronic devices have become smaller, their circuit boards have also become smaller, leading to a trend towards higher density packaging. One of the methods for high-density packaging is hybrid IC (hereinafter referred to as HI).
Call it C. ). The method for manufacturing the resistor used in the HIO2 page is to form the resistor and wiring pattern on a ceramic substrate, and then form the resistor by drawing or printing.

As shown in FIG. 3, a conventional thick film resistor is constructed by having a planar rectangular resistor 1 on a substrate in contact with electrodes 2, 2 in gold mines.

3 is a contact portion between the resistor 1 and the electrode 2.

On the other hand, with thick film resistor paste, the size of the particles that become the resistor
The specific resistance changes depending on the viscosity, solid content, etc., and it is difficult to determine the desired specific resistance, and the resistance value tends to deviate from the target resistance value. Conventionally, in order to adjust this, the paste was removed from a screen in the printing method or from a drawing ink tank in the drawing method, and the viscosity was controlled with a diluent such as thinner, or blended with other resistance pastes. I was making adjustments.

Problems to be Solved by the Invention However, in the above method, once the
7. It is necessary to remove the paste from the screen or drawing ink tank to adjust the resistivity.
It was extremely unproductive.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a method for manufacturing a thick film resistor, which allows the resistance value to be easily adjusted.

Means to solve the problem In order to solve the above problem, the thick film resistor fabrication position is changed in the direction of the thick film resistor, and the electrodes formed at both ends of the thick film resistor are changed. This is a method of manufacturing a thick film resistor in which a desired resistance value is obtained by changing the contact area with the resistor.

Function: As described above, the present invention obtains a desired resistance value by changing the manufacturing position of the thick film resistor in the lengthwise and widthwise direction of the resistor and changing the contact area with the electrodes formed at both ends thereof. Therefore, the resistance value can be easily adjusted to obtain the desired resistance value.

EXAMPLE Hereinafter, a method for manufacturing a thick film resistor according to an example of the present invention will be described with reference to the drawings. Figure 1.

FIG. 2 is a plan view of a resistor formed by the thick film resistor manufacturing method of the present invention. In FIGS. 1 and 2, the contact area between the resistor and the electrode is changed. In Figure 1, the contact area between the thick film resistor and the electrode is small, but the contact area between the thick film resistor and the electrode is small.
In the figure, almost the entire area is in contact.

When the resistor is fabricated as shown in Figure 1, if the resistance value is higher than the desired resistance value, the resistor is shifted downward as shown in Figure 2, and the electrode 2 is left in its original position. Form.

Then, the area of the resistor and electrode increases, and the resistance value decreases accordingly and approaches the desired resistance value. That is, the desired resistance value can be obtained by measuring the resistance value after the resistor is manufactured and changing the formation position of the resistor so as to approach the desired resistance value. The relationship between the contact area and the resistance value becomes as shown in FIG. 6 when the electrode length X is changed in the resistor shown in FIG. 4.

To shift the formation position of the resistor as described above, when forming a thick film resistor by printing, either shift the position of the screen attached to page 5 of the printing machine, or slightly move the position of the holder on the printing surface. This can be easily done. Further, when forming a thick film resistor using a drawing method, the coordinates of the resistor drawing position may be changed.

In the above embodiment, the electrode formation position is kept constant and the resistor fabrication position is shifted, but it is also possible to conversely keep the resistor fabrication position constant and the electrode fabrication position to be shifted.

Effects of the Invention According to the method for manufacturing a thick film resistor of the present invention, the resistance value can be adjusted by simply shifting the positions of the resistor and the electrode relative to each other, thereby significantly improving productivity.

[Brief explanation of the drawing]

1 and 2 are plan views of an embodiment of the present invention, FIG. 3 is a plan view of a resistor formed by a conventional thick film resistor manufacturing method, and FIG. 4 is a plan view of a thick film resistor. External view, No. 6
This figure is a characteristic diagram of the resistor when the length of the electrode is changed in FIG. 4. 6 He-7 1... Thick film resistor, 2... Electrode, 3...
...Thick film resistor and electrode contact area. Name of agent: Patent attorney Toshio Nakao and 1 other person/
-m-membrane resistor? ---Electrode Figure 1 3-1H armpit &! The weight of the body and the spirit house fJ, l 4 yen! Figure 2 Figure 3

Claims (1)

[Claims] A method for manufacturing a thick film resistor produced by drawing or printing, in which the production position of the thick film resistor is changed in the width direction of the thick film resistor, and the thick film resistor is formed at both ends of the thick film resistor. A method of manufacturing a thick film resistor in which a desired resistance value is obtained by changing the contact area with an electrode.