JPS6237986A - 加工導電性回路基板とその補強法 - Google Patents

加工導電性回路基板とその補強法

Info

Publication number: JPS6237986A
Authority: JP; Japan
Prior art keywords: substituted; nuclear; circuit board; mixture; conductive
Prior art date: 1985-08-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP17824685A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0320077B2 (fr

Inventor

一洋橘

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nissha Printing Co Ltd

Original Assignee

Nissha Printing Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-08-12

Filing date

1985-08-12

Publication date

1987-02-18

1985-08-12 Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd

1985-08-12 Priority to JP17824685A priority Critical patent/JPS6237986A/ja

1987-02-18 Publication of JPS6237986A publication Critical patent/JPS6237986A/ja

1991-03-18 Publication of JPH0320077B2 publication Critical patent/JPH0320077B2/ja

Status Granted legal-status Critical Current

Links

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VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
239000002033 PVDF binder Substances 0.000 claims description 3
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238000006386 neutralization reaction Methods 0.000 description 7
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235000011114 ammonium hydroxide Nutrition 0.000 description 4
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KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
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238000004140 cleaning Methods 0.000 description 1
229910000365 copper sulfate Inorganic materials 0.000 description 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
238000005238 degreasing Methods 0.000 description 1
XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
235000011180 diphosphates Nutrition 0.000 description 1
238000011978 dissolution method Methods 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
239000012776 electronic material Substances 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
238000011049 filling Methods 0.000 description 1
150000002222 fluorine compounds Chemical class 0.000 description 1
239000007789 gas Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
238000007731 hot pressing Methods 0.000 description 1
150000002429 hydrazines Chemical class 0.000 description 1
125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
238000007654 immersion Methods 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
239000002648 laminated material Substances 0.000 description 1
238000010329 laser etching Methods 0.000 description 1
MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
229910001486 lithium perchlorate Inorganic materials 0.000 description 1
239000001630 malic acid Substances 0.000 description 1
235000011090 malic acid Nutrition 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
230000000873 masking effect Effects 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
150000007522 mineralic acids Chemical class 0.000 description 1
239000011259 mixed solution Substances 0.000 description 1
239000003607 modifier Substances 0.000 description 1
238000010137 moulding (plastic) Methods 0.000 description 1
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
150000002823 nitrates Chemical class 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
235000005985 organic acids Nutrition 0.000 description 1
239000003002 pH adjusting agent Substances 0.000 description 1
239000003973 paint Substances 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
239000010452 phosphate Substances 0.000 description 1
229920002120 photoresistant polymer Polymers 0.000 description 1
IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
238000005554 pickling Methods 0.000 description 1
239000002985 plastic film Substances 0.000 description 1
229920006255 plastic film Polymers 0.000 description 1
239000003495 polar organic solvent Substances 0.000 description 1
229920002312 polyamide-imide Polymers 0.000 description 1
229920006289 polycarbonate film Polymers 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
229940074439 potassium sodium tartrate Drugs 0.000 description 1
239000010970 precious metal Substances 0.000 description 1
230000001376 precipitating effect Effects 0.000 description 1
230000001007 puffing effect Effects 0.000 description 1
UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
125000000168 pyrrolyl group Chemical group 0.000 description 1
238000011160 research Methods 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1
239000005060 rubber Substances 0.000 description 1
229920006395 saturated elastomer Polymers 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
229910001961 silver nitrate Inorganic materials 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
235000011006 sodium potassium tartrate Nutrition 0.000 description 1
229940074404 sodium succinate Drugs 0.000 description 1
ZDQYSKICYIVCPN-UHFFFAOYSA-L sodium succinate (anhydrous) Chemical compound [Na+].[Na+].[O-]C(=O)CCC([O-])=O ZDQYSKICYIVCPN-UHFFFAOYSA-L 0.000 description 1
235000010265 sodium sulphite Nutrition 0.000 description 1
AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
235000019345 sodium thiosulphate Nutrition 0.000 description 1
239000012265 solid product Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
239000001119 stannous chloride Substances 0.000 description 1
235000011150 stannous chloride Nutrition 0.000 description 1
239000010959 steel Substances 0.000 description 1
239000007785 strong electrolyte Substances 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
OSBSFAARYOCBHB-UHFFFAOYSA-N tetrapropylammonium Chemical compound CCC[N+](CCC)(CCC)CCC OSBSFAARYOCBHB-UHFFFAOYSA-N 0.000 description 1
229920006337 unsaturated polyester resin Polymers 0.000 description 1
238000007738 vacuum evaporation Methods 0.000 description 1
238000007740 vapor deposition Methods 0.000 description 1

Landscapes

Manufacturing Of Printed Wiring (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

JP17824685A 1985-08-12 1985-08-12 加工導電性回路基板とその補強法 Granted JPS6237986A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP17824685A JPS6237986A (ja)	1985-08-12	1985-08-12	加工導電性回路基板とその補強法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP17824685A JPS6237986A (ja)	1985-08-12	1985-08-12	加工導電性回路基板とその補強法

Publications (2)

Publication Number	Publication Date
JPS6237986A true JPS6237986A (ja)	1987-02-18
JPH0320077B2 JPH0320077B2 (fr)	1991-03-18

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ID=16045138

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Application Number	Title	Priority Date	Filing Date
JP17824685A Granted JPS6237986A (ja)	1985-08-12	1985-08-12	加工導電性回路基板とその補強法

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JP (1)	JPS6237986A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004524149A (ja) *	2001-03-02	2004-08-12	コミツサリアタレネルジーアトミーク	複合表面の導電性部分または半導電性部分上へとマスクフリーで局所的に有機物をグラフト形成するための方法

1985
- 1985-08-12 JP JP17824685A patent/JPS6237986A/ja active Granted

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004524149A (ja) *	2001-03-02	2004-08-12	コミツサリアタレネルジーアトミーク	複合表面の導電性部分または半導電性部分上へとマスクフリーで局所的に有機物をグラフト形成するための方法

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Publication number	Publication date
JPH0320077B2 (fr)	1991-03-18

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JPS6237986A - 加工導電性回路基板とその補強法 - Google Patents

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Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=16045138

Family Applications (1)

Country Status (1)

Cited By (1)

Cited By (1)

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