JPS6237988A - Electronic component mounting equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic component mounting apparatus for mounting leadless type electronic components such as chip resistors and chip multilayer capacitors onto a substrate constituting an electronic circuit. Especially from taping cassettes that hold a tape-like member containing a large number of electronic components.

The present invention relates to an electronic component mounting device that takes out electronic components and mounts them on a board.

Conventional technology In electronic component mounting equipment, Japanese Patent Application Laid-Open No. 55-118698
A device using a taping cassette is already known, an example of which is disclosed in Japanese Patent Publication No. The taping cassette stores a large number of electronic components in a tape-like member, winds and holds this tape-like member on a reel, and
The structure is such that a feeding mechanism that engages with a feeding hole formed in the tape-like member and enables the tape-like member to be fed out intermittently is provided in the vicinity of the component extraction position. The above-mentioned electronic component mounting device uses a suction head to adsorb and take out the electronic components in the tape-like member at the component take-out position of the taping cassette, and operates a feeding mechanism to sequentially feed out the tape-like members, and the electronic components are picked up by the suction head. The electronic component is configured to be mounted on a predetermined position on the board by moving the head.

In addition, in order to sequentially mount multiple types of electronic components on the board, a plurality of the taping cassettes are arranged in parallel, and a suction head that can move in the parallel direction takes out the electronic components from any taping cassette, and the taping cassette There have also been proposals in which desired electronic components are mounted at predetermined positions on a board movably arranged on the side of the group.

Problems to be Solved by the Invention However, since a single suction head is used in the above-mentioned electronic component mounting apparatus, the suction head is moved back and forth once, and
There is a problem in that only one electronic component can be mounted, and high-speed mounting is difficult.

Therefore, it has been considered that a pair of taping cassette groups and a suction head are arranged side by side to enable high-speed mounting, but there are problems in that the device becomes large, requires space, and increases cost. Furthermore, it was considered that the taping cassette group could be combined into one and have multiple suction heads, but in that case, the suction heads would have to be
It is necessary to move along different movement paths, which makes controlling the removal position of electronic components and controlling the movement of the board extremely complicated, which increases the cost of the control device and causes malfunctions. There are problems such as easy.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems and to provide an electronic component mounting device that is capable of high-speed mounting and has a simple configuration and control.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention arranges taping cassettes each holding a tape-like member containing a large number of electronic components in parallel, and arranges the component take-out position of each taping cassette and the electronic A plurality of movable bodies are provided that move the taping cassette between the board on which the component is mounted and on mutually different movement paths in parallel directions, and each movable body has a suction device that takes out the electronic component from the tape-like member and mounts it on the board. A suction head is provided, and the suction head is attached to the movable body so as to be movable between two positions in a direction intersecting the moving direction of the movable body, and when the suction head is in the first position, the suction heads are located on the same movement path. However, when they are in the second position, they are located on different movement paths that do not interfere with each other.

Function Since the present invention has the above-mentioned configuration, it is possible to efficiently mount electronic components from a taping cassette to a board at high speed using a plurality of suction heads. By moving the suction heads to the second position, the suction heads do not interfere with each other and can be positioned on the same path when taking out from the taping case 7) and when attaching to the board, making it possible to control the position of the board, etc. It can be done easily.

EXAMPLE An example of the present invention will be described below based on the drawings. First, the overall layout will be explained with reference to Figure 3.
A plurality of taping cassettes 1 having substantially the same configuration as that disclosed in Japanese Patent No. 5-118698 are arranged in parallel to form an electronic component supply section 2. One end of this electronic component supply section 2 serves as a component take-out position 3 for taking out electronic components from any taping cassette 1.

A substrate moving device 5 is disposed on the side of the component supply section 2, which is capable of moving and driving a substrate 4 on which electronic components are to be mounted in a direction perpendicular to the parallel direction of the taping cassettes 1, and can accurately position it at any position. It is set up. Above the component extraction position 3, an electronic component transfer device 8 is configured to move in the parallel direction of the taping cassettes 1 to take out electronic components from any taping cassette 1 and mount them on the board 4. The electronic component transfer device 8 is disposed across the gap between the component supply section 2 and the substrate transfer device 5, and includes a pair of moving bodies 7 each having a suction head 6 attached thereto. □ Below the component take-out position 3 in the electronic component supply section 2, a feeding device 9 for feeding out the tape-like members of each taping force set 1 is disposed so as to be movable in the parallel direction of the taping cassettes 1. .

The configuration of the electronic component transfer device 8 will be explained with reference to FIGS. 1 and 2. The pair of moving bodies 7 each have guide rails arranged in parallel on both sides of a moving path 10 passing through the component counting position 3. 11, and is disposed so as to surround each guide rail 11.
A part of the moving body 7 is fixed to the movable body 7. Each endless rotating body 12 is wound between a driving wheel body 13 and a driven wheel body 14 at both ends, and the driving wheel body 13 is configured to be rotatably driven by a servo motor 15. The movable body 7 is equipped with a rocking body 16 that can swing around a vertical axis, and the suction head 6 is attached to the tip of the rocking body 16 . A switching lever 17 extends from the swinging body 16 to the side opposite to the suction head 6 side, and an engagement roller 18 is attached to the tip thereof. The engagement roller 18 is movably engaged with an operating bar 19 which is disposed parallel to the guide rail 11 and movable towards and away from the guide rail 11.

The operating bars 19 are each driven to move by driving means 20 such as a pair of cylinder devices, and as a result, the rod 6 is attracted to the tip of the oscillating body 16 to the first position on the moving path 10.
It is configured to move between this position and a second position where it is retracted to the guide rail 11 side.

In the above configuration, when taking out a desired electronic component from the component supply section 2 and mounting it on a predetermined position on the board 4, the rad 6 is moved along the moving path 10 to the supply of one of the movable bodies 7 to pick up the desired electronic component. is moved toward the taping cassette 1 containing the electronic component, and when it is positioned corresponding to a predetermined taping cassette 1, it is stopped, and the desired electronic component is adsorbed by the rad 6 and taken out. At this time, when the other moving body 7 is attracted, the rad 6 moves on the moving path 10 toward the electronic component mounting position of the board 4 in the moving direction of the moving body 7, and at the same time, the board 4 is moved by the board moving device 5 to the electronic component mounting position. The mounting position is the movement path 10
When the electronic components are moved upward and stopped at predetermined positions, the electronic components that were previously suctioned by the suction head 6 are mounted on the substrate 4 at the predetermined positions. Note that when the electronic component is taken out by the suction rod 6, the feeding device 9 also moves in conjunction with the suction head 6 to be positioned corresponding to the taping cassette 1, and after the electronic component is taken out, the tape-like member of the taping cassette 1 is removed. is sent out one pitch.

When the electronic component has been taken out and mounted on the board, the suction head 6 that has suctioned the electronic component moves to the other in order to mount the electronic component, and the suction head 6 that has finished mounting the electronic component to take out the next electronic component. Although they move in opposite directions, they interfere with each other because they move on the same moving path 10. In the interference section, the driving means 20 operates and the operating bar 19 moves toward the guide rail 11. As a result, the swinging body 16 swings toward the guide rail 11, and the suction rod 6 moves from the first position on the moving path 10 to the second position, thereby avoiding interference with each other. After passing through the interference zone, the operating bar 19 returns to its original position, and the suction head 6 moves on the moving path 10 again. After that, by repeating the above operation, the moving body 7
Electronic components can be mounted at predetermined positions on the board 4 every half stroke.

Incidentally, in the above embodiment, an example was shown in which the swinging body 16 was used as a structure for moving the rad 6 to the suction body 7, but the suction head was attached to the movable body so as to be movable in a straight line, and a cam rail etc. It may be moved using a motor or an appropriate driving means such as a motor or a Tsuremade. Further, although an example is shown in which the rad 6 is moved to both suctions of the pair of movable bodies 7, it is also possible to move only the rad 6 to one of the suctions. moreover,
The present invention is not limited to a pair of moving bodies, and for example, three or more moving bodies may be used.

Effects of the Invention According to the electronic component mounting apparatus of the present invention, as described above, it is possible to efficiently mount electronic components from a taping cassette onto a board using a plurality of suction heads at high speed. Moreover, by appropriately moving the suction heads to the second position during the movement of the movable body, it is possible to prevent the suction heads from interfering with each other. It has the advantage that it can be positioned on the route and the position of the substrate etc. can be easily controlled.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a schematic configuration of an embodiment of the present invention, FIG. 2 is a perspective view of the main parts, and FIG. 3 is a perspective view of the overall appearance. 1... Taping cassette 3... Parts removal position 4... Substrate 6... Suction head 7... Moving body 10... Movement route.

Claims (1)

[Claims] Taping cassettes each holding a tape-like member containing a large number of electronic components are arranged in parallel, and the taping cassettes are moved along different paths between the component extraction position of each taping cassette and the board on which the electronic components are mounted in the parallel direction. A plurality of moving bodies are provided, each moving body is provided with a suction head for taking out the electronic component from the tape-like member and mounting it on the board, and the suction head is moved in two directions perpendicular to the moving direction of the moving body. The suction heads are attached to a movable body so as to be movable between positions, and when the suction heads are in the first position, they are located on the same movement path, and when they are in the second position, they are located on different movement paths that do not interfere with each other. An electronic component mounting device characterized by: