JPS6238764A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To execuate continuously a work, and to improve the productivity by pressing a soldering part to which a cream solder is applied through an applying mechanism which is placed in the vicinity of the soldering part, against the soldering part together with a heating means by using a moving mechanism. CONSTITUTION:A rectangular word 22 is placed on a pan 20, and a printed board 76 is placed fixedly on a slide table 74. A cream solder 43 is supplied to rotation bite parts of rollers 41, 42, and they are advanced to the lower direction of the pan. A piston rod 54 of a cylinder 53 is made to descend and the whole heating head 50 is made to descend, by which the word 22 descends against a spring mechanism 17 and also the cream solder 43 on the roller 42 is applied through a pin 22a. Subsequently, the work 22 is made to ascend by a nozzle 63, and thereafter, the printed board 76 is placed fixedly in its lower part, also the work 22 is positioned, both 22, 29 are pressed and heated by the heating head 50, and soldering is executed. In such a way, soldering can be executed with an excellent productivity.

Description

[Detailed description of the invention] [Industrial application field]
[Is the present invention applicable to soldering parts such as electronic parts? This article relates to an automatic soldering device that selectively solders parts to be soldered such as printed boards.

[Conventional technology]

In recent years, electronic components have improved in performance and become smaller.
?朋”“猷”0°6°°2”5! Ri-6i%? [+7)
1. Flat package type electronic components have been developed. When mounting such an electronic component on a printed board, in the case of a conventional through-hole type, it is necessary to apply a metal pattern for soldering around the periphery of each bottle hole, and there is a gap between the holes, for example. Since a space of 2.5 mm or more is required, all of these should be used.

I can't do it.

Therefore, the printed circuit board on which all electronic components of this type of flat package are attached is non-perforated, and has a connection pattern of nine parallels corresponding to the many pins protruding radially from the four circumferences of the electronic components. Therefore, there is a need for a soldering device that can efficiently solder these types of electronic components onto printed circuit boards.89 The following devices have been developed and put into practical use. There is.

In other words, a soldering robot is placed above a flint plate fixed to a ring on the table, and electronic parts are gripped by the hands of this robot? After positioning and applying it to the connection pattern part of the flint board, apply electric heat, infrared rays, laser beam, etc. to the bottle part of this electronic component? During the irradiation, the solder that had been attached to the connection pattern of the printed board and the bottle of electronic components in advance was temporarily dissolved. It is something that connects.

[Problem that the invention seeks to solve]

However, due to the force, in such conventional soldering equipment, the positioning means and heating means, the cream solder supply mechanism attached to this, the mounting mechanism on the printed board, etc. are complicated and the installation cost is high. However, the heating method for melting solder involves scanning in the direction of the alignment of the pins of electronic components, which requires a long time to work. However, there was a problem in that it was difficult to expect satisfactory results and high productivity. Furthermore, the above conventional VC placement may be advantageous when all similar flat package type electronic components are soldered to a single flint board, or because there are many printed board insertion parts such as insertion type resistors. When there are few parts, the solder dipping method is used for all printed wiring boards in the molten solder bath1'
The above electronic parts? Since it is not possible to solder both the top and bottom sides of the printed circuit board, the above-mentioned equipment currently requires manual soldering, which is problematic in terms of productivity.

[Elaborate means to solve problems]

In order to solve these problems, in the present invention, a cream solder application mechanism consisting of an application roller and means for advancing and retracting the application roller is disposed in a position close to the bottom of the soldering part supported by a support stand. Above the soldering parts, a heating head is provided via a stand for mounting the parts to be soldered, which is moved horizontally back and forth. , a support stand that is reciprocated and driven in the distance direction relative to the soldering component, and a support stand that is elastically supported by this support stand, holds the n1 soldering part 1 in a removable manner, and moves back and forth with the support stand. A clamping means presses the soldering part and the part to be soldered, and a clamp means is supported by a support stand and reciprocates with the soldering part, and at the lowering limit position of the support stand, the soldering part of the soldering part ta cloth crawler side is moved to the soldering part. It consists of a heating member that presses against the parts.

[Function] With this configuration, the applicator roller is brought close to the soldering component placed on the support stand, descends, and then the clamping means of the heating head brings the soldered part of the soldering component into contact with the applicator roller. As the cream solder adheres to the soldered parts, the soldered parts are all held by the clamping means and raised, and then the parts holder moves all the soldered parts mounted on the stand below the parts. When the clamping means and the heating means are lowered and pressed against the soldered part, the cream solder is melted. So what about clamping means and heating means? While raising it, wait for the cream solder to solidify, then move the parts holder back and remove the parts.

〔Example〕

1 to 4 show all the embodiments of the automatic soldering device according to the present invention, FIG. 1 is a front view of the entire device, FIG. 2 is a side view thereof, and FIG. 3 is an A of FIG. 1. Enlarged side view, 4th
The figure is a front view from B in Fig. 3, Fig. 5 is a CC sectional view in Fig. 3, Fig. 6 is a front view of the cream solder applicator, Fig. 7 is a DD sectional view in Fig. 6, and Fig. 8 Similarly, FIG. 9 is an enlarged front view of the application section, and FIG. 9 is a longitudinal sectional view of the heating head.

In the figure, on the front half of the base plate 1 formed in a rectangular shape, there is a cream powder coating device 10, which will be described later.
is mounted with the main part covered by a cover 2, and in the center part above the pace grate 1, the cover 2 = 9 is formed in a U-shape in cross section and extends high upwards, and there is a heating head which will be described later. 50t - Heating head frame 3 that supports vertical movement automatically
The board is fully bolted and stands vertically in contact with the rear of the cover 2. Further, at the rear of the pace plate 1, at the same height as the heating head claim 3, a control box 4, in which a control device is housed, is fixed to the left and right legs 57 of the pace plate 1 and stands upright. An operation panel 6 equipped with various switches and gauges is mounted on the front side. Reference numeral 1 denotes a cover that covers three sides of the heating head 50, and a start switch 8 for starting the entire apparatus is mounted on the front inclined surface of the coating apparatus cover 2.

Therefore, the cream solder applicator, which is generally indicated by the reference numeral 10, will be explained based mainly on FIGS. 6 and 7. On the pace plate 1, there is a device 1 formed in a rectangular shape.
The base plates 11 for 0 are stacked and bolted together, and above the pace plate 11, a rectangular slide table 12 parallel to the base plate 11 is mounted on a column 13 on the value side fixed to the base plate 11. It is supported and constructed. Bearings 14 and 15 are fitted concentrically into the upper and lower slide tables 12 and the base plate 11.
'LfC, (b) Upper and lower small diameter parts 16a, 16 of the moving shaft 16
b are pivoted so that they can rotate and move up and down 9, and a large diameter fB that is formed short and short to enable up and down movement.
Between the lower end of 16c and the base plate 11,
A compression coil spring 17 is interposed between the stepped portion t and the slide table 12 to urge the rotating shaft 11 upward. 18 is a large diameter portion 16c of the rotating shaft 16. Two chamfered portions 18a having different heights in four orthogonal directions are fitted with the GC.
A key 19 fixed to the rotation shaft 164IA+1 is fitted into a key groove 18c extending along its entire length, and the rotation shaft 16 rotates in one direction. It is configured to allow vertical movement. A receiving shaft 21 with a removable receiving plate 20 is fitted into the shaft hole bored in the upper end of the rotating shaft 16 and is fixed with a screw. As shown in Fig. 8, a flat package type electronic component 22 (hereinafter referred to as the work 22) is placed, which is formed into a rectangular shape in plan view and has a large number of pins 22a to 22f that protrude radially from four holes. . On the other hand, 1 of the base plate 11
A lamp and rotation cylinder 24 is swingably supported by a pivot shaft 23 installed in a corner, and a U-shaped cylinder 7 is formed at the working end of the piston rod 25 and has a threaded part. ′
The Cc & end ends 26 are screwed together and fixed with nuts. 2γ is an arm integrally formed with the rotor 18, and is pivotally attached to the tip of the rod end 26 via a pin 28, and the rotary cylinder 2 is rotated from the state shown in FIG.
When the piston rod 25 of No. 4 retreats, the U:B mover 18 rotates 90' via the arm 2Tt-. The workpiece 2 is rotated through the rotating shaft 16.
2 also rotates 90'. Note that in the illustrated state, a positioning stopper 41, which will be described later, is in contact with the chamfered portion 18a, and the rotation of the rotor 1B is restricted by 1t, but in reality, the positioning stopper i4T is moved away from the chamfered portion 18a. Rotate when 1
Since the cylinder 24 operates, the rotor 180 turns
It does not interfere with 1. 29 is base plate 1
1. The L fitting screwed to 1 supports a stopper 30 that can be adjusted forward and backward with a bolt.
[The rotation of the rotator 18 is restricted at the position shown in the figure.
First, the mechanism for applying cream solder to the workpiece 22 will be explained. In this example, FIG.
As shown in 1, they have the same configuration and are formed symmetrically to each other. m. □ Engineering 31Ai11116,
2112, one sea lion is arranged on both its left and right sides, and gears, rollers, etc. are not shown in the coating mechanism 31 on the left side.
There is 1. Each application mechanism 31 is connected to the slide table.
; It slides on □ 12 in the distance direction with respect to the rotating wheel 16 (:: It is equipped with a drive plate 32 formed to be freely movable,
This drive plate 32 has a vertically long rectangular shape.
:; Bracket 33 is fixed. A small gear 34 is pivotally mounted on the bracket 33 and rotates in the direction indicated by an arrow E in the figure by being driven by a drive device (not shown). A dog gear 36, which rotates coaxially with the small gear 34, meshes with another small gear 3T which is pivoted on the bracket 33, and further meshes with a small gear 38 which is pivoted on the small gear 37U and the bracket 33. They mesh together. And large gear 35
The shaft 39 of the small gear 38 and the shaft 40 of the small gear 38 are located at the same height, and the shafts 39 and 40 of the small gear 38 have the same diameter.
A pair of rollers 41, 42 having the same structure are integrally provided with the gear 35, 38 with a sufficient gap between the two surfaces, and as is clear from the meshing of the gears 34-38, the roller 41 and The roller 42 and the roller 42 are rotated in the same direction as shown by the arrow 1'', G, in the direction of the biting side? In this way, a predetermined amount of cream solder 43 is supplied to an unillustrated supply device to the upper injection portion of both rollers 41 and 42, which rotate in opposite directions due to the speed difference. When the rollers 41 and 42 rotate, the cream solder 43 passes through the gap and adheres to the surface of the high-speed roller 42 as a film. The coating mechanism 31 is provided with advancing and retreating means for moving them back and forth in opposite directions.
The left and right ends of the slide table 12 extend downwardly in the front and back direction, and are connected to the front ends of the left and right horizontal members 32a and 32b shown in FIG. 7 by a floating cylinder 44. This bloating cylinder 44 has its cylinder 44a bolted to one horizontal member 32a, and a pin 4 attached to a U-shaped fitting 45.
Piston rod 4 is pivoted to allow automatic rocking at 6.
The working end of 4b is fixed to the other horizontal member 32b. With this configuration, engineering 9 and boat 4
Pressure fluid from 4c to head end side? When the piston rod 44b is fed in, the piston rod 44b moves forward and the cylinder 44a moves back by the same amount at the same time, causing the left and right coating mechanisms 31 to move away from the rotation shaft 16. When the pressure fluid is fully supplied to the cylinder 44, the piston rod 44b retreats and the cylinder 44
The forward movement of a is performed by the same amount at the same time, and the left and right application mechanisms 31 move in the direction closer to the rotating shaft 16, respectively.

At the rear ends of the left and right horizontal members 32a and 32b, a head bolt-shaped stopper 4γ is attached to the floating cylinder 44.
The end face of the head abuts against the chamfered portion 18a of the rotator 18, and the forward limit of the coating mechanism 31 is regulated. The radius of the chamfered portion 18a and the chamfered portion 18b differs because of the intersection corresponding to the long side and short side of the workpiece 22. Furthermore, stoppers 48 are provided at both left and right ends of the slide table 12, and are configured to fully restrict the retraction of the application mechanism 31 when the drive plate 32 is brought into full contact.

Then, the left and right application mechanisms 31 move forward and the left and right rollers 4
2, the receiver is close to the shaft 21, and in the next state, the workpiece 22? When the pin 22a of the rainbow work 22 is pressed down, it comes into contact with the rotating roller 42, and the cream solder 43 on the curved surface touches the pin 22.
Although the workpiece 22 is coated with K, a means for pushing down the workpiece 22 is attached to the heating head 5a side, which will be described below.

Brackets 51 with holes above and below are fixed to the side surface of the heating head frame 3, which supports the entire heating head, and are generally designated by the reference numeral 50.
52 supports a cylinder 53 for raising and lowering the heating head.
A horizontally long rectangular slide plate 56 with a diagonal recess 1856 atlV shown in FIG. ing. On the other hand, a guide plate 57 formed in a strip shape is fixed to the heating head frame 3 side, and is configured to fit into a groove 56a of the slide plate 56 to guide the vertical movement of the slide plate 56. ing. Reference numeral 58 denotes a support metal fitting formed in a 27-shaped cross section and bolted to the slide plate 56. The heating head 50 is assembled as a whole by bolting to the upper end face of the support metal fitting 58. ? The piston rod 54 of the cylinder 53 is guided by a guide plate 57 and moved up and down as the piston rod 54 of the cylinder 53 moves forward and backward.

The upper plate 5B is formed into a rectangular shape in plan view, extends upward from the saucer 20, and is connected to the lower lower plate 60 by a plurality of stays 61. A support base 62 is formed by the plates 59 and 60 and the stay 61. 63 is the upper and lower plate 5
9,600 A nozzle for sucking a workpiece is fitted into a bearing hole and supported vertically movably on a support stand 62, and a lower suction end 62a'c is placed opposite the workpiece 22 and is placed in the same position as the bearing shaft 21. Between the upper plate 59 and a collar 64 extending in a core shape and fixed to the nozzle 63 above the lower plate 60, there is a compression coil spring 65 that biases the nozzle 63' downward. It is mounted on top. Then, as the support base 62 descends, the nozzle 63 descends and presses the workpiece 22t downward.
The second bottle 22a is pressed against the roller 42, and the cream solder 43 on the circumferential surface of the roller 42 is applied to the bottle 22a. Further, a plug 66 connected to an air source (not shown) through an open flexible vacuum tube is screwed into the end of the nozzle 63, and the workpiece 22t after applying the cream solder is sucked at the suction end 63a. It is configured to be pulled up. Further, below the lower plate 60, a block mounting plate 67 is provided.
is fixed to the lower plate 60 and supported by a plurality of guide pins 68 so as to be movable up and down, and on each guide pin 68 is a compression coil spring 69 that urges the block mounting plate 67 downward. It is interposed between the lower plate 60 and the lower plate 60. TO has a nozzle 63 on the bottom surface of the block mounting plate 67.
The hot block is completely enclosed by a bolt-tightened hot block and has a built-in heater 71 connected to a heat source, and a protruding part at the lower end of the block is formed into a rectangular shape corresponding to the workpiece 22 and has a trowel. A hot ram 72 as a tip is screwed so as to surround the nozzle 63.

On the other hand, on the device frame side, a cylinder 73 for moving the slide table is supported horizontally, and a slide table T4 supported movably in the horizontal direction by a guide table is fixed to the working end of the piston rod. has been done. On this slide table 74, a printed board T6 as a component to be soldered is positioned by a mounting jig T5, and the suction port * 63 of the nozzle 63 is raised by the reciprocating movement of the slide table T4. It is configured to enter the space between the workpiece 22 and the workpiece 22, and then exit from the space.

The automatic soldering apparatus constructed as described above will be explained based on the operation timing chart shown in FIG. 10 and the above-mentioned figures. First, a rectangular workpiece 22 is placed horizontally on the descending saucer 20 with its long side extending in the left-right direction in FIG. After 76t, a-
Cream solder 43t- to the rotating injection part of 41°42
When the roller 41.42t is supplied and rotated, the cream solder 43 is deposited on the circumferential surface 1 of the roller 42 which is faster due to the rotation direction and speed difference, resulting in a floaty 2'/I)7f44°. 7
)"m 7)-, 11, send all the caps into the left and right m cloth mechanism 31t - below the saucer 2o
: Move forward to the closest position. This forward position is regulated by the stopper 47 coming into contact with the chamfered portion 47b of the moving element 16.

Therefore, when the piston rod 54'fr of the cylinder 53 is lowered, the entire heating head 50 is lowered, and the suction end 63a of the nozzle 63 comes into contact with the workpiece 22.
; Force 1 causes rotation shaft 16 to compress compression coil spring 17 2>f6TRL? Wow, □20t? :/22a i>E
. -2142, the cream hand 1:da 43 of the roller 42 is transferred and applied to the bottle 22a on the short side. After coating, when pressure fluid is fed to the helad end side of the floating cylinder 44, the coating mechanism 31 retreats and the drive plate 32 comes into contact with the stopper 48 and stops. Therefore, after raising the heating head 50, when the piston 25i of the swing cylinder 24 is moved forward, the arm 27? Through this, the rotator 18 is rotated 90° to the illustrated position, and the workpiece 22 is oriented vertically with its short side extending in the left-right direction in FIGS. 6, 8, and 9.

Therefore, the process of advancing the coating mechanism 31 and lowering the heating head 50 is repeated 2 times to apply the pins 22a on the long side of the workpiece 22.
Apply Cream No. 43 to the skin.

In this case, the forward position & of the application mechanism 31 is equal to
is regulated by coming into contact with the other chamfered portion 18a of the rotor 1, so that the position of the screw 22a can be made to correspond to the position of the roller 42.

After applying it to Cream No Nda 43 in this way,
While the nozzle 63 is pressing the workpiece 22, the plug 5
When all the air in the nozzle 63 is suctioned through the nozzle 6, the workpiece 22 is attracted to the suction end 63a, so the nozzle 63 holds the workpiece 22' and then the heating head 50 is completely raised. During this rise, move forward with the piston rod of cylinder T3,
The printed board γ6 is placed below the workpiece 22 held by the nozzle 63 and is moved forward by the slide table 74t, while at the same time the rotor 18 is reversed by 90 degrees to the original position to turn the workpiece 22 sideways.

Then, when the heating head 50 is completely lowered, first the workpiece 2
2 hits the printed circuit board 76 and restricts the nozzle 63 from descending. Therefore, when the heating head 50 descends, the support base 62, hot block 70, etc. descend while fully compressing the compression coil spring 65. Continuing, the nozzle 63 is pressed against the workpiece 22 by the elastic force of the compression coil spring 65. Then, after the hot ram T2 comes into contact with the printed board T6, only the support base 62 is lowered and the compression coil spring 69''t-
The hot ram 72 is compressed and pressed by the elastic force of the compression coil spring 69 against the soldering pattern portion of the printed board γ6 on the entire area to which the cream solder 43 of the F-work 22 is applied. Then, the cream solder 43 is melted and soaked into the pattern portion, and the workpiece 22 is soldered to the printed board γ6. At this time, the solder surface of the workpiece 22 and the solder surface of the printed board T6 uniformly sandwich the cream solder 43, and heat is transferred to the printed board 76.

When the cream solder 43 is sufficiently melted, turn on the heating head 5 at the 9th point.
When Qi is raised, the support base 62 is first raised, contrary to when lowered.
After the hot ram 72 rises, the hot ram 72 continues to rise and separates from the printed board γ6.

Subsequently, the nozzle 63 separates from the workpiece 22, but before that, the heating head 50 is completely stopped from rising, and the nozzle 63 holds the workpiece 22 completely, waiting for the fci\cream solder 43 to solidify. .

During this time, if all the air is sucked from the suction end 63& and kept at 91\, the influence of high temperature during soldering will be less likely to occur due to the force exerted due to the air cooling effect. However, the heating head 50 does not necessarily need to be stopped at the end of the solder solidification stage, but may be raised gradually to solidify the solder. After the cream solder 43 solidifies, the heating head 50 is raised to its upper limit and the workpiece 22 is held by the nozzle 63. After folding, the slide table 74 is removed from the soldering position, and the entire soldered plate γ6 is removed from the slide table 74.
The cycle is complete. Note that when the nozzle 63 is raised after the solder solidifies, the suction air is normally turned off, but if the printed board 74 is sufficiently heavy or the solder is sufficiently solidified, the suction air may not be turned off. Work.

However, the elasticity value of the compression coil spring 69 that maintains the entire elasticity of the heated portion is determined depending on the size and shape of the workpiece 22, but it may not be provided depending on the case.

FIG. 11 shows the self-made soldering device 1 according to the present invention, in which parts have already been soldered and parts are soldered from a printed board.
An operation timing sheet i when used for removal preparation is shown. In this case, first, the parts are soldered and then the slide cheese luer 4 held on the printed board 76' is advanced to the lower position of the nozzle 63 shown in FIG.
2) As in the case of soldering, the hot ram 72t is lowered to the lower limit and pressed against the soldering part of the workpiece 220 to melt the solder. And nozzle 6
3, the heating head 50 is sucked and held completely on the workpiece 22.
? Slide table 74t-nozzle 6 that holds the printed board 76 whose parts have been removed after being raised to the upper limit.
3. Move it horizontally so as to remove it from the position directly below it. In this state, the nozzle 63 is held vertically on the workpiece 22', and the saucer 20 is horizontally oriented.
Rotate it 90 degrees to make it vertical. Subsequently, by lowering the heating head 50' and completely stopping the suction by the nozzle 63, the workpiece 22 is released from the holding and placed on the tray 20. And the heating head 50 is completely raised above the workpiece 22? After opening, the workpiece 22 is removed and the saucer 20 is turned sideways for preparation for the next time.Step 9 The work of removing the workpiece 22 is completed.

In addition, in this embodiment, the workpiece 22'': C is placed on the saucer 20.
The workpiece 22 is formed by forming the bearing shaft 21 etc. of the machining shaft so as to be rotatable.
An example of rotating while rising? However, depending on the shape of the soldering parts, it is not necessarily necessary to rotate the parts all the way, and the cream solder 43 application mechanism 31 may be provided with only one set of these depending on the specifications of the workpiece 22. Further, in this embodiment, seven nozzles 63 are shown as the clamping means for holding the workpiece 22, but a chuck-type clamping means may also be used, for example.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, an automatic soldering device uses a coating roller and a means for driving it to move back and forth, and a paste is placed in a position close to the bottom of the parts to be soldered, supported by a support stand. A component holder for mounting parts to be soldered, which is driven horizontally above the soldering parts, is equipped with a soldering mechanism, and the heating head is fully operated by the platform. - A support base that is reciprocated in the direction of distance from and near the part to be soldered, and a support base that is elastically supported by this support base, holds all the parts to be soldered in a removable manner, moves reciprocatingly with the support base, and is soldered at the lowering limit position of the support base. A clamp means for pressing the component against the soldering component, and a clamping means supported by a support base and reciprocating with the clamp means to press the soldering part of the soldering component against the applicator roller and the soldering component at the lowering limit position of the support base. It has a simple structure consisting of a heating member and a heating member, and it can perform everything from applying cream solder to parts to soldering to printed boards in a continuous manner, greatly increasing productivity compared to conventional equipment. It is possible to improve the performance and reduce equipment costs. In addition, it is possible to solder flat-packaged electronic components that have many leads and a narrow pitch of 0.6 mm without causing solder bridging, and in a short time and with ease. Since other parts can be mounted on the next printed board by soldering on both the top and bottom sides, the range of applications is extremely wide and the effect is great.

[Brief explanation of the drawing]

FIGS. 1 to 11 show an embodiment of an automatic soldering device according to the present invention. J#:tThe overall plan view, Figure 2 is a side view, Figure 3 is an enlarged side view from A in Figure 1, Figure 4 is a front view from B in Figure 3, and Figure 5 is a side view. 3 is a CC sectional view, FIG. 6 is a front view of the cream solder coating device, FIG. 7 is a DD sectional view of FIG. Longitudinal sectional view, 1st
Fig. 0 is an operation timing chart for soldering, and Fig. 11 is an operation timing chart for removing soldered parts. 3...Fist/Karonetsu head frame, 10...Kai cream solder applicator, 16...Rotation axis, 2011...
・Saucer, 21... Bearing shaft, 22... Work, 41
, 42...roller, 43...cream solder,
44...Floaty''//VIJ7'・50°
°°°add'lI&″y de・53°
[1...Cylinder, 62...Support stand, 63...
1... Nozzle, 65... Compression coil spring, 72 I... Hot ram, No. 74 φ slide tee
f. Pull, 76...Printed board.
: “Patent applicant Yamatake Honeywell Co., Ltd.
1('',' Agent Masaki Yamakawa (and 2 others)'l □4 1: 1; Figure 3 Figure 4 Figure 5 Figure 8 η Figure 9 Figure 11

Claims (1)

[Claims] A support stand that is supported on the device frame side and supports the soldering part at the upper end, an applicator roller whose peripheral surface is supplied with cream solder and is driven to rotate, and this applicator roller is placed close to the bottom of the soldering part of the soldering part. A cream solder application mechanism equipped with an advance/retreat drive means for advancing and retracting from a position, and a heating head disposed above the soldering component via a component holder that is mounted with a component to be soldered and is driven horizontally to advance and retreat. and a support base for supporting the heating head on a device frame side and reciprocating vertically in a direction toward and away from the soldering component;
This support table and the soldering part elastically supported by the support table reciprocate with the support table while reciprocating with the support table, and move the soldering part to the applicator roller side and the soldering part. The heating member is configured to include a clamp means for pressing the component, and a heating member supported by the support base and reciprocated together with the support base to press the soldering part of the soldering component against the component to be soldered at the lowering limit position of the support base. An automatic soldering device characterized by: