JPS623892A - Work supporting equipment for thermal cutting machine - Google Patents
Work supporting equipment for thermal cutting machineInfo
- Publication number
- JPS623892A JPS623892A JP60140293A JP14029385A JPS623892A JP S623892 A JPS623892 A JP S623892A JP 60140293 A JP60140293 A JP 60140293A JP 14029385 A JP14029385 A JP 14029385A JP S623892 A JPS623892 A JP S623892A
- Authority
- JP
- Japan
- Prior art keywords
- support
- pin
- cutting
- laser
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 41
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、熱切断加工機のワーク支持装置に関し、レ
ーザご−ムにより鋼材切断のような熱切断加工機におい
て、ワーク支持装置の耐久性の維持を図るものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a workpiece support device for a thermal cutting machine, and the durability of the workpiece support device is improved in a thermal cutting machine such as a laser beam for cutting steel materials. The aim is to maintain the
熱切断加工機において、ワークを支持するために、針状
の支持ビン群を設ける形態としている。In a thermal cutting machine, a group of needle-shaped support bottles is provided to support a workpiece.
このような支持ビンＢＹによりワーク下面を支持する形
態であっても、切断加工中にレーザビームの如き切断熱
、ビームが、ワーク下側の支持ビンに、２作用すると、
この支持ビンの先端が損傷し易い。Even with such a configuration in which the lower surface of the workpiece is supported by the support bin BY, if cutting heat or beam such as a laser beam acts on the support bin on the lower side of the workpiece during cutting,
The tip of this support bottle is easily damaged.
その都度この支持ビンの交換を行うことが必要である。It is necessary to replace this support bin each time.
この発明は、このような欠陥を解消するものである。This invention eliminates these deficiencies.
この発明は、次のような技術的手段を講じる。 This invention takes the following technical measures.
即ち、熱切断加工を受けるワークを下方から支持する支
持ビンを多数配設した支持ビン群を設ける。That is, a support bin group is provided in which a large number of support bins are arranged to support the workpiece to be thermally cut from below.
この支持ビン群のうち、熱切断装置の切断加工移動に合
せて、この切断加工位置下の支持ビンを適方へ退避すべ
く設けてなる熱切断加工機のワーク支持装置の構成とす
る。The workpiece support device of the thermal cutting machine is configured such that among the group of support bins, the support bins below the cutting position are evacuated to an appropriate position in accordance with the movement of the thermal cutting device during the cutting process.
支持ビンの立並ぶ支持ピン群上にワークを支持させて、
このワーク上方からレーザど−ムの如き熱切断装置によ
る熱切断作用を行わせる。ワークに対する熱切断作用の
移動に伴って、この熱切断装置の切断位置直下の支持ビ
ンが退避し、それ以外の部分の支持ビン群はそのま）の
ワークの支持姿勢を保つ。The workpiece is supported on a group of support pins lined with support bins,
A thermal cutting action is performed from above the work using a thermal cutting device such as a laser beam. As the thermal cutting action moves on the workpiece, the support bins directly below the cutting position of this thermal cutting device are retracted, and the other support bins maintain the same support posture for the workpiece.
このため、熱切断装置による切断位置直下には、直接支
持ビンがワーク下面に接していないために、ワーク切断
時の加工熱が支持ビンを加熱するごとがない。従って、
支持ピンの損傷等を受は難く、耐久性を高めることがで
きる。しから、ワークを支持する姿勢から退避する支持
ピンは、直接切断加工熱の作用される熱切断装置と対向
する部分近傍のみであり、他の部分は支持ピンで支持さ
れて安定的である。Therefore, since the support bin is not in direct contact with the lower surface of the work directly below the cutting position by the thermal cutting device, there is no possibility that the processing heat during cutting the workpiece heats the support bin. Therefore,
The support pin is less likely to be damaged, and its durability can be increased. Therefore, the support pin that retreats from the position of supporting the workpiece is only in the vicinity of the part facing the thermal cutting device to which cutting heat is directly applied, and the other parts are supported stably by the support pin.
いて、ワークである板金を支持する支持装置を示・ず。The supporting device that supports the sheet metal workpiece is not shown.
熱切断加工装置は、ワーク１を支持する支持ピン３を配
設した基台７と、レーザビームを作用させるための熱切
断装置５を取付【プて前後方向及び左右横方向等に自由
に移動できる取付台９等を設ける。The thermal cutting processing device is equipped with a base 7 on which support pins 3 are arranged to support the workpiece 1, and a thermal cutting device 5 for applying a laser beam. Provide a mounting base 9 etc. that can be used.
支持ピン３は、基台７の左右方向幅に亘るビンホルダ１
１に沿って一定間隔に配設する。各支持ピン３の形態は
上端を尖らせた針状にしている。The support pin 3 supports the bottle holder 1 over the width of the base 7 in the left and right direction.
1 at regular intervals. Each support pin 3 has a needle shape with a sharpened upper end.
ビンホルダ１１の左右両部には、前後方向の支持アーム
１３が固着される。この支持アーム１３の後端は、基台
７上の支柱１５に上下方向へ回動自在にしてビン１７で
枢着される。又、この支持アーム１３の前端は、基台７
上の案内軸１つに沿って上下動自在に嵌合案内し、ばね
２１で常時上端位置のストッパー２３に弾発させている
。このような形態にしてビンホルダ１１を前後方向に一
定の間隔で設ける。Support arms 13 in the front and rear direction are fixed to both the left and right sides of the bottle holder 11 . The rear end of this support arm 13 is pivoted to a column 15 on the base 7 with a pin 17 so as to be vertically rotatable. Further, the front end of this support arm 13 is connected to the base 7.
It is fitted and guided so as to be vertically movable along one upper guide shaft, and is always urged against a stopper 23 at the upper end position by a spring 21. In this configuration, the bottle holders 11 are provided at regular intervals in the front-rear direction.
各ストッパー２３に係止されたときの支持ピン３の先端
部は、水平面上り揃っており、上端にワーク１の下面を
均一に支持する構成とする。The tips of the support pins 3 when locked to each stopper 23 are aligned on the horizontal plane, and the lower surface of the workpiece 1 is uniformly supported at the upper end.
基台７の左右両側には、前後方向の支持レール２５を設
ける。この支持レール２５には、前後方向に移動自在の
前後移動台２７の支脚部２９を支持させる。この前後移
動台２７の前後方向（Ｘ）の移動は、基台アの一側に設
けたモータ４９によって回転される螺旋軸３３に螺合さ
れて案内される。この前後移動台２７上には、取付台９
を方向（Ｙ）へ移動自在に案内させて、モータ３５によ
って回転される螺旋軸３７に螺合させている。これら螺
旋軸３３による前後移動台２７と、螺旋軸３７による取
付台９とによって、この取付台９は、基台７上の水平面
に沿って前後左右の方向へ自由に移動制御できる。Support rails 25 in the front and rear directions are provided on both left and right sides of the base 7. This support rail 25 supports a support leg 29 of a back-and-forth moving table 27 that is freely movable in the front-back direction. The movement of the back-and-forth moving table 27 in the back-and-forth direction (X) is guided by being threaded onto a helical shaft 33 rotated by a motor 49 provided on one side of the base. On this back and forth moving table 27, a mounting table 9 is mounted.
is guided movably in the direction (Y) and is screwed onto a helical shaft 37 rotated by a motor 35. By means of the back-and-forth movable table 27 formed by the helical shaft 33 and the mount 9 formed by the helical shaft 37, the mount 9 can be freely controlled to move forward and backward and left and right along the horizontal plane on the base 7.
この取付台９には、熱切断装置５の一部であるシー１１
ビームを照射するレーザヘッド３９を取付けている。こ
のレーザヘッド３９は、取付台９に取付ける筒体部４１
内に集光レンズ４３を設け、上端には反射ミラー４５を
有し、下端にはノズル４７を設けている。又、この取付
台９には、該レーザヘッド３つにレーザビームを案内す
るためのレーザ案内筒５１を左右方向に向けて伸縮自在
に設けている。This mounting base 9 has a seat 11 which is a part of the thermal cutting device 5.
A laser head 39 for emitting a beam is attached. This laser head 39 has a cylindrical body portion 41 that is attached to the mounting base 9.
A condensing lens 43 is provided inside, a reflecting mirror 45 is provided at the upper end, and a nozzle 47 is provided at the lower end. Further, a laser guide tube 51 for guiding a laser beam to the three laser heads is provided on the mounting base 9 so as to be extendable and retractable in the left-right direction.
前記前後移動台２７の支脚部２９には、該レーザヘッド
３９と対向し下方へ突出するカム５３を設け、このカム
５３の移動位置と対向して、各ビンホルダ１１の左右端
部にはロール５５を設けている。前後移動台２７と共に
このカム５３が前後方向（×）へ移動してロール５５が
押下げられると、このアーム１３がばね２１に抗して下
動し、この部分の支持ピン３が下動される関係に設定さ
れている。A cam 53 that faces the laser head 39 and protrudes downward is provided on the support leg 29 of the back-and-forth movable table 27, and rolls 55 are provided at the left and right ends of each bottle holder 11, facing the moving position of the cam 53. has been established. When this cam 53 moves in the front-back direction (x) together with the back-and-forth moving table 27 and the roll 55 is pushed down, this arm 13 moves down against the spring 21, and the support pin 3 in this part moves down. The relationship is set as follows.
レーザ発信器５７が基台７の一側方に設けられている。A laser transmitter 57 is provided on one side of the base 7.
このレーザ発信器５７から支持レール２５と平行にレー
ザビームを案内するレーザ案内筒５９を設ける。このレ
ーザ案内筒５９の内部には、前記取付台９とレーザ案内
筒５１を、前後方向と左右方向とに移動自在に設ける。A laser guide tube 59 is provided to guide the laser beam from the laser transmitter 57 in parallel to the support rail 25. Inside the laser guide tube 59, the mounting base 9 and the laser guide tube 51 are provided so as to be movable in the front-rear direction and the left-right direction.
又、このレーザ案内筒５９内部には、レーザ発信器５７
から発信されるレーザビームを前記−レーザヘッド３９
の反射ミラー４５へ反射させる反射ミラー６１を設ける
。この反射ミラー６１は、該レーザ案内筒５１と共に前
後方向へのみ移動自在であるが、このレーザ案内筒５１
の左右方向の移動によっては移動できない構成である。Also, inside this laser guide cylinder 59, a laser transmitter 57 is installed.
The laser beam emitted from the laser head 39
A reflecting mirror 61 is provided to reflect the light onto the reflecting mirror 45 of the above. This reflecting mirror 61 is movable only in the front and back direction together with the laser guide tube 51.
The configuration is such that it cannot be moved by moving the left and right direction.
なお、この構成は、レーザ案内筒５１に反射ミラー６１
を設けて、このレーザ案内筒５１を取付台９と共に前後
方向（Ｘ）のみ移動自在に設ける。Note that this configuration includes a reflection mirror 61 in the laser guide tube 51.
This laser guide tube 51 is provided so as to be movable only in the front-rear direction (X) together with the mounting base 9.
又、反射ミラー４５を有するレーザヘッド３９は、該取
付台９と共に左右方向（Ｙ）へ移動自在に設ける構成と
するもよい。Further, the laser head 39 having the reflection mirror 45 may be provided so as to be movable in the left-right direction (Y) together with the mounting base 9.
ワーク１を基台７の支持ビン３群上に載Ｕで、定位置に
保持させる。このワーク１を切断加工するときは、レー
ザ発信器５７からレーザビームを発信させる。このレー
ザビームは、レーザ案内筒５９を通り、反射ミラー６１
で反射され、レーザ案内筒５１を通って、レーザヘッド
３９の反射ミラー４５に至る。この反射ミラー４５に反
射されたレーザビームは、更にこのレーザヘッド３９内
を直下して集光レンズ４３を通り、ノズル４７から該ワ
ーク１に照射されて、このワーク１を切断する。The workpiece 1 is placed on the group of support bins 3 on the base 7 and held at a fixed position. When cutting the workpiece 1, a laser beam is emitted from the laser transmitter 57. This laser beam passes through a laser guide tube 59 and a reflection mirror 61.
The light is reflected by the beam, passes through the laser guide cylinder 51, and reaches the reflection mirror 45 of the laser head 39. The laser beam reflected by the reflecting mirror 45 further passes directly through the laser head 39, passes through the condenser lens 43, and is irradiated onto the work 1 from the nozzle 47 to cut the work 1.
このレーザビームによるワーク１の切断進行は、レーザ
ヘッド３９の前後方向（×）、及び左右方向（Ｙ）等の
移動制御によって行われる。又、この移動制御は数値制
御によって行われる。The progress of cutting the workpiece 1 with this laser beam is performed by controlling the movement of the laser head 39 in the front-rear direction (X), left-right direction (Y), and the like. Further, this movement control is performed by numerical control.
レーザヘッド３９の前後方向（Ｘ）移動は、制御モータ
４９の正転、又は逆転等によって、螺旋軸３３を回転し
、移動台２７を支持レール２５に案内させて移動させる
。又、このレーザヘッド３９の左右方向（Ｙ）移動は、
制御モータ３５の正転、又逆転によって、螺旋軸３７を
回転し、取付台９を移動台２７に案内させて移動させる
。レーザヘッド３９の切断移動は、これら前後方向（Ｘ
）と左右方向（Ｙ）との複合によって所定の加工寸法に
従って直線乃至曲線に切断移動される。The laser head 39 is moved in the forward and backward direction (X) by rotating the helical shaft 33 by rotating the control motor 49 in the forward direction or in the reverse direction, thereby moving the movable table 27 while being guided by the support rails 25 . Furthermore, the movement of the laser head 39 in the left and right direction (Y) is as follows:
By rotating the control motor 35 forward or backward, the helical shaft 37 is rotated, and the mounting base 9 is guided by the moving base 27 and moved. The cutting movement of the laser head 39 is performed in these forward and backward directions (X
) and the left-right direction (Y), the cutting movement is performed in a straight line or in a curved line according to a predetermined processing dimension.
レーザ案内筒５１が前後方向（Ｘ）へ移動されるときは
、レーザ案内筒５１との交差部では、反射ミラー６１を
このレーザ案内筒５１と一体的にして、レーザ案内筒５
９ｇ沿って前後方向（Ｘ）へ移動させる。又、取付台９
が左右方向（Ｙ）へ移動されるときは、レーザ案内筒５
１は同方向へ移動されるが、反射ミラー６１はレーザ案
内筒５９に位置さぜたま）とし、左右方向（×）へは移
動させない。When the laser guide tube 51 is moved in the longitudinal direction (X), the reflection mirror 61 is integrated with the laser guide tube 51 at the intersection with the laser guide tube 51, and the laser guide tube 5
9g in the front-back direction (X). Also, the mounting base 9
When the is moved in the left-right direction (Y), the laser guide tube 5
1 is moved in the same direction, but the reflecting mirror 61 is positioned in the laser guide tube 59 (sandetama) and is not moved in the left-right direction (x).
移動台２７の前後方向（Ｘ）移動によって、この支脚部
２９と一体のカム５３が、同方向へ移動される。このた
めカム５３が通過するときのロール５５を押下する。こ
の押下されたロール５５のビンホルダ１１が、支柱１５
との枢支ビン１７を中心にしてばね２１に抗して下方へ
回動される。By moving the movable table 27 in the back and forth direction (X), the cam 53 integrated with the support leg 29 is moved in the same direction. Therefore, the cam 53 presses down the roll 55 as it passes. The bottle holder 11 of this pressed roll 55 is
It is rotated downwardly against the spring 21 about the pivot pin 17 with respect to the spring 21.
従って、ワーク１の下面を支持していた支持ビン３のう
ち、このカム５３によって押下されるビンホルダ１１に
配設された支持ビン３が、下方へ離間される。このカム
５３によって押下される支持ビン３は、レーザヘッド３
９から照射されるレーザビームによる切断作用位置のは
望直下に位置しているが、この切断時の支持ビン３はワ
ーク１の切断位置を支持しない。従って、この支持ビン
３が、レーザビームやスパッター等を受けたり、切断時
の強い熱を直接受けるようなことがなく、支持ビン３が
損傷され難い。Therefore, of the support bins 3 supporting the lower surface of the workpiece 1, the support bins 3 disposed in the bin holder 11 pushed down by the cam 53 are separated downward. The support bin 3 pressed down by this cam 53 is attached to the laser head 3.
Although the cutting action position of the laser beam irradiated from the workpiece 9 is located directly below the target, the support bin 3 does not support the cutting position of the workpiece 1 during this cutting. Therefore, the support bottle 3 is not exposed to laser beams, sputters, etc., or directly exposed to strong heat during cutting, and thus the support bottle 3 is less likely to be damaged.
なお、図示例では、全て支持ビン３を配設した形態であ
る。しかし、この支持ビン３の間に一部フリーローラベ
アリングを配設して、ワーク１の供給、送出時にこのフ
リーローラベアリングでワーク１下面を支持できる構成
としてもよい。In addition, in the illustrated example, the support bins 3 are all provided. However, a configuration may also be adopted in which a part of the free roller bearing is disposed between the support bins 3 so that the lower surface of the workpiece 1 can be supported by the free roller bearing when the workpiece 1 is supplied or sent out.
図はこの発明の一実施例を示すもので、第１図は正面図
、第２図は平面図、第３図は一部所面せる拡大側面図で
ある。
１・・・ワーク ３・・・支持ビン５・・・熱切
断装置 １１・・・ビンホルダ第３図
ｔｌ ｌｊ ココ ＩＩ ｌｊ ｌコ
ｔｌ 七 ココ ＩＪ ヱ第１図The drawings show an embodiment of the present invention; FIG. 1 is a front view, FIG. 2 is a plan view, and FIG. 3 is a partially enlarged side view. 1...Workpiece 3...Support bottle 5...Thermal cutting device 11...Bin holder Fig. 3 tl lj here II lj lko
tl 7 here IJ ヱFigure 1
Claims (1)
群のうち、この熱切断装置の切断加工移動に合せて、こ
の切断加工位置下の支持ピンを適方へ退避すべく設けて
なる熱切断加工機のワーク支持装置。Among a group of support pins that support a workpiece to be thermally cut from below, this thermal cutting process is provided so that the support pins below the cutting position are retracted to an appropriate position in accordance with the movement of the thermal cutting device during the cutting process. Machine workpiece support device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60140293A JPH0679794B2 (en) | 1985-06-28 | 1985-06-28 | Work support device for thermal cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60140293A JPH0679794B2 (en) | 1985-06-28 | 1985-06-28 | Work support device for thermal cutting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS623892A true JPS623892A (en) | 1987-01-09 |
| JPH0679794B2 JPH0679794B2 (en) | 1994-10-12 |
Family
ID=15265420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60140293A Expired - Lifetime JPH0679794B2 (en) | 1985-06-28 | 1985-06-28 | Work support device for thermal cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0679794B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299291A (en) * | 1988-10-06 | 1990-04-11 | Amada Co Ltd | Heat cut machining device |
| WO2007134630A1 (en) * | 2006-05-24 | 2007-11-29 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method, adjusting method and supporting element for setting up a workpiece support for receiving a plate-like workpiece |
| US11691224B2 (en) * | 2018-12-21 | 2023-07-04 | Magic Leap, Inc. | Configurable fixture for cutting shapes |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127988A (en) * | 1983-01-11 | 1984-07-23 | Asahi Optical Co Ltd | Laser working machine |
-
1985
- 1985-06-28 JP JP60140293A patent/JPH0679794B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127988A (en) * | 1983-01-11 | 1984-07-23 | Asahi Optical Co Ltd | Laser working machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299291A (en) * | 1988-10-06 | 1990-04-11 | Amada Co Ltd | Heat cut machining device |
| WO2007134630A1 (en) * | 2006-05-24 | 2007-11-29 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method, adjusting method and supporting element for setting up a workpiece support for receiving a plate-like workpiece |
| US11691224B2 (en) * | 2018-12-21 | 2023-07-04 | Magic Leap, Inc. | Configurable fixture for cutting shapes |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0679794B2 (en) | 1994-10-12 |
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