JPS624113A - Feed gear for flexible platelike work - Google Patents
Feed gear for flexible platelike workInfo
- Publication number
- JPS624113A JPS624113A JP60140894A JP14089485A JPS624113A JP S624113 A JPS624113 A JP S624113A JP 60140894 A JP60140894 A JP 60140894A JP 14089485 A JP14089485 A JP 14089485A JP S624113 A JPS624113 A JP S624113A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- clamp
- endless chain
- coating
- closed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 28
- 238000000576 coating method Methods 0.000 abstract description 15
- 239000011248 coating agent Substances 0.000 abstract description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 239000007788 liquid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000003973 paint Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 2
- 102220502480 Vacuolar ATPase assembly integral membrane protein VMA21_A18F_mutation Human genes 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 101150036577 fl11 gene Proteins 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Chain Conveyers (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、フレキシブルな板状物の両面にエツチングレ
ジスト等の液状塗料を同時にコーティングしたもの金、
乾燥炉を移動させるため等に用いられるフレキシブル板
状物の送り装置!に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a flexible plate-like material coated with liquid paint such as etching resist on both sides at the same time.
Feeding device for flexible plate-like materials used to move drying ovens, etc.! Regarding.
(従来の技術)
例えば、プリント配線板の製造に於て、銅張積層板にエ
ツチングレジストを形成する場合、接着剤付き積層板に
メツキレジス)l形成する場合等、エツチングレジスト
、メツキレシスト等の液状の塗料をロールコータ−によ
り板状物の表面にコーティングすることは広く行われて
いる。しかし板状物の表面を同時にコーティングするこ
とはコーティング直後の表面が液状のなめコーティング
板状物を送るために支持することが困難である。(Prior art) For example, in the production of printed wiring boards, when forming an etching resist on a copper-clad laminate, or when forming an etching resist on an adhesive-coated laminate, etc. 2. Description of the Related Art It is widely practiced to coat the surface of a plate-like object with a paint using a roll coater. However, it is difficult to simultaneously coat the surface of a plate because the surface immediately after coating is liquid and the plate is slick-coated.
板状物がリジットの場合は端部の各種支持方法として第
1因、第2図、第5図、第4図、第5図に示す方法が一
般に行われている。ことに1は板状物、2は送り装置で
ある。When the plate-like object is rigid, the methods shown in the first method, FIG. 2, FIG. 5, FIG. 4, and FIG. 5 are generally used as various methods of supporting the end portions. In particular, 1 is a plate and 2 is a feeding device.
(発明が解決しようとする問題点)
これらは板状物が1.Q mra以上以上比較的厚くリ
ジットの場合に限られる。第2図〜第4図は1〜511
Iffl厚さ位の板状物に第5図、第6図は1Qmm以
上位の板状物に適用されることが多い。(Problems to be Solved by the Invention) These are the problems that the plate-like object is 1. Limited to relatively thick and rigid cases of Q mra or more. Figures 2 to 4 are 1 to 511.
5 and 6 are often applied to plate-like objects with a thickness of about 1 Qmm or more.
また板状物がフレキシブルの場合、外観上問題にならな
いものについては、第7図に示す方法がなされている。Further, in the case where the plate-like object is flexible and does not pose a problem in terms of appearance, the method shown in FIG. 7 is used.
しかし、プリント配線板の液状フォトレジストの場合な
どコーテイング後の板状物の表面の塗料が凹みがなく平
滑ヲ要するものについては使用されない。However, it is not used in cases where the coating on the surface of a plate-like object after coating, such as liquid photoresist for printed wiring boards, needs to be smooth and free of dents.
そのため、フレキシブルな板状物の両面にロールコータ
−により液状の塗料をコーティングすることは行われて
いない。Therefore, coating both sides of a flexible plate with a liquid paint using a roll coater is not practiced.
本発明は、フレキシブルな板状物(例えば多層プリント
配線板の内層基板やフレ午シプルプリント配線板)の両
面に液状塗料(例えば液状フォトレジスト)を同時にコ
ーティングする両面ロールコータ−において、コーテイ
ング後の両面が機械的接触VCより被塗部または基板が
凹みや傷の損傷により製品の外観や品質管損ったり低下
させないようにする送り装置管提供するものである。The present invention is a double-sided roll coater that simultaneously coats liquid paint (for example, liquid photoresist) on both sides of a flexible plate-like object (for example, an inner layer substrate of a multilayer printed wiring board or a flexible printed wiring board) after coating. The present invention provides a feeding device tube that prevents the appearance and quality of the product from being damaged or degraded due to damage to the coated part or substrate due to dents or scratches due to mechanical contact between both sides of the VC.
(問題点を解決するための手段)
以下、本発明を多層プリント配線板の内層基板の回路形
成時の液状フォトレジストのコーティング工程を例にし
て説明する。(Means for Solving the Problems) Hereinafter, the present invention will be explained using a liquid photoresist coating process during circuit formation on an inner layer substrate of a multilayer printed wiring board as an example.
多層プリント配線板の内層基板は、通常厚さがa18f
fl11カら1. Q O111110間で多種使用さ
れている。特に厚さがα4mm以下位になると基板がフ
レキシブルになシ搬送上困難なことが多い。The inner layer board of a multilayer printed wiring board usually has a thickness of A18F.
1 from fl11. Q O111110 is used in various ways. In particular, when the thickness is less than α4 mm, the substrate becomes flexible and transportation is often difficult.
現在フォトレジストは感光性樹脂フィルムであるドライ
フィルム七加熱した基板に熱圧着しているのが多いが、
加熱、互層、切断、耳カット、ガイド穴明け、と工程が
多く、高価で@滑性及び解倫度に限界があシ、液状の7
オトレジストを内層基板に直接コーティングする方法が
検討されている。しかし、両面を同時にコーティングす
る方法の静電コーティング、スプレーコーティング、デ
ィップコーティングではフォトレジストの歩留りが悪く
、ロスが非常に多い。生産性が悪い装置が大がかりにな
夛設備投資額が大となる等でほとんど採用されていない
。そこで7オトレジストの歩留シが1<、堰板が簡単で
設備投資額も比較的少い両面ロールコータ−が多用され
ているが基板がフレキシブルの場合コーテイング後の搬
送が困難なため採用されていない。本発明はコーテイン
グ後の搬送の困翔を解決するためになされたもので、ロ
ールコータ−により基板の両面管コーティング後送り方
向の両端部をクランプにより基板を支え送る装#vc関
する。Currently, photoresists are often made of dry film, which is a photosensitive resin film, and are bonded under heat and pressure to a heated substrate.
There are many steps such as heating, alternating layers, cutting, cutting edges, and drilling guide holes, and it is expensive, has limited lubricity and degree of release, and is in liquid form.
A method of directly coating the inner layer substrate with photoresist is being considered. However, electrostatic coating, spray coating, and dip coating, which simultaneously coat both sides, have poor photoresist yields and result in a large amount of loss. It is rarely used because it requires large-scale equipment with poor productivity and requires a large amount of equipment investment. Therefore, when the yield of 7-otoresist is <1, a double-sided roll coater is often used because the weir plate is simple and the capital investment is relatively small, but if the substrate is flexible, it is difficult to transport it after coating, so it is not used. do not have. The present invention was made in order to solve the problem of transportation after coating, and relates to a system for supporting and transporting a substrate by clamping both ends of the substrate in the feeding direction after double-sided tube coating of the substrate using a roll coater.
以下具体的に因に従って説明する。第8因は、本発明を
採用した多層プリント配線板の内層基板の回路形成用フ
ォトレジストt−両面に同時にコーティングする両面ロ
ールコータ−の簡略側面図である。第8図において、4
4は基板t−ロールコータ−へ送り込む送り込みローラ
ーコンベヤー、50箇所で基板の大きさに応じロールコ
ータ−の定位置へ基板を送れるよう位置を合せる。6は
上部コーティングロール、7は上部ドクターロール、8
は7オトレジストで、6と7のクリアランスにより基板
の上面に転写される量が規制される。9は下部コーティ
ングロール、10は下部ドクターロール、11はフォト
レジストで、9と10のクリアランスによシ基板の下面
に転写される量が規制される。12はクランプ付キエン
ドレスチェンコンベヤーで本発明のポイントとなるとこ
ろである。15は乾燥機、14は乾燥後の基板を後工程
に送る送り出シエンドレスベルトコンベヤーテアル。6
と9のコーティングクールにより両面に7オトレジスト
を同時にコーティングされ九基板は後工程へのエンドレ
スベルトコンベヤーによす搬送されるまでの間、表面の
7オトレジストを固化させる必要があシ、13の乾燥機
を使用する。This will be explained in detail below. The eighth factor is a simplified side view of a double-sided roll coater that simultaneously coats both sides of the circuit-forming photoresist t of the inner layer substrate of a multilayer printed wiring board employing the present invention. In Figure 8, 4
4 is a feed roller conveyor that feeds the substrate to the T-roll coater, and is positioned at 50 locations according to the size of the substrate so that the substrate can be fed to the fixed position of the roll coater. 6 is the upper coating roll, 7 is the upper doctor roll, 8
is photoresist 7, and the amount transferred onto the upper surface of the substrate is regulated by the clearance between 6 and 7. Reference numeral 9 is a lower coating roll, 10 is a lower doctor roll, and 11 is a photoresist, and the amount transferred to the lower surface of the substrate is regulated by the clearance between 9 and 10. 12 is a chain conveyor with a clamp and is the key point of the present invention. 15 is a dryer, and 14 is a delivery chainless belt conveyor for sending the dried substrate to a subsequent process. 6
The 7th photoresist is coated on both sides at the same time by the 9th coating coolant, and the 7th photoresist on the surface needs to be solidified before being transferred to the endless belt conveyor for the subsequent process. use.
しかるにこの間の基板表面の7オトレジストは液状のま
まで69同化後表面に凹みや小さい傷もあってはならな
いため最終工程の裂品有効寸法外の例えば両端部で支持
するが、基板が(118IIII11 α2011+1
,123市位の薄い場合7レキシプルとなり従来の第2
図、第5図、@4図の方法では基板中央部が下方に曲り
自重で落下してしまう。そのため両端部て端よ51cm
以内で製品有効寸法に支障のない部分で支え、しかもは
y水平な状態で基板を送る必要がある。本発明はこの必
要を解決するもので第1図に示すりランフ”i12のエ
ンドレスチェーンコンベヤーに取りつけ、両端より支持
するものである。第1図は、送り方向に向って右側のク
ランプの組立図である。14はエンドレスチェンコンベ
ヤーのチェーン、15は両面に7オトレジストをコーテ
ィングした基板である。16はクランプ本体、17はカ
ラー、18はバネピン、19はクランプピンで、20の
テンシ重ンバネによシフランプの開閉を行う。21はカ
ムフォロワ、22はクランプ本体上止めるピン、23は
クランプ組立部会体を14のエンドレスチェーンコンベ
ヤーに固定するボルトナツト、24はクランプ本体を水
平に保つ25のガイドに接触するカム7寸ロワである。However, during this time, the 7 otoresist on the surface of the substrate remains in a liquid state, and after 69 assimilation, there must be no dents or small scratches on the surface, so it is supported at both ends, for example, outside the effective dimensions of the final process.
, the thin case of 123 cities becomes 7 lexical, which is the conventional second
In the methods shown in Figures, Figure 5, and @ Figure 4, the center portion of the board bends downward and falls under its own weight. Therefore both ends are 51cm.
It is necessary to support the board at a part that does not interfere with the effective dimensions of the product within a range of 300 to 300 cm, and to send the board in a horizontal state. The present invention solves this need, and is attached to an endless chain conveyor with a ramp "i12" as shown in Fig. 1, and is supported from both ends. Fig. 1 is an assembly diagram of the clamp on the right side in the feeding direction. 14 is a chain of an endless chain conveyor, 15 is a substrate coated with 7 Otoresist on both sides, 16 is a clamp body, 17 is a collar, 18 is a spring pin, 19 is a clamp pin, and 20 is a tension spring. Opens and closes the shift lamp. 21 is a cam follower, 22 is a pin that fixes the top of the clamp body, 23 is a bolt nut that fixes the clamp assembly assembly to the endless chain conveyor 14, and 24 is a cam that contacts the guide 25 that keeps the clamp body horizontal. It is 7 inch lower.
第8図に示すクランプを5〜20CfM隔に12のエン
ドレスチェンコンベヤーに取りつけ基板が6と9の間を
通過後両端で挟み、レベリング及び13の乾燥機により
両面の7オトレジストt−乾燥して固化後、14のエン
ドレスベルトコンベヤーへ渡る直前にクランプが開き基
板が12のエンドレスチェンコンペヤーから開放され1
4のエンドレスベルトコンベヤーに移送される。なお1
2のエンドレスチェンコンベヤーに固定されたクランプ
の開閉はレバーによりなされる。コーターに近い部分で
は閉じるが、そのレバーは第9図rζ示すものによる。The clamps shown in Fig. 8 are attached to the endless chain conveyor 12 at intervals of 5 to 20 CfM, and after the substrate passes between 6 and 9, it is sandwiched at both ends, leveled, and the photoresist 7 on both sides is dried and solidified using the dryer 13. After that, just before passing to the endless belt conveyor 14, the clamp opens and the board is released from the endless chain conveyor 12.
It is transferred to endless belt conveyor 4. Note 1
A lever is used to open and close the clamp fixed to the second endless chain conveyor. The lever close to the coater is the one shown in Figure 9 rζ.
第9図は基板の送り方向に向って右側のクランプ閉レバ
ーでるる。第8図OAの地点において第1図のクランプ
本体がC位tVCあったものが、26のクランプ閉レバ
ー1c21のカムフォロワが接触し、D位置となシ閉じ
る。これに1勺基板15管挟む機構となっている。なお
26のクランプ閉レバーは、12のエンドレスチェンコ
ンベヤーの29フレームに固定なるよう、27の#lL
、28のボ、+b)によシ止められる。FIG. 9 shows the clamp closing lever on the right side when facing the board feeding direction. At the point OA in FIG. 8, the clamp body in FIG. 1 is in the C position tVC, but the cam follower of the clamp closing lever 1c21 of 26 comes into contact with it, and the clamp body is in the D position and closed. The mechanism is such that one board and 15 tubes are sandwiched between these. In addition, the clamp closing lever 26 is fixed to the frame 29 of the endless chain conveyor 12 with #lL of 27.
, 28, +b).
第10図はクランプ開レバーである。50のクランプ開
レバ一本体は29のフレームに52のボルトにより固定
されていて、51の禅レバーに沿って進むとクランプの
21カムクオロワに接触して開き16のクランプ本体が
開き、15の基板を開放し、16のエンドレスベルトコ
ンベヤーへ移送される。FIG. 10 shows the clamp opening lever. The main body of the clamp opening lever 50 is fixed to the frame 29 by the bolt 52, and when it moves along the Zen lever 51, it contacts the cam roller of the clamp 21 and opens, and the clamp main body 16 opens, opening the board 15. It is opened and transferred to 16 endless belt conveyors.
なお、基板の大きさによシフランプの大きさ、ピッチを
変えるとよい。また、送り方向の@調整は、12のエン
ドレスチェンコンベヤーの29フレ一ム金ハンドル操作
により容易に調整でき、どのような大きさの基板寸法に
も適用可能である。なお第11図は、不発1311によ
る板状物を送りでいる状態の全体を示す側ii!ili
歯を示し念。Note that it is good to change the size and pitch of the shift lamps depending on the size of the board. Further, the feeding direction can be easily adjusted by operating the 29-frame gold handle of the 12 endless chain conveyors, and can be applied to any size of substrate. In addition, FIG. 11 shows the entire state in which a plate-like object is being fed due to the misfire 1311. ili
Show your teeth.
(発明の効果)
以上の如く、レバーによシ開閉するクランプ全エンドレ
スチェーンコンベヤーに取り付けることによシ無人で両
面ロールコータ−による両面コーテイング後のフレキシ
ブルな基aV衣表面損傷することなく搬送することがで
き、フォトレジストの両面同時塗布ができる。(Effects of the Invention) As described above, by attaching the clamp to the endless chain conveyor, which can be opened and closed by levers, it is possible to convey the flexible base coat without damaging the surface after double-sided coating using the double-sided roll coater. This allows photoresist to be coated on both sides at the same time.
第1図は本発明の装置の要部側面白、第2図〜第7図は
従来の装置を示す断面、第8図は本発明の装置全体を示
す側面幽、第9図、第10図は本発明の装置の畳部斜視
図、第11図は本発明の装置の要部断面図である。
符号の説明
14 エンドレスチェーンコンベアー
15 両面フォトレジストコーティング基板16 クラ
ンプ
氾3図 宅6図
尾8図
第11図Fig. 1 shows a white side view of the main part of the device of the present invention, Figs. 2 to 7 show a cross section of a conventional device, Fig. 8 shows a side view of the entire device of the present invention, and Figs. 9 and 10. 11 is a perspective view of the tatami part of the device of the present invention, and FIG. 11 is a sectional view of the main part of the device of the present invention. Explanation of symbols 14 Endless chain conveyor 15 Double-sided photoresist coated substrate 16 Clamp flood 3 Figure House 6 Figure Tail 8 Figure 11
Claims (1)
ーに取付けられた開閉自在なりランプ、エンドレスコン
ベヤーの必要箇所に設けられたクランプを閉じる機構及
びエンドレスコンベアーの他の必要箇所に設けられたク
ランプを開く機構とより成るフレキシブル板状物の送り
装置。1. Consists of a pair of endless conveyors, a ramp attached to the endless conveyor that can be opened and closed, a mechanism for closing clamps provided at necessary locations on the endless conveyor, and a mechanism for opening clamps provided at other required locations on the endless conveyor. Feeding device for flexible plate materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60140894A JPS624113A (en) | 1985-06-27 | 1985-06-27 | Feed gear for flexible platelike work |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60140894A JPS624113A (en) | 1985-06-27 | 1985-06-27 | Feed gear for flexible platelike work |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS624113A true JPS624113A (en) | 1987-01-10 |
Family
ID=15279260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60140894A Pending JPS624113A (en) | 1985-06-27 | 1985-06-27 | Feed gear for flexible platelike work |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS624113A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH061322U (en) * | 1992-06-08 | 1994-01-11 | 日本電熱計器株式会社 | Printed circuit board holding and conveying device |
| JPH0637218U (en) * | 1992-08-28 | 1994-05-17 | 新東工業株式会社 | Skin transport device |
| JP2014135373A (en) * | 2013-01-10 | 2014-07-24 | Tokyo Kakoki Kk | Conveyor of surface treatment device of board material |
| CN108712821A (en) * | 2018-06-04 | 2018-10-26 | 湖州旭源电气科技有限公司 | A kind of clamped-in style pcb board chip mounter |
| JP2020012131A (en) * | 2018-07-13 | 2020-01-23 | 日立化成株式会社 | Etching apparatus, etching method, and method of manufacturing printed wiring board |
-
1985
- 1985-06-27 JP JP60140894A patent/JPS624113A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH061322U (en) * | 1992-06-08 | 1994-01-11 | 日本電熱計器株式会社 | Printed circuit board holding and conveying device |
| JPH0637218U (en) * | 1992-08-28 | 1994-05-17 | 新東工業株式会社 | Skin transport device |
| JP2014135373A (en) * | 2013-01-10 | 2014-07-24 | Tokyo Kakoki Kk | Conveyor of surface treatment device of board material |
| CN108712821A (en) * | 2018-06-04 | 2018-10-26 | 湖州旭源电气科技有限公司 | A kind of clamped-in style pcb board chip mounter |
| CN108712821B (en) * | 2018-06-04 | 2020-08-28 | 湖州旭源电气科技有限公司 | Clamping type PCB (printed circuit board) chip mounter |
| JP2020012131A (en) * | 2018-07-13 | 2020-01-23 | 日立化成株式会社 | Etching apparatus, etching method, and method of manufacturing printed wiring board |
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