JPS6242560Y2 - - Google Patents

Description

[Detailed description of the invention] This invention is an electrical component that does not have a lead wire (chip component) among electrical components such as resistors and capacitors.
The present invention relates to a chip component mounting device for attaching chips to a predetermined position on a printed circuit board, and in particular, provides a device that can automatically send chip components to a predetermined position on a printed circuit board efficiently and without malfunction. There is something to do.

Next, the present invention will be explained based on embodiments shown in the drawings.

Fig. 1 is a schematic side view showing the entire chip parts mounting device, Fig. 2 is a schematic top view thereof, and Fig. 3 is an explanatory view showing the operation of the chip parts mounting device. To explain the overall configuration and operation, 1... is a plurality of hoppers arranged above the device, and the hoppers have electrodes at both ends of the insulating part Ca, as shown in Figure 4. Part Cb, Cb
The diameter without the lead wire formed is approximately 1.6mm,
Column-shaped chip parts C with a length of about 3.2 mm are stored, and they are prepared in correspondence with the number of chip parts C to be attached to the printed circuit board P. In the drawing, six pieces are arranged in two rows. 12 hoppers 1... are shown prepared.

2 is a hopper stand located above the device and supports the hoppers 1 in a replaceable manner; 3... is a support member for fixing the alignment plate 4 to the hopper stand 2; 5... is a support member for supplying chip parts C made of plastic; A hollow pipe is formed to connect the hopper stand 2 and the alignment plate 4, and the hopper 1...
The chip part C sent out from this pipe 5...
It is configured such that it passes through and falls to the alignment plate 4 side.

Reference numeral 6 indicates a support member for fixing the hopper stand 2 to the base stand 7, 8 a movable feed belt, 9 a stand member placed on the feed belt 8, and 10 a lower side placed on the stand member 9. plate, 11 is the lower plate 1
0, the upper and lower plates 11, 10 have holes 11a, . 10a... are provided, and the upper plate 11 is formed of a thicker plate than the lower plate 10, so that it can be moved from above the lower plate 10.

12 is a power source for moving the upper and lower plates 11, 10 and the base member 9 toward the alignment plate 4 side.

Next, the operation of the device of the present invention will be explained with reference to FIGS. 1 and 3. Desired chip parts C are stored in the hoppers 1, and one chip part C is delivered from each hopper 1. It is designed to be sent out. (The feeding mechanism will be described later.) Now, as shown in FIG.
This is lifted by the power source 12 and placed on the alignment plate 4 as shown in FIG. 3A.

Next, each hopper 1...
When one chip part C is sent out from the pipe 5, the chip part C is guided by the pipe 5 and falls into the holes 11a and 10a of the upper and lower plates 11 and 10.

(See Figure 3A) Next, return the power source 12 to its original position, place the upper and lower plates 11 and 10 and the base member 9 on the feed belt 8, and move the feed belt 8 to vibrate it. When given, the chip part C falls sideways using the holes 11a and 10a of the upper and lower plates 11 and 10 as guides, and after the chip part C is turned sideways, the upper plate 11 is removed from above the lower plate 10. .

(See Fig. 3B) Then, as shown in Fig. 3B, the chip part C is positioned in the hole 10a of the lower plate 10, and a part of it protrudes from the lower plate 10 of the thin plate. When a printed circuit board P coated with an adhesive S in advance at a location corresponding to the position of the chip component C is placed on top of such a state, the chip component C is attached to the printed circuit board P by the adhesive S, and The chip component C is in a state where it has been transferred onto the printed circuit board P, and when this printed circuit board P is immersed in a solder bath, the attachment of the chip component C to the printed circuit board P is completed.

By repeating these steps, the chip component C can be automatically attached to the printed circuit board P.

Next, as mentioned above, the feeding mechanism in which the chip parts C stored in the hoppers 1 are fed out one by one will be explained based on FIG. The drive rollers are rotatably mounted on bearings 14, 14, and gears 15, 16 meshing with each other are provided at one end of each drive roller 13, 13. Fixed, each gear 1
5, 16 and drive rollers 13, 13 are constantly rotated by a drive source 17 such as a motor via a gear 18.

Further, each hopper 1... is equipped with an alignment roller 34 and a shutter 41, which will be described in detail later, and the alignment roller 34 of each hopper 1... is equipped with drive rollers 13, 1.
It rotates constantly in contact with hopper 1, aligns the chip parts C in hopper 1, and also
The shutter 41 of... is the shutter drive member 1
It is designed to be linked to 9 and 19.

That is, 20, 20 are cylinders for driving the shutters, 21... are pistons connected to the shutter driving members 19, 19 and disposed within the cylinders 20, 20, and air or oil is supplied into the cylinders 20, 20. By moving the pistons 21 in and out, the pistons 21... are made to reciprocate.Now, by operating the cylinders 20, 20,
In FIG. 2, when the pistons 21 are moved in the direction of the arrow X, the shutter drive member 1
9,19 moves.

Then, the shutter 41 of each hopper 1 is moved, and one of the chip parts C stored in each hopper 1 falls through the pipe 5 .

Thereafter, when the cylinders 20, 20 are operated to return the pistons 21 to their original positions, each shutter 41 also returns to its original position.

By repeating this operation, one chip component C will be sent out from each hopper 1.

Next, the detailed structure and operation of the hopper 1 will be explained with reference to FIGS. 5 to 8. Reference numeral 30 is a main body made of metal, and the main body has a funnel part 30a on the upper side, and A notch 30b extending to the center is provided on the side surface. Reference numeral 31 denotes an outer cylindrical portion fixed with a screw 32 above the main body 30; 33 is a lid that closes the upper part of the outer cylindrical portion 31;
The chip component C is housed in the hollow portion formed by the funnel portion 30a.

Reference numeral 34 denotes an alignment roller having a groove 34a provided at the center of the outer circumference and a friction member 34b provided at the outer periphery. The alignment roller 34 is rotatably attached to the main body 30, and a part of the alignment roller 34 protrudes outside from the notch 30b, and the drive roller 13
I have made it possible for you to contact me. 36 is the main body part 30
The screw 3 is located in the notch 30b of the outer cylindrical part 31.
2, the sealing member seals the notch 30b at the upper part of the alignment roller 34 to prevent the chip parts C from falling off, and also allows a part of the alignment roller 34 to be inserted into the funnel part 30a. The purpose is to expose the

Reference numeral 37 denotes a shutter top plate having an alignment pipe 38 attached to its center, and a recess 37c extending across the center on the lower surface of the shutter top plate. Reference numeral 39 denotes a lower shutter plate having a groove 39a and a hole 39b for inserting the chip component C provided at the bottom of the groove 39a. Hole 37
It is attached by inserting it through holes a and 39c and screwing it into the main body part 30.

At this time, as shown in FIG. 5, the tips of the alignment pipes 38 come to face the grooves 34a of the alignment rollers 34.

A shutter 41 is housed in the groove 39a of the lower shutter plate 39 and is movably attached between the upper shutter plate 37 and the lower plate 39. The shutter has a hole 41a and a hole 41b for inserting the tip component C. A stopper pin 42 fixed to the main body 30 is inserted into the hole 41a of the shutter 41 through the hole 37b of the shutter top plate 37, so as to limit the range of movement of the shutter 41. Reference numeral 43 denotes a spring fixed to the shutter upper plate 37 with screws 44, and this spring is located in the groove 39a of the shutter lower plate 39, and constantly presses the shutter 41 in one direction to push a part of the shutter 41 into the groove 39a.
The shutter 41 is made to protrude from the shutter 41 so that the shutter driving member 19 can come into contact with it.

In order to attach the hopper 1 constructed in this way to the hopper stand 2, as shown in FIG. By this, the main body 30, shutter upper and lower plates 3
Since 7 and 39 are made of metal, they are heavy and can be mounted in a stable state.
9b and the chip component insertion hole 2b of the hopper stand 2 are in a matched state.

Then, when removing the hopper 1 from the hopper stand 2, it is sufficient to simply lift the hopper 1.

Next, to explain the operation of Hopper 1, first,
A large number of chip parts C are stored in the hollow part formed by the outer cylinder part 31 and the funnel part 30a, and the alignment roller 34 is rotated in the direction of arrow Y (counterclockwise) in FIG. The alignment roller 34 is rotated by the drive roller 13.
When the chip C rotates, the chip C is scraped upward by the friction member 34b provided on the alignment roller 34.
At the same time, while preventing the chip parts C from being concentrated at the tip of the alignment pipe 38, the chip parts C fit into the groove 34a of the alignment roller 34 and become aligned, and the chip parts C in this aligned state are sequentially , and fall into the alignment pipe 38.

FIG. 8A shows an enlarged view of the main part, and the chip component C that fell first was inserted into the chip component insertion hole 41b of the shutter 41 because the alignment pipe 38 and the chip component insertion hole 41b of the shutter 41 coincided with each other. It fits into the communication hole 41b, and one end of the chip component C comes into contact with the shutter lower plate 39, and
The chip component C that fell next overlaps the chip component C that fell first in the alignment pipe 38, and in this way, the chip component C that falls inside the alignment pipe 38 overlaps with the chip component C that fell first.
are sequentially arranged and overlapped.

Next, the shutter 41 is moved in the direction of arrow Z against the spring 43. This shutter 41 is moved by the shutter drive member 19, and then it moves until one end of the hole 41a of the shutter 41 engages with the stopper pin 42, and as shown in FIG. 8B, it fits into the tip component insertion hole 41b. The loaded chip component C is carried to a position that matches the chip component insertion hole 39b of the lower shutter plate 39, and then the chip component C falls through the chip component insertion hole 39b of the lower shutter plate 39. become.

At this time, the next chip part C is in contact with the upper part of the shutter 41.

Moreover, when the shutter drive member 19 is released,
The shutter 41 returns to the original position where the other end of the hole 41a of the shutter 41 is locked to the stopper pin 42 by the spring 43, and the chip component C is newly fitted into the chip component insertion hole 41b of the shutter 41. The state shown in Figure 8A is reached.

By repeating such operations, the chip parts C are taken out from the hopper 1 one by one.

Further, in the hopper 1, the shutter 41 is normally pressed by the spring 43, and the chip component insertion hole 39b of the lower shutter plate 39 is closed by the shutter 41, as shown in FIG. 8A. Even if the hopper 1 is removed from the hopper stand 2, the chip parts C will not spill out.

In the chip parts mounting device as described above,
The chip parts C move inside the pipe 5 one by one accurately.
This led to a situation where it did not fall quickly.

That is, when the chip part C slides inside the pipe 5, static electricity is generated, and the chip part C may be attracted to the pipe 5 and not fall, or when the chip part C is dropped, the chip part C may be Since it falls while rotating in a spiral, it takes time for it to fall, leading to mounting errors, and furthermore, it is not possible to increase the mounting speed.

FIG. 9 is an explanatory diagram of the falling state of the chip component C in the conventional pipe 5, and
The inner diameter of the chip C is about 2.2 mm, and the diameter of the chip part C is about 1.6 mm, so there is a gap of 0.6 mm between the two.
If a chip part C is dropped into this pipe 5, the chip part C will fall while moving in the order of positions H ₁ → H ₂ → H ₃ , and during that time , the chip part C rotates in the horizontal direction and falls with at least a part of the side surface of the chip part C in contact with the inside of the pipe 5.

As a result, the falling process of the chip parts becomes longer.
Not only does it take time for the pipes to fall, but as shown in FIG. There were variations in the falling time, which led to errors in attachment or to obstacles in increasing the attachment speed.

The reason why the spiral (rotational) movement of the chip component C occurs, which is a major factor in this problem, is that the chip component C is light, so as the chip component C falls, the air inside the pipe 5 escapes upward, and this escaping air Under the influence of this, a spiral movement occurs by itself, and the vertically extending portion of the pipe 5 is particularly susceptible to this influence. The present invention aims to reduce the spiral movement of the chip component C as much as possible, thereby reducing mounting errors and improving the mounting speed. Next, the configuration of the present invention is shown in Fig. 10. The cylindrical pipe 50 of the present invention is made of a plastic material mixed with several percent of carbon or the like to make it conductive, and the pipe 50 is different from the conventional pipe 5. The inside of the pipe 50 has a bar-shaped protrusion 51 extending over the entire length in the longitudinal direction.
has been established. As shown in FIG. 10B, the protrusion 51 causes the chip component to fall through a restricted space from the center of the pipe 5 to the opposite area on the left side, causing the chip component to make a spiral movement while contacting the inner wall of the pipe 5. You won't have to do anything.

The protrusion 51 is formed by adhering a rod-shaped member made of plastic to the inside of the pipe 50 or by molding it integrally with the pipe 50.

The height of the protrusion 51 is about 0.3 mm, and the inner diameter of the pipe 50 with respect to the chip part C is narrowed, and the gap that was about 0.6 mm is reduced to about 0.3 mm. A small gap 52 for regulating the movement of the chip component C and a gap 53 for air escape are formed inside the chip 50.

For this reason, the space in which the chip part C falls and the space for air escape are separated, the spiral movement of the chip part C can be drastically reduced, and the fall is performed smoothly, in a short time, and reliably.

As described above, according to the present invention, in the chip component mounting device that drops the chip components C one by one through the pipe and guides them to a predetermined location, a protrusion is provided inside the pipe parallel to the axis of the pipe. Therefore, a space is formed in the area opposite to the side where the protrusion is provided, in which the chip parts fall, and an escape space is formed around the protrusion for the air that is pressed as the chip parts fall. Ru. For this reason, the chip parts will have less spiral movement while contacting the inner wall of the pipe,
In addition, the air pressed when the chip component C falls escapes into the air escape space, which is the air escape gap 53, and the influence of this air on the chip component C can be reduced. The spiral movement of the object can be drastically reduced, and the falling speed can be accelerated.
The mounting speed can be improved, the chip component C can be mounted securely, and the number of mounting mistakes can be reduced.

By making the pipe conductive by mixing carbon or the like into the plastic material, it is possible to prevent the pipe from falling accidentally due to static electricity.

[Brief explanation of the drawing]

Figure 1 is a schematic side view showing the entire chip component mounting device, Figure 2 is a schematic top view thereof, and Figures 3A and B.
is an explanatory diagram showing the operation of the chip component mounting device, FIG. 4 is a perspective view of the chip component, FIG. 5 is a sectional view of the main part of the hopper, FIG. 6 is a bottom view thereof, and FIG. 7 is an exploded view of the main part. 8A and 8B are explanatory diagrams showing the operation of the hopper, and FIGS. 9A and 9B show a conventional pipe. 10A and 10B show the pipe of the present invention, FIG. 10A is a longitudinal cross-sectional view thereof, and FIG. 10B is a cross-sectional view thereof. C...Chip parts, P...Printed circuit board, S...
...Adhesive, 1...Hopper, 2...Hopper stand,
2a...Protrusion, 2b...Hole, 3...Supporting member, 4
... Alignment plate, 5 ... Pipe, 6 ... Support member, 7 ... Base stand, 8 ... Feeding belt, 9 ...
Base member, 10...lower plate, 10a...hole,
11... Upper plate, 11a... Hole, 12...
Power source, 13... Drive roller, 14... Bearing, 1
5, 16... Gear, 17... Drive source, 18... Gear, 19... Shutter drive member, 20... Cylinder, 21... Piston, 30... Main body, 3
0a...funnel part, 30b...notch part, 31...outer tube part, 32...screw, 33...lid, 34...alignment roller, 34a...concave groove, 34b...friction member,
35... Support shaft, 36... Sealing member, 37... Shutter top plate, 37a, 37b... Hole, 37c...
Recess, 38... Alignment pipe, 39... Shutter lower plate, 39a... Groove, 39b... Chip component insertion hole, 39c, 39d... Hole, 40... Screw, 41... Shutter, 41a... Hole, 41b
... Chip component insertion hole, 42 ... Stopper pin, 43 ... Spring, 44 ... Screw, 50 ... Pipe, 51 ... Projection, 52, 53 ... Gap.

Claims (1)

[Scope of utility model registration request] A plurality of hoppers containing cylindrical chip parts are arranged side by side on a hopper table, one chip part is dropped from each hopper at the same time, and the chip parts are passed through each cylindrical pipe and placed in a predetermined position. In a device for mounting chip parts that is guided,
A protrusion is provided on the inside of the pipe in parallel with the axis of the pipe, and a space in which the chip parts fall is formed in an area opposite to the side where the protrusion is provided, and the chips are placed around the protrusion. A chip component mounting device characterized by forming an escape space for air pressed as the component falls.