JPS6245694B2 - - Google Patents

Info

Publication number
JPS6245694B2
JPS6245694B2 JP58046045A JP4604583A JPS6245694B2 JP S6245694 B2 JPS6245694 B2 JP S6245694B2 JP 58046045 A JP58046045 A JP 58046045A JP 4604583 A JP4604583 A JP 4604583A JP S6245694 B2 JPS6245694 B2 JP S6245694B2
Authority
JP
Japan
Prior art keywords
pixel
disc
interest
shaped body
pixels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58046045A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172244A (ja
Inventor
Makoto Fukuda
Makoto Asakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP58046045A priority Critical patent/JPS59172244A/ja
Publication of JPS59172244A publication Critical patent/JPS59172244A/ja
Publication of JPS6245694B2 publication Critical patent/JPS6245694B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
JP58046045A 1983-03-22 1983-03-22 円板形状体の切欠検出方法 Granted JPS59172244A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58046045A JPS59172244A (ja) 1983-03-22 1983-03-22 円板形状体の切欠検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58046045A JPS59172244A (ja) 1983-03-22 1983-03-22 円板形状体の切欠検出方法

Publications (2)

Publication Number Publication Date
JPS59172244A JPS59172244A (ja) 1984-09-28
JPS6245694B2 true JPS6245694B2 (da) 1987-09-28

Family

ID=12736054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58046045A Granted JPS59172244A (ja) 1983-03-22 1983-03-22 円板形状体の切欠検出方法

Country Status (1)

Country Link
JP (1) JPS59172244A (da)

Also Published As

Publication number Publication date
JPS59172244A (ja) 1984-09-28

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