JPS6245833B2 - - Google Patents

Info

Publication number
JPS6245833B2
JPS6245833B2 JP55080156A JP8015680A JPS6245833B2 JP S6245833 B2 JPS6245833 B2 JP S6245833B2 JP 55080156 A JP55080156 A JP 55080156A JP 8015680 A JP8015680 A JP 8015680A JP S6245833 B2 JPS6245833 B2 JP S6245833B2
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
mark
mold release
flame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55080156A
Other languages
English (en)
Japanese (ja)
Other versions
JPS577142A (en
Inventor
Juji Miura
Michitoshi Sera
Tetsuo Ito
Atsushi Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP8015680A priority Critical patent/JPS577142A/ja
Publication of JPS577142A publication Critical patent/JPS577142A/ja
Publication of JPS6245833B2 publication Critical patent/JPS6245833B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/08—Surface shaping of articles, e.g. embossing; Apparatus therefor by flame treatment ; using hot gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing

Landscapes

  • Duplication Or Marking (AREA)
JP8015680A 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device Granted JPS577142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8015680A JPS577142A (en) 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8015680A JPS577142A (en) 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS577142A JPS577142A (en) 1982-01-14
JPS6245833B2 true JPS6245833B2 (de) 1987-09-29

Family

ID=13710431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8015680A Granted JPS577142A (en) 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS577142A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178142A (ja) * 1984-09-25 1986-04-21 Sanyo Electric Co Ltd モ−ルド型半導体装置の印刷方法
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54140463A (en) * 1978-04-21 1979-10-31 Nec Corp Process method for resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPS577142A (en) 1982-01-14

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