JPS6247193A - Soldering of electronic part - Google Patents
Soldering of electronic partInfo
- Publication number
- JPS6247193A JPS6247193A JP60188178A JP18817885A JPS6247193A JP S6247193 A JPS6247193 A JP S6247193A JP 60188178 A JP60188178 A JP 60188178A JP 18817885 A JP18817885 A JP 18817885A JP S6247193 A JPS6247193 A JP S6247193A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cream solder
- rosin
- soldering
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 239000006071 cream Substances 0.000 claims description 28
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 18
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 18
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 12
- 230000004907 flux Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000009835 boiling Methods 0.000 description 7
- 238000004821 distillation Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- WCOXQTXVACYMLM-UHFFFAOYSA-N 2,3-bis(12-hydroxyoctadecanoyloxy)propyl 12-hydroxyoctadecanoate Chemical compound CCCCCCC(O)CCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCC(O)CCCCCC)COC(=O)CCCCCCCCCCC(O)CCCCCC WCOXQTXVACYMLM-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- -1 Amine hydrochloride Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- AIXAANGOTKPUOY-UHFFFAOYSA-N carbachol Chemical group [Cl-].C[N+](C)(C)CCOC(N)=O AIXAANGOTKPUOY-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001256 steam distillation Methods 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業−七の利用分野〉
本発明は電子部品のはんだ付方法の改良に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION <Industry - Seventh Field of Application> The present invention relates to an improvement in a method for soldering electronic components.
〈先行技術と問題点〉
プリント回路に電子部品、特にチップ型回路素子をはん
だ付けする場合、クリームはんだをプリント回路の所定
位置に印刷または滴下によって塗布し、このクリームは
んだの粘着力にょつて回路素子を仮固定し、而るのち、
プリヒートによりクリームはんだ中の溶剤を徐々に除去
し、而るのち、高温急速加熱によってクリームはんだ中
のはんだにより電子部品をプリント回路にはんだ付けす
ることが公知である。<Prior art and problems> When soldering electronic components, especially chip-type circuit elements, to a printed circuit, cream solder is applied by printing or dropping onto a predetermined position of the printed circuit, and the adhesive strength of this cream solder is used to solder the circuit elements. Temporarily fix it, and then,
It is known to gradually remove the solvent in the cream solder by preheating, and then to solder electronic components to printed circuits with the solder in the cream solder by high temperature rapid heating.
上記プリヒートは、クリームはんだ中の溶剤の除去以外
に、はんだ付時での熱的ショックを排除するための予備
加熱としての技術的意義を有し、予備加熱時での熱的歪
を排除すべく、比較的、緩やかな加熱速度によって加熱
している。In addition to removing the solvent in cream solder, the preheating described above has technical significance as preheating to eliminate thermal shock during soldering, and is intended to eliminate thermal distortion during preheating. , heating is performed at a relatively slow heating rate.
かかる緩やかな加熱速度下での加熱条件下では、クリー
ムはんだ中の溶剤の揮発も徐々に進行していき、溶剤の
爆発的揮発時に懸念されるチップ型回路素子の跳動を回
避できる。Under such heating conditions at a slow heating rate, the solvent in the cream solder gradually evaporates, and it is possible to avoid the chip-type circuit element from jumping, which is a concern when the solvent evaporates explosively.
しかしながら、本発明者等は、加熱速度の緩慢なプリヒ
ートにもかかわらず、チップ型回路素子の移動が往々に
しであることを経験している。而るに、本発明者等はこ
の原因を種々検討したところ、クリームはんだのロジン
中のある成分がはんだ付時の急速加熱のために沸騰し、
この沸騰のためにチップ型回路素子か移動する結果であ
ることを知った。However, the inventors have experienced that chip-type circuit elements often move despite preheating at a slow heating rate. However, the inventors investigated various causes of this and found that a certain component in the rosin of cream solder boils due to rapid heating during soldering.
I learned that the boiling caused the chip-type circuit elements to move.
〈発明の目的〉
本発明の目的は、チップ型回路素子のような中Ｙ量、小
型の電子回路部品であっても、クリームはんだにより所
定の位置に高精度下ではんだ付けできる電子部品のはん
だ付方法を提供することにある。<Object of the Invention> The object of the present invention is to provide a solder for electronic components that can be soldered in a predetermined position with high precision using cream solder, even if the electronic circuit components are medium-sized and small, such as chip-type circuit elements. The objective is to provide a method for attaching.
〈発明の構成）
本発明に係る電子部品のはんだ付方法は、粉末はんだと
ロジン系フラックスとからなるクリームはんだの粘着力
によって電子部品を所定の位置に仮固定し、而るのち、
プリヒートによってクリームはんだ中の溶剤を除去し、
次いで、急速加熱によってクリームはんだ中のはんだに
よりはんだ付けする方法において、ロジン系フラックス
を予め蒸留処理しておくことを特徴とする方法である。(Structure of the Invention) The method for soldering electronic components according to the present invention temporarily fixes electronic components in a predetermined position using the adhesive force of cream solder made of powdered solder and rosin-based flux, and then
The solvent in the cream solder is removed by preheating,
Next, in a method of soldering using solder in cream solder by rapid heating, this method is characterized in that the rosin-based flux is subjected to a distillation treatment in advance.
〈実施例の説明〉 以下、図面により本発明を説明する。<Explanation of Examples> The present invention will be explained below with reference to the drawings.
図において、１はプリント回路板、２．２はプリント導
体である。２０．２０はプリン［・導体のラウンドであ
り、クリームはんだ３を印刷法または滴下法等によって
塗布する。このりＩＪ−ムはんだには、粉末はんだとロ
ジン系フラックスとからなり、ロジン系フラックスを予
め蒸留処理したものを用いている。４はチップ型回路素
子であり、」１記クリームはんだの塗布後に、その塗布
したクリームはんだにクリームはんだ自体の粘着力によ
り仮固定しである。In the figure, 1 is a printed circuit board, and 2.2 is a printed conductor. 20. 20 is a conductor round, and the cream solder 3 is applied by a printing method, a dropping method, or the like. This IJ-meum solder is made of powdered solder and rosin-based flux, and the rosin-based flux is pre-distilled. 4 is a chip type circuit element, which is temporarily fixed to the applied cream solder by the adhesive force of the cream solder itself after applying the cream solder described in 1.
このようにしてチップ型回路素子を仮固定したのちは、
クリームはんだの融点よりも低温でかつ溶剤の沸点より
もやや高い温度にて、相当に長い時間をかけてプリヒー
トを行い、クリームはんだ中の溶剤を除去する。Ｉ７か
るのちは、クリームはんだのはんだ融点よりも高い温度
で急速加熱して回路部品のはんだ利けを行う。After temporarily fixing the chip type circuit element in this way,
Preheating is performed for a considerably long time at a temperature lower than the melting point of the cream solder and slightly higher than the boiling point of the solvent to remove the solvent in the cream solder. After the I7 period, the cream solder is rapidly heated at a temperature higher than the melting point of the solder to improve the solder strength of the circuit components.
この場合、クリームはんだ中のフラックスの溶剤は、」
−記したプリヒートにより除去しであるから、溶剤の爆
発的飛散による回路素子の移動を排除できる。捷た、ク
リームはんだロジン中の低沸点物は、蒸留処理により除
去しであるから、低沸点物の沸騰による回路素子の移動
も排除できる。In this case, the flux solvent in the cream solder is
- Since the removal is carried out by the preheating described above, movement of circuit elements due to explosive scattering of the solvent can be eliminated. Since the low-boiling substances in the crushed cream solder rosin are removed by distillation, movement of circuit elements due to boiling of the low-boiling substances can also be eliminated.
本発明において使用するクリームはんだは、蒸留処理し
たロジンと活性剤と溶剤とからなるフラックスと粉はん
だとを混合することにより得られ、ロジンの蒸留処理は
、上記のはんだ付は温度下で沸騰するような成分を除去
し得るものであればよく、かかる条件下、一般の蒸留法
、減圧蒸留法、水蒸気蒸留法等を用いることができる。The cream solder used in the present invention is obtained by mixing powdered solder with a flux made of distilled rosin, an activator, and a solvent. Any method may be used as long as it can remove such components, and general distillation methods, vacuum distillation methods, steam distillation methods, etc. can be used under such conditions.
ロジンには、天然ロジン、水素添加ロジン、不均化ロジ
ン、重合ロジン等を使用でき、特に制限はない。ロジン
からの低沸点物の除去縫は、例えば１０〜１００ｍ１１
ｇの減圧蒸留下、初留分にして２％以上とすることが望
ましい。As the rosin, natural rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, etc. can be used, and there are no particular limitations. For example, stitching to remove low boiling point substances from rosin is 10 to 100 m11.
It is desirable that the initial distillate fraction be 2% or more under reduced pressure distillation of 100 g.
実施例 クリームはんだとして次のものを使用した。Example The following cream solder was used.
初留分を５％除去した天然ロジン ６０％アミン塩酸
塩 １％カルビＩ・−ル（溶剤
） ３７％カスターワックス
２％粉はんだ（Ｓ ｎ ６３％、２００メツシユ）
１２％プリヒート条件は、１５０℃、１分間とし、
はんだ付条件は２２０℃、約３秒とした。Natural rosin with 5% of the first distillate removed 60% Amine hydrochloride 1% Carbyl (solvent) 37% Castor wax
2% solder powder (S n 63%, 200 mesh)
The 12% preheat conditions were 150°C for 1 minute,
The soldering conditions were 220°C and about 3 seconds.
回路素子には、２．０ Ｘ １．３ Ｘ ０．５龍のチ
ップ抵抗器を使用した。かかる条件下、本発明により、
このチック抵抗器を１０００コはんだ付けした。A 2.0 x 1.3 x 0.5 inch chip resistor was used as the circuit element. Under such conditions, according to the present invention,
I soldered 1000 of these tick resistors.
一方、天然ロジンに、蒸留処理しないものを使用し、他
は−１−記実施例と同じ条件下で、チップ抵抗器を１０
００コはんだ付けした。On the other hand, using natural rosin that was not subjected to distillation treatment and under the same conditions as in Example 1-1, 10 chip resistors were fabricated.
00 soldered.
この比較例においては、はんだ何時にフラックスが沸騰
し、６％のはんだ付は不良が発生したが、上記実施例で
は１％以下の不良率であった。In this comparative example, the flux boiled at some point during the soldering, and 6% of soldering defects occurred, but in the above example, the defective rate was 1% or less.
〈発明の効果〉
本発明に係る電子部品のはんだ付は方法は、上述した通
りの方法であり、クリームはんだを用いてはんだ付けす
る場合、クリームはんだのフラックスのロジンを蒸留処
理しであるから、はんだ付は時でのフラックスの沸騰を
防止でき、軽量なチップ型回路素子でも移動なく所定の
位置にはんだ付けできる。<Effects of the Invention> The method of soldering electronic components according to the present invention is as described above, and when soldering is performed using cream solder, the rosin of the flux of the cream solder is distilled. Soldering can prevent flux from boiling over time, and even lightweight chip-type circuit elements can be soldered in place without movement.
図面は本発明に係る電子部品のはんだ付方法を示す説、
四囲である。
図において、２，２は回路導体、３，３はクリームはん
だ、４は回路素子である。The drawings illustrate a method for soldering electronic components according to the present invention;
It is surrounded by four walls. In the figure, 2 and 2 are circuit conductors, 3 and 3 are cream solder, and 4 is a circuit element.
Claims (1)
んだの粘着力によつて電子部品を所定の位置に仮固定し
、而るのち、プリヒートによつてクリームはんだ中の溶
剤を除去し、次いで、急速加熱によつてクリームはんだ
中のはんだによりはんだ付けする方法において、ロジン
系フラックスを予め蒸留処理しておくことを特徴とする
電子部品のはんだ付方法。Electronic components are temporarily fixed in place by the adhesive strength of cream solder made of powdered solder and rosin-based flux, and then preheated to remove the solvent in the cream solder, followed by rapid heating. A method of soldering electronic parts using solder in cream solder, characterized in that a rosin-based flux is distilled in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60188178A JPS6247193A (en) | 1985-08-26 | 1985-08-26 | Soldering of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60188178A JPS6247193A (en) | 1985-08-26 | 1985-08-26 | Soldering of electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247193A true JPS6247193A (en) | 1987-02-28 |
Family
ID=16219130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60188178A Pending JPS6247193A (en) | 1985-08-26 | 1985-08-26 | Soldering of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247193A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04317201A (en) * | 1991-04-17 | 1992-11-09 | Murata Mfg Co Ltd | Dielectric resonator |
| US6690584B2 (en) | 2000-08-14 | 2004-02-10 | Fujitsu Limited | Information-processing device having a crossbar-board connected to back panels on different sides |
| WO2004039869A1 (en) | 2002-10-31 | 2004-05-13 | Nippon Kayaku Kabushiki Kaisha | High-molecular weight derivatives of camptothecins |
| WO2007126046A1 (en) | 2006-04-27 | 2007-11-08 | Kabushiki Kaisha Yakult Honsha | Process for production of camptothecin derivative |
| US7488825B2 (en) | 2003-02-25 | 2009-02-10 | Kabushiki Kaisha Yakult Honsha | Method for preparing polymorphism of irinotecan hydrochloride |
| US7994186B2 (en) | 2005-04-18 | 2011-08-09 | Kabushiki Kaisha Yakult Honsha | Pharmaceutical compositions containing camptothecins |
| JP2019208021A (en) * | 2018-05-25 | 2019-12-05 | 日亜化学工業株式会社 | Method for manufacturing light-emitting module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159298A (en) * | 1983-03-01 | 1984-09-08 | Nippon Genma:Kk | Flux for soldering |
-
1985
- 1985-08-26 JP JP60188178A patent/JPS6247193A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159298A (en) * | 1983-03-01 | 1984-09-08 | Nippon Genma:Kk | Flux for soldering |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04317201A (en) * | 1991-04-17 | 1992-11-09 | Murata Mfg Co Ltd | Dielectric resonator |
| US6690584B2 (en) | 2000-08-14 | 2004-02-10 | Fujitsu Limited | Information-processing device having a crossbar-board connected to back panels on different sides |
| US7133292B2 (en) | 2000-08-14 | 2006-11-07 | Fujitsu Limited | Information-processing device having a crossbar-board connected to back panels on different sides |
| US7193861B2 (en) | 2000-08-14 | 2007-03-20 | Fujitsu Limited | Information-processing device having a crossbar-board connected to back panels on different sides |
| WO2004039869A1 (en) | 2002-10-31 | 2004-05-13 | Nippon Kayaku Kabushiki Kaisha | High-molecular weight derivatives of camptothecins |
| US7488825B2 (en) | 2003-02-25 | 2009-02-10 | Kabushiki Kaisha Yakult Honsha | Method for preparing polymorphism of irinotecan hydrochloride |
| US7994186B2 (en) | 2005-04-18 | 2011-08-09 | Kabushiki Kaisha Yakult Honsha | Pharmaceutical compositions containing camptothecins |
| WO2007126046A1 (en) | 2006-04-27 | 2007-11-08 | Kabushiki Kaisha Yakult Honsha | Process for production of camptothecin derivative |
| JP2019208021A (en) * | 2018-05-25 | 2019-12-05 | 日亜化学工業株式会社 | Method for manufacturing light-emitting module |
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