JPS624899A - Anode device for electroplating equipment - Google Patents

Abstract

PURPOSE:To improve the working rate of plating equipment and to stabilize the quality of the plating by dispensing with the replacement or taking out of a basket packed with fine grains of a soluble plating metal. CONSTITUTION:An anode device is arranged opposite to a metallic strip to be plated. The fine grains 4 of a plating metal is continuously supplied into a basket 3 supported by a carrier 15 in a plating bath from a hopper 8 through a feeder 9. An electric current is passed through the fine grains 4 of a plating metal in the basket 3 by a feeder conductor 14. The grains are pulverized while being eluted, moved downward and then continuously introduced into a filter means 11 through a recover pipe 10 which is provided at the lower part of the basket 3. The consumed solid fine grains of the plating metal is separated from a plating soln. The plating soln. is passed through a plating soln. discharge pipe 12 and recovered.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an anode device for electroplating equipment using a soluble anode.

<Prior art and its problems> In electroplating using a soluble anode, the use of fine-grained plating metal as the anode has conventionally been carried out as follows.

A basket-shaped power supply part is formed from a material that has a plating liquid property such as titanium, and is filled with fine particles of soluble plating metal.The basket-shaped part is immersed in a plating bath, and electroplating is performed by power supply.

By plating, the plating metal is consumed, and just before the plating metal in the basket disappears, the basket is taken out of the plating bath, and the scaret 7 is filled with ++f plating metal. Alternatively, a separate basket may be pre-filled with plated metal and placed in conjunction with the basket depleted of plated metal. This is disappearance 111
This is because there are many impurities in plated metal.

However, the above conventional method has the following drawbacks.

(1) Continuous plating cannot be performed due to the addition or removal of the pass-scaler 1 as the plating metal wears out.

C? ) Discontinuous plating reduces the operating rate of plating equipment and makes it difficult to stabilize plating quality.

(3) It becomes necessary to put in or take out the passkent, and additional costs are required.

<Object of the invention> The present invention has been made in view of the above-mentioned current situation.
f By eliminating the need to replace or take out the basket filled with soluble plating metal fine particles, it is possible to improve the operation rate of plating equipment. FI's objective is to provide an anode device for electroplating equipment that can be used.

<Structure of the invention> The above item [1] is achieved by the following present invention.

That is, the present invention is an anode device for electroplating equipment that is disposed opposite a metal slip to be plated.

A hopper that holds one soluble plated metal fine particle.

A basket configured to supply plated metal fine particles from this hopper and discharge the plated metal fine particles consumed by plating, and a solid liquid that separates the exhausted plated metal fine particles discharged from this basket from the plating solution. The present invention provides an anode device for electroplating equipment characterized by comprising a separation means.

The present invention also includes: An anode device for electroplating equipment, which is disposed opposite a metal strip to be plated.

a hopper for storing jrf-soluble plated metal fine particles; and a basket configured such that the plated metal fine particles are supplied from the hopper and the plated metal fine particles consumed by plating are discharged.

solid-liquid separation means for separating the consumable plating metal fine particles taken out from the basket 11 from the plating solution; The present invention provides an anode device for electroplating equipment, characterized in that it includes a plating solution flow generating device that generates a flow of plating solution.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The anode device for electroplating equipment according to the present invention will be described in detail below with reference to preferred embodiments shown in the accompanying drawings.

FIG. 1 diagrammatically shows an example of the structure of a plating tank in which an anode device 30 of electroplating equipment according to the present invention is arranged. FIG. 1 shows an example of a vertical plating tank, but the present invention It is not limited to this.

Plating solution 2 is circulated through plating 461, and soluble plated metal fine particles 4 are filled into basket 3 submerged in the plating solution by a method described later.

In FIG. 1, 5 is an object to be plated (cathode) such as a metal strip, 6 is a roll for supplying current to the cathode, and 7 is a zinc roll that guides and supports the object to be plated.

Next, an example of the configuration of the anode device 30 of the electroplating equipment of the present invention will be explained with reference to FIG. In the anode device of the present invention, plated metal fine particles are continuously supplied, and metal fine particles consumed by plating are automatically discharged. There's no need.

As shown in Figure 2, 8 is soluble plated metal fine grain 4
The plated metal fine particles 4 are continuously or intermittently fed from the hopper 4 via a feeder 9 into a basket 3 made of a plating solution-based material such as titanium. Basket is plated +61 with support 1
5 and properly positioned. Inside the hesket 1-3, the plated metal fine particles 4 are supplied with electricity by the power supply conductor 14, and during plating, they are eluted and consumed, becoming finer particles and moving downward, and are sent to a recovery pipe provided below the basket 3. It is continuously guided to the filtering means 11 from the IO. In the filtration means 11, solid-liquid separation between the consumable plating metal fine particles and the plating solution is performed, and the plating solution 2 is recovered through the plating solution discharge pipe 12.

In addition, in order to smoothly move and discharge the plated metal fine particles from the basket 3 through the recovery pipe 1O,
It is preferable to provide means for generating a flow of the plating solution in at least a portion of the passage through which the plated metal fine particles travel from the basket 3 to the discharge means 11 via the recovery pipe 10.

FIG. 2 shows an example of a plating solution flow generating device in which a plating solution jetting pipe 13 is provided in the recovery pipe 10.

By jetting out the plating solution continuously or intermittently from the spouting pipe 13, the fine plating metal particles 4 can be moved to be discharged, thereby causing the basket 3
Movement obstacles such as hanging of the fine plated metal particles 4 within the container can be prevented.

FIG. 3 shows an enlarged sectional view of the lower part of the basket 3 shown in FIG. Supported. As can be seen from this figure, fine plated metal particles 4 are filled in the basket 3.
Of these, only the fine plated metal particles 4, which have become coarsely refined due to wear during plating, are discharged into the recovery pipe 10 via the net 16 and the filtering net 17. Net 16 and filter net 17
The roughness of the pores is appropriately selected within a range that minimizes the elution of impurities from the plated metal fine particles.

Figure 4 shows a cross section of the basket 3.The side of the basket 3 facing the cathode should preferably have a triple structure of a net 19, a cloth 20, and a net 21.The inner net 21 is a circle made of fine plated metal particles. It is preferable to use a material with a small coefficient of friction to ensure smooth movement. Combined with the smooth movement by the net 21 and the movement by the plating liquid flow generating device described above, the plated metal fine particles can be moved even more smoothly, and movement obstacles such as shelf hanging are prevented.

In addition, the net 19 is caused by breakage of the plated object 5, etc. 20
It acts to reduce the frequency of damage.

11s 20 is thin] to prevent the plating solution from passing through.
It is preferable to leave it as is. This causes the plating solution 2 to flow from the second part of the basket 3 shown in FIG. 1, thereby cooling the plating metal fine particles 4, which are the anode, and making it possible to perform plating at a high current density.

The nets 19, 1j20, 21 are attached to the connecting member 27 by suitable fasteners such as screws 28,
The connecting member 27 is recessed into the back plate 23 and can be fixed in the plating tank l.

Note that 23 is the back plate of the basket, and 24 and 25 are the vertical and horizontal members assembled into the grid L.

Also, 27 is a connecting member between these members and the back plate 23, and at the same time, from here (uncovered part)! 'f board 2
3 and is configured to supply power to the plated metal fine particles.

<Effects of the Invention> Since the anode device of the present invention automatically supplies and discharges soluble plated metal fine particles, there is no interruption in plating unlike in the past, and the present invention provides an apparatus that generates a plating solution flow. If it is incorporated into an anode device, the automatic supply and discharge of the plated metal fine particles described above can be performed even more smoothly, and the plating solution flow has the effect of cooling the plated metal fine particles that become the anode, allowing plating at high current density. It can be carried out.

[Brief explanation of the drawing]

Figure 1 shows a state in which the anode device of the present invention is installed in a plating tank.
FIG. 2 is a diagrammatic cross-sectional view showing an island. FIG. 2 is a perspective view of the anode device of the present invention. FIG. 3 is a partial sectional view of the basket bottom of the anode device of the present invention. FIG. 4 is a cross-sectional view of the basket. Explanation of symbols 1...Plating tank, 2...Plating solution, 3...
Basket, 4...Soluble plated metal fine particles, 5...
... Plating object (cathode), 6... Current roll, 7.
・φ・Zinchlor, 8...hopper. 9...Feeder, 10...Recovery pipe, 11
...Discharge means, 12...Plating solution discharge pipe,
13... Plating solution piping for anode movement, 14... Power supply conductor, 15... Basket support, 16...
Net, 17...Sickness, 18...Support member, 19...Net, 20...Cloth, 21...
Net, 22...Basket elution prevention coating, 23
... Back plate, 24... Vertical member.

Claims (2)

[Claims] (1) An anode device for electroplating equipment, which is disposed opposite to the metal strip to be plated, and includes a hopper for storing soluble plating metal fine particles, and a plating metal fine particle supplied from this hopper, which is used for plating. An electroplating method comprising: a basket configured to discharge spent fine plated metal particles; and solid-liquid separation means for separating the spent fine plated metal particles discharged from the basket from a plating solution. Facility anode device. (2) An anode device for electroplating equipment, which is disposed facing the metal strip to be plated, and includes a hopper for storing soluble plated metal fine particles, and a plated metal fine particle supplied from this hopper, which is used for plating. a basket configured to discharge spent fine plated metal particles; a solid-liquid separation means for separating the spent fine plated metal particles discharged from the basket from a plating solution; and a space between the basket and the solid-liquid separation means. 1. An anode device for electroplating equipment, comprising: a plating solution flow generating device for generating a plating solution flow in at least a portion of a movement passage for plating fine metal particles.