JPS6252935U - - Google Patents
Info
- Publication number
- JPS6252935U JPS6252935U JP14472285U JP14472285U JPS6252935U JP S6252935 U JPS6252935 U JP S6252935U JP 14472285 U JP14472285 U JP 14472285U JP 14472285 U JP14472285 U JP 14472285U JP S6252935 U JPS6252935 U JP S6252935U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- main surface
- double
- elements
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の両面配線構造を示す断面図で
あり、第２図は実施例における両面配線の形成工
程図であり、第３図は実施例２の半導体断面図で
あり、第４図は実施例３の半導体断面図であり、
第５図は実施例４の半導体断面図であり、第６図
は実施例５の半導体断面図である。第７図は従来
例を示す横断面図である。
１……素子（または配線）、２……主面、３…
…裏面、４，１４，２４……スルーホール、７，
２７……半導体チツプ、１１……主面パツドメタ
ルパターン、１１′……裏面メタルパターン。
FIG. 1 is a cross-sectional view showing a double-sided wiring structure of the present invention, FIG. 2 is a process diagram for forming double-sided wiring in an embodiment, FIG. 3 is a cross-sectional view of a semiconductor in Example 2, and FIG. is a cross-sectional view of the semiconductor of Example 3,
FIG. 5 is a cross-sectional view of a semiconductor of Example 4, and FIG. 6 is a cross-sectional view of a semiconductor of Example 5. FIG. 7 is a cross-sectional view showing a conventional example. 1...Element (or wiring), 2...Main surface, 3...
...Back side, 4, 14, 24...Through hole, 7,
27...Semiconductor chip, 11...Main surface padded metal pattern, 11'...Back surface metal pattern.
Claims (1)
部分とを有し、 該エツチングした部分に素子または配線を形成
して成る両面配線構造。 ２ 主面に形成する素子または配線と裏面に形成
する素子または配線とをスルーホールを介して接
続することを特徴とする実用新案登録請求の範囲
第１項記載の両面配線構造。[Claims for Utility Model Registration] 1. A main surface on which an element or wiring is formed, and a part of the back surface which is the back side of the main surface is etched, and an element or wiring is formed on the etched part. Double-sided wiring structure. 2. The double-sided wiring structure according to claim 1, wherein the elements or wiring formed on the main surface and the elements or wiring formed on the back surface are connected through through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14472285U JPS6252935U (en) | 1985-09-21 | 1985-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14472285U JPS6252935U (en) | 1985-09-21 | 1985-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6252935U true JPS6252935U (en) | 1987-04-02 |
Family
ID=31055588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14472285U Pending JPS6252935U (en) | 1985-09-21 | 1985-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6252935U (en) |
-
1985
- 1985-09-21 JP JP14472285U patent/JPS6252935U/ja active Pending