JPS6252992U - - Google Patents
Info
- Publication number
- JPS6252992U JPS6252992U JP1985145282U JP14528285U JPS6252992U JP S6252992 U JPS6252992 U JP S6252992U JP 1985145282 U JP1985145282 U JP 1985145282U JP 14528285 U JP14528285 U JP 14528285U JP S6252992 U JPS6252992 U JP S6252992U
- Authority
- JP
- Japan
- Prior art keywords
- diode
- field effect
- effect transistor
- inverter device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electronic Switches (AREA)
Description
第1図は本考案に係る実施例を示す側断面図、
第2図は第1図の―線矢示方向断面図、第3
図は回路構成図、第4図乃至第7図は従来技術を
示し、第4図は外観図、第5図は回路構成図、第
6図は平面図、第7図は側面図である。
2,3……MOSFET(電界効果トランジス
タ)、4,5,6,7……ダイオード、13……
放熱器(放熱手段)、21……銅ベース板(基板
)。
FIG. 1 is a side sectional view showing an embodiment of the present invention;
Figure 2 is a sectional view in the direction of the - line arrow in Figure 1;
The figure is a circuit configuration diagram, FIGS. 4 to 7 show the prior art, FIG. 4 is an external view, FIG. 5 is a circuit configuration diagram, FIG. 6 is a plan view, and FIG. 7 is a side view. 2, 3...MOSFET (field effect transistor), 4, 5, 6, 7...diode, 13...
Heat radiator (heat radiating means), 21... copper base plate (substrate).
Claims (1)
されたインバータ装置において、 上記電界効果トランジスタとダイオードを同一
基板上に設置し、且つ該基板に接触させて放熱手
段を設けたことを特徴とするインバータ装置。[Claims for Utility Model Registration] In an inverter device composed of a field effect transistor and a diode, the field effect transistor and the diode are installed on the same substrate, and a heat dissipation means is provided in contact with the substrate. Features of the inverter device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985145282U JPS6252992U (en) | 1985-09-24 | 1985-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985145282U JPS6252992U (en) | 1985-09-24 | 1985-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6252992U true JPS6252992U (en) | 1987-04-02 |
Family
ID=31056677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985145282U Pending JPS6252992U (en) | 1985-09-24 | 1985-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6252992U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290098A (en) * | 1989-02-10 | 1990-11-29 | Fuji Electric Co Ltd | Cooling device for inverter apparatus |
| WO2013136623A1 (en) * | 2012-03-13 | 2013-09-19 | 富士電機株式会社 | Power converter and apparatus for controlling same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5761985B2 (en) * | 1975-10-11 | 1982-12-27 | Mitsubishi Electric Corp |
-
1985
- 1985-09-24 JP JP1985145282U patent/JPS6252992U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5761985B2 (en) * | 1975-10-11 | 1982-12-27 | Mitsubishi Electric Corp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290098A (en) * | 1989-02-10 | 1990-11-29 | Fuji Electric Co Ltd | Cooling device for inverter apparatus |
| WO2013136623A1 (en) * | 2012-03-13 | 2013-09-19 | 富士電機株式会社 | Power converter and apparatus for controlling same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6252992U (en) | ||
| JPS61207038U (en) | ||
| JPS6280392U (en) | ||
| JPS6113946U (en) | Cooling device for semiconductor devices | |
| JPS61192455U (en) | ||
| JPS62118453U (en) | ||
| JPS6081657U (en) | Heat sink for semiconductor devices | |
| JPS6318855U (en) | ||
| JPS6226095U (en) | ||
| JPH0385652U (en) | ||
| JPS6263944U (en) | ||
| JPH0238748U (en) | ||
| JPS6149456U (en) | ||
| JPS6294643U (en) | ||
| JPH01110490U (en) | ||
| JPS6260042U (en) | ||
| JPS6251755U (en) | ||
| JPS61119396U (en) | ||
| JPS6265895U (en) | ||
| JPS60144245U (en) | semiconductor equipment | |
| JPS6176963U (en) | ||
| JPS61121743U (en) | ||
| JPS6127270U (en) | printed wiring device | |
| JPS6221531U (en) | ||
| JPS6176998U (en) |