JPS625357B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a transmission device for transmitting low voltage and large current to a rotating body, and more particularly to a transmission device for a working unit that bonds and wires wires to a printed circuit board.

2. Description of the Related Art Electronic devices such as computers, electronic exchanges, and data communication equipment are becoming more advanced in functionality and performance year by year. Along with this, it has become essential for the electronic circuits to have higher density, and printed circuit boards, which are the base of the mounting system in which the electronic circuits are housed, have also become extremely dense. By the way, the wiring density of the printed circuit board is
Pad conductors with a diameter of approximately 1 mm are connected to through-hole conductors that penetrate through the back surface, and are arranged at 2 mm intervals, and multiple wiring pattern conductors run between adjacent pads, creating high-density wiring. . Connecting and wiring hair-thick thin insulating wires to a printed circuit board with such a high-density printed pattern is no longer done manually, resulting in connection errors, poor connections, and bridges (short circuits) between wiring patterns. The current situation is that it is not possible to deal with this issue due to such reasons. Therefore,
There is a need for an automatic wiring device that can perform error-free and highly accurate wiring on printed circuit boards with such high-density wiring without manual intervention. Such an automatic wiring device must be able to perform wiring in all directions on the surface of the printed wiring board, and therefore must have a structure that allows the feeding direction of the wire to be changed at will.

The object of the present invention is to provide a bonding wiring work unit that allows the wiring direction to be freely determined.
The present invention provides a device for transmitting large currents.

The present invention is a device for supplying power from a fixed main body to a rotating body via a set of cables, the insulator being rotatably attached to a column supported by the rotating body as a central axis. A rotary terminal is provided that has a disc and a connection terminal that is attached to the insulating disc and connects the cable on the main body side to the cable on the rotating body side, so that the cable can be easily connected from the case attached to the main body as the rotating body rotates. It is characterized by a driving force transmission device to the rotating body that can be pulled out.

Hereinafter, an embodiment in which the present invention is applied to an automatic wiring device for printed circuit boards will be described in detail. In this explanation, the head section corresponds to the rotating body, and the wire guide unit, bonding unit, and cutter unit correspond to the working unit. FIG. 1 is a perspective view showing the entire automatic wiring apparatus of this embodiment, and FIG. 2 is a block diagram showing its functional configuration. In FIG. 1, 1 is the main body of the automatic wiring device, 3 is an XY table on which the printed circuit board 11 to be wired is placed and moves in the X and Y directions, and 6 is positioned by the XY table. A head section is provided with various work units for bonding wires to printed circuit boards, a wire supply section 9 supplies wiring materials through the head section, and a wire supply section 7 is installed above the wire supply section 9. A TV camera was used to connect the printed circuit board 1 using a pipe with a built-in optical lens that penetrated the center of the head section 6.
It is designed to observe the surface of 1. 8 is a monitor television for displaying an enlarged image of the printed circuit board surface obtained from the camera 7 for the operator to monitor; 4 is a known electric device for manually fine-tuning the position of the printed circuit board 11 on the XY table 3; 2 is a low-voltage, high-current power supply for generating a bonding heat source; 5 is an operation panel section provided with operation buttons for operating the automatic wiring device; and 10 is a lamp that displays the operating status of the automatic wiring device. It is a display panel. 1
7 is a floppy disk (FD) that reads recorded data from the set floppy disk 16.
A reader 18 controls the FD reader 17.
In the FD control unit, as shown in Figure 2, there is a power supply 18 inside.
p, memory 18m and microcomputer 18
c built-in, and is connected to the automatic wiring device main body 1 via an interface 1i and a control section 1c. 19
is the microcomputer 18c of the FD control 18
(Fig. 2) is a console typewriter for issuing various operating instructions.

FIG. 3 shows details of the head section 6 and its related parts. A fixed cylinder 602 is fixed inside a case 616 of the main body of the device, and the fixed cylinder 602
A rotating cylinder 601 rotatably supported is housed inside. Furthermore, a monitor lens barrel 60 is inserted through the center of the rotating cylinder 601 and the head portion 6.
6 is provided and fixed to the case 616. A head section 6 is attached to the lower part of the rotary barrel 601, and a bonding unit 607, a wire cutter unit 609, and a wire guide unit 610 are arranged in a circumferential manner around the lower part of the monitor lens barrel. installed. Further, a lighting unit 611 for illuminating the wiring surface of the printed circuit board 11 on which wiring is applied is attached to the main body case 616 so as to emit illumination light diagonally downward from a position that does not interfere with the operation of the unit. It is being Of course, this illumination unit 611 may be attached to the head portion 6 and rotated together with other units. The head section 6 is rotated by the rotational drive of the pulse motor 604.
When the gear 603b is rotated, the rotating cylinder 601 is rotated via the gear 603a. In order to detect the rotational position of the rotary cylinder 601, a pulse generator 605 outputs pulses proportional to the rotation of a gear 603d rotating integrally with the rotating cylinder 601 via a gear 603c. . By counting these pulses, the rotational movement position of each work unit attached to the head section 6 can be known. Head part 6
Each work unit 607, 60 attached to
The driving force for performing various operations (details will be described later) of 9 and 610 is provided by air pressure. Fixed cylinder 6
Air pressure is applied to a large number of air supply pipes 617 attached to the cylindrical surface of the 02, and is sent to a large number of air transmission tubes 615 via an air pressure transmission mechanism described later, and is sent to each unit via the head section 6. Supplied. 614 is a wire guide pipe that is a wire passage for supplying a bonding wiring wire to the wire guide 612 at the tip of the wire guide unit 610; 634 is a very thick cable that supplies current for generating a bonding heat source;
620 connects the cable 63 via the relay terminal 619
4 and is connected to the low voltage, large current source 2 of the main body 1 (FIG. 1) via a movable connection mechanism (details will be described later) incorporated in the case 613.

Next, each work unit attached to the head section 6 will be explained in detail. Conceptual diagrams of the operations of these work units are shown in FIGS. 4 and 5. Fourth
As shown in the figure, a certain amount of the bonding wire 664 is fed out to the tip guide 612 of the wire guide 610, and the wire guide 610 is lowered until the wire 664 contacts the conductor pad 8 to be bonded. In this state, the bonding unit 607 is lowered by a certain amount, the bonding chip 645 is pressed against the wire 664 on the pad 8, and a current is applied to the chip 645. The current causes the chip 64
5 generates heat and connects the wire 664 to the conductor pad 8. The connection between this wire 664 and the conductor pad 8 is as follows:
By applying solder to the conductor pads 8 in advance, soldering can be performed without supplying solder.
Furthermore, by using a wire 664 coated with a resin material such as polyurethane that melts and can be removed at about the melting temperature of the solder, the wire 664 can be coated with a resin material such as polyurethane that can be removed at about the melting temperature of the solder.
45, the core wire of the wire is exposed only in the part to be soldered, and no special coating removal work is required. Thereafter, the printed board 7 is moved to the right in the figure, and the other end of the wire 664 is placed on the conductor pad 9 as shown in FIG. Similarly to the above, the chip 645 is lowered, a current is passed through the chip 645 to generate heat, and the wire 664 is soldered to the pad 9. Next, the wire cutter unit 609 (FIG. 4) is lowered, and the wire 645 is cut by force with the cutter 652 attached to its tip.

Detailed views of each unit for performing such operations are shown in FIGS. 6 to 8. FIG. 6 is a front view of the wire guide unit 610, and FIG. 7 is a sectional view showing the wire feeding mechanism 667 of the unit 610.
FIG. 8 is a front view showing the cutter unit 609 and bonding unit 607 integrated. In FIG. 6, the wire guide unit 6
10 is connected to the head portion 6 (third
A support rail 674 is attached to the rail 674 with an inclination at a certain angle, a wire guide movable part 675 is slidably supported on the rail 674, and the rail 67
4 and a cylinder 660 that moves the movable part 675 up and down along the rail 674. Reference numeral 667 is a feeding mechanism that feeds out the wire 664 inserted into the wire guide pipe 612, and is integrated with the movable part 675. The arm 668 is fixed to the movable part 675, and when the movable part 675 moves up and down, it hits an upper end switch (micro switch) 669 and a lower end switch 672, so that the up and down movement of the movable part 675 can be checked by the output of the switch. It's getting old.
The cylinder 660 is driven by air pipes AW1 and AW.
By supplying air to AW2, for example, if air is supplied to AW1, it will descend, and if air is supplied to AW2, it will rise.

Next, the structure of the wire feeding mechanism 667 will be explained with reference to FIG. A wire feeding mechanism 667 fixed to the wire guide movable part 675 is configured to move the wire 66
A cylinder 662 that operates to sandwich the cylinder 4 is slidably attached to the movable part 675 in the longitudinal direction A, and a cylinder 661 that moves the cylinder 662 in the direction A is provided. The wire 664 is fed out by supplying air to these two cylinders from air pipes AW3 and AW4. The wire guide unit 610 described above is schematically shown in FIG. 10 for easy understanding. Its operation is air pipe
When air pressure is applied to AW1, the cylinder 621 lowers the movable member 675 and the wire guide 612 approaches the pad 8 of the printed board 7 (Fig. 4). Next, when air pressure is applied to the air pipe AW4, the cylinder 662 moves down. By holding the wire 664 and applying air pressure to the air pipe AW3, the cylinder 661 becomes the wire holding part 66 including the cylinder 662.
3 is lowered, and a certain amount of wire 664 is paid out.

Next, the structure of the cutter unit 609 and bonding unit 607 will be explained with reference to FIG. These units 609 and 607 include a rail 651 that is inclined at a constant angle and is attached to the head portion 6 (FIG. 1) via a support member 655, and the rail 65
The cylinder 6 is mounted so as to be movable up and down along the cylinder 1.
A movable member 656 that is moved up and down by the cylinder 64 engages with a fulcrum 646 at the lower end of the movable member.
2, the bonding arm 6 moves in seesaw motion by
44, and a cutter arm 6 that engages with another fulcrum 654 and moves in seesaw motion by the cylinder 643.
It is composed of 53. cutter arm 65
A cutter 652 is attached to the tip of the cutter 652, and its position is adjusted in advance so that when the cylinder 643 performs a downward seesaw operation, it draws an arc that is almost vertical at the position where it hits the printed board surface. shall be. A bonding tip 645 is attached to the tip of the bonding arm 644, and when the cylinder 642 performs a downward seesaw movement, the bonding arm 644 is positioned in advance so that it forms an arc that is almost perpendicular to the printed board surface. The following adjustments shall be made. By acting (pressing) vertically at the printed board surface position in this manner, the wire will not shift or the cutter 652 and tip 645 will not shift from their predetermined positions, making it possible to perform precise bonding and wire cutting. In addition, the see-saw movement of the bonding tip 645 is always applied with a downward force by a spring spring 647, and the cylinder 64 is always
2 presses the right end of the arm 644 in FIG. By releasing the pressing force of the cylinder 642 (reducing the air pressure of the pipe Ab3) only during bonding, the downward force is generated only by the pressing force of the spring 647, so that the wire can always be bonded with a constant pressing force. It has been devised. This operation is schematically shown in FIG. In particular, since wires as thin as a hair are bonded, if the pressing force is too large, the wire may be cut or the pad may be damaged.On the other hand, if the pressing force is too small, heat transfer will be poor and flow soldering may occur on the pad surface. The bonding cannot be melted, resulting in defective bonding, which greatly affects the reliability of the connection. Therefore, keeping the pressing force constant is very effective when performing precise wiring on a printed board with a high-density wiring pattern. air pipe
Ab1 provides air pressure to lower the movable member 656 to which the cutter unit 609 and bonding unit 607 are attached, and the air pipe Ab2
provides air pressure to raise it.
The air pipe Ab3 provides air pressure to normally keep the bonding arm 644 raised, and is lowered by reducing the air pressure during bonding. The air pipe Ab4 supplies air for lowering the cutter arm 653.
These air pipes receive air pressure from corresponding pipes among the large number of pipes 615 in FIG.

Next, the air transmission mechanism from the fixed cylinder 602 (FIG. 3) to the rotating cylinder 601 (FIG. 3) provided inside the stationary cylinder 602 (FIG. 3) will be described. FIG. 11 is a partially sectional view showing how the rotating cylinder 601 is incorporated into the fixed cylinder 602, and FIG. 12 is a partially enlarged sectional view thereof. In Figure 11, 624
Numeral air supply ports are arranged in parallel on the cylindrical surface of the fixed cylinder 602, and are connected to the air supply pipe 617 shown in FIG. The fixed cylinder 602 is fixed to a main body case 616, and rotatably supports the rotating cylinder 601 therein via vertical bearings 623 and 626. The rotary cylinder 601 has a large number of independent vertical holes 627 arranged circumferentially in the wall constituting the rotary cylinder. The upper part of each vertical hole 627 is sealed with a sealing screw 628, and each of the air supply ports 627
It's starting to become familiar to me. Furthermore, this vertical hole 627
communicates with an air supply port 625 provided at the bottom of the rotating cylinder, and this air supply port 625 is connected to an air pipe 615 shown in FIG. The mechanism for transmitting air pressure between the vertical hole of the rotating cylinder 601 and the horizontal hole 632 of the stationary cylinder 602 will be explained in detail with reference to FIG. In FIG. 12, the gap between the rotating cylinder 601 and the fixed cylinder 602 is vertically sealed and divided by a large number of O-rings 633, and the upper and lower O-rings 6 in the horizontal hole 632
The air pressure from the hole 632 flows through the vertical hole 6 without leaking through the ring-shaped gap defined by the hole 633.
27. Due to this ring-shaped gap, even if the rotating cylinder 601 rotates and the position of the vertical hole 627 moves, the air pressure supplied from the horizontal hole 632 of the fixed cylinder 602 is always transferred to the vertical hole 627 of the corresponding rotating cylinder.
will be supplied without leakage to others. This O-ring 633 is attached to the fixed cylinder 63 so that there is no vertical movement.
2 or the outer surface of the rotating cylinder 602 is provided with a recess that can hold the ring.

Next, a movable connection mechanism for sending a low voltage and large current to the bonding unit 607 which is rotated by the head portion 6 will be explained. FIG. 13 is a partial sectional view of the movable connection mechanism, FIG. 14 is a sectional view of a portion thereof, and FIG. 15 is a diagram for explaining its operation. In Figure 13, 630
is a cylindrical movable case attached to the outer periphery of the rotary cylinder 601 via an angle 629, and is structured to form a space around which the cable 618 can be accommodated. 613 is main case 6
16 and protects the cable 618 from jumping out (indicated by the dashed-dotted line in FIG. 3). Note that the air pipe 615 is housed in a space inside the movable case 630 in a portion close to the rotating cylinder 601. This cable 618 passes through a guide roller 631 from another fixed case 636 and is housed in a circumferential space made up of a fixed case 613 and a movable case 630, and the tip of the cable is connected to a rotary terminal provided at an angle 629. 63
5 (Fig. 14). Another cable 62 is connected via the rotary terminal 635 (FIG. 14).
0, the cable 620 is connected to the rotating cylinder 60
It is connected to a relay terminal 619 attached to 1. The rotary terminal 635 is designed to be able to freely rotate in order to prevent the cable fastening portion from loosening and to facilitate the cable being routed around the inside of the case 613 as shown in FIG. 15. The structure of this rotary terminal 635 is such that a column 635b is vertically attached to the rotating cylinder 601 via an angle 629, and a bearing 635b is attached to the top of the column 635b.
A disc-shaped insulating member 635a is rotatably attached via 35d. 2 of the disc member 635a
A connection terminal 635c is implanted at this location, and a cable 618 from a fixed case 636 is connected to the upper end of this terminal 635c, and a cable 620 from a terminal 619 attached to the rotating cylinder is connected to the lower end of the terminal 635c.
is connected. This terminal 635c and the disk 63
5a may be fixed, but if the terminal 635 itself is pivoted so that it can rotate, the cable routing will be smoother. Cable 61 from fixed case 636
8 will be explained with reference to FIGS. 15a to 15c. When the rotary terminal 635 is at the position closest to the cable outlet, that is, at the position closest to the roller 631, most of the cable 618 is housed in the case 636 in a hanging state as shown in FIG. 15a. . The rotating cylinder 601 is shown in FIG. 15b.
When the rotating cylinder 601 rotates to the left, the rotary terminal 635 revolves and the cable 61
8 from the fixed case 636. When the cable is pulled out, the guiding roller 631 rotates as the cable moves and serves to guide the cable being pulled out. In this example, it is possible to rotate to the left up to a maximum rotation angle of 190 degrees, and to the right, it is possible to rotate to a maximum rotation angle of -190 degrees, but the thickness and hardness of the cable It goes without saying that if the conditions such as this change, the rotation angle can be increased accordingly. When moving from the state shown in FIG. 15b to the state shown in FIG. 5c, the cable 618 is moved to the state shown in FIG. 15a.
is once pushed into the case 636 by the rightward revolution of the rotary terminal 635, and then pulled out as shown in FIG. 15c. Since the cable is terminated at the rotary terminal 635 that revolves and rotates and is housed in a circumferential shape at a constant angle, the cable 618 can be easily connected to the rotating body even with very thick wires, and thus the cable 618 can be easily connected to the rotating body. Large current can be supplied without any problems.

Above we have explained each part of the device of this embodiment, but next we will explain how the entire operation is performed.
The flowchart is shown in Figure 6. The process will be explained below according to the flowchart shown in FIG. FIG. 17 shows an example of a logical configuration for explaining the flow of each signal that executes the flow operation. Figures 16 and 17 below.
This will be explained using figures.

First, the printed circuit board to be wired is set on the XY table 3 shown in FIG. 1, and positioned at a predetermined position. Next, the floppy disk 16 on which wiring data has been recorded is inserted into the FD reader 17 as shown in FIG. Next, when the operation start button (not shown) on the operation panel 5 is pressed, an operation start signal (not shown) is generated from the control unit 1c in FIG. 17 to the microcomputer 18c via the input line 711 of the interface 1i. and the microcomputer 18c
A read command 710 is issued to the FD reader. From floppy disk (FD) 16 to a certain amount (e.g. 64
When the wiring instruction data (64 words) for instructing the wiring of the book is read into the memory 18m via the FD reader 17, the operation of the flow shown in FIG. 16 is started. The operations of each flow shown in FIG.
i to the control section 1C, and the control section 1C instructs each section to generate mechanical driving force. Generating this driving force means driving the pulse motor M _X that moves the XY table 3 in the X direction, driving the pulse motor M _Y that moves the XY table 3 in the Y direction, and driving the air valve V ₀ ~ that sends air to the air pipe 617. This refers to opening and closing _V7 , supplying large current for bonding, etc.

The MC 18c reads one data (one word) from the memory 18m (flow in FIG. 16). The pad direction information is taken in from the control information _C0 of the read data, and the difference (deviation angle Δθ) from the current rotation angle of the head portion 6 is determined and included in the control information ΔC. Similarly, take _{in the} XY address information
is transferred to the register 701 of the control unit 1C via the interface 1i. The following MC18c is the 16th
Control information △ for each block of the flow in the diagram
C and transfer it to the register 701. Among the information set in the register 701, the control information △C is taken into the control circuit (CONT) 702 and the corresponding
When CONT702 receives the deflection angle Δθ value from ΔC and applies it to the pulse generator (PGθ), the deflection angle Δθ
A number of pulses proportional to is supplied to the pulse motor 604. The pulse motor 604 is rotated by the pulse, and the head section 6 is rotated via the gear 603, and is aligned with the direction of the wiring starting point pad (first
6 diagram flow, ). At this time, the rotation angle of the head section 6 is counted by a pulse counter 605 via a gear 603, and a pulse signal 7 is output from the counter 605.
13 is sent to the control circuit (CONT) 702.
The CONT 702 counts this pulse signal 713 and uses the count result as count information to send it to the MC 18 via the input line 711 of the interface 1i.
Transfer to c. When the MC 18c receives the count information, it updates the current head rotation angle information with the count information.

Next, the CONT 702 issues signals 714 and 715 to open the gates 703 and 704, and the address information △x, △Y set in the register 701
is transferred to pulse generators PGX and PGY. The pulse generator PGx generates a pulse signal proportional to the value of the address information Δx and supplies it to the pulse motor _Mx . The pulse motor Mx is driven by the pulse signal to move the table 3 in the X direction. Similarly, the pulse generator PGY also gives a pulse signal proportional to the value of the address information ΔY to the pulse motor M _Y , and the motor M _Y moves the table 3 in the Y direction (first
6 diagram flow). Through the above operations, the wiring starting point pad 8 of the printed circuit board 7 is positioned at the point of action of each unit as shown in the upper part of FIG. 4.

Next, as shown in Fig. 4, the wire guide unit 610
The wire guide 612 is lowered so that its tip approaches the pad 8 (see the flowchart in FIG. 16).
For this lowering, the CONT 702 in FIG. 17 detects an instruction to lower the wire guide from the control information ΔC of the register 701, and outputs a signal to open the air supply valve V ₀ for a certain period of time. When the valve V ₀ is opened for a certain period of time by this signal, air pressure from the air pressure generator AG is applied to the air supply pipe 617 via the valve V ₀ and finally to the register 660 via the pipe AW1 in FIG.
is pressed, and the wire guide movable part 675 is lowered. Next, in order to pay out the wire 664 as shown in the lower part of FIG. 4, the CONT 702 in FIG. Then, open air supply valves V ₂ and V ₃ for a certain period of time.
As a result, when air pressure is applied to the same pipe of the wire feeding section 667 in FIG. 7 via the pipes AW3 and AW4 in FIG.
64 and the cylinder 6 together with the cylinder 664.
By pushing leftward at 61, the wire 664 is fed out at a constant pitch (flow in FIG. 16). The first thing to check when performing this action is whether or not the unrolling was performed reliably.
Detected by a wire tension change detector (not shown) provided in the wire supply section 9 shown in the figure,
Input line 7 of interface 1i from CONT702
A feeding confirmation signal is sent to the MC 18c via 11 (flow in FIG. 16). When the MC 18c learns that this confirmation signal cannot be obtained within a certain period of time, it is treated as an error, an error is displayed on the display section 10 of FIG. 1 (details not shown), and the operation is stopped. Once this confirmation signal is obtained, CONT70 in Figure 17
2 takes in the bonding voltage instruction from the control information ΔC of the register 701, and outputs the voltage setting section 2 of FIG.
A set voltage is specified via the signal line 716 in FIG. 17, and an appropriate voltage corresponding to the size of the wire and pad is prepared to be output from the bonding power supply (PS) 637 in FIG. Figure Flow).

Next, insert the bonding chip 6 as shown in the lower part of Figure 4.
45 (flow in Figure 16), this lowering is done in two stages: lowering of the bonding unit 607 and pressurizing the chip 645 attached to the unit (arc-shaped lowering). First, in order to lower the bonding unit 607, an instruction to lower the bonding unit is received from the control information ΔC of the register 701, and the valve V ₄ in FIG.
Gives a signal to open. When the valve V ₄ is opened by this signal, air pressure is applied to the pipe Ab ₁ of FIG. 8 through the pipe 617 in the same manner as described above, and the cylinder 641 moves down the movable member 656. As a result, the bonding arm 644 and the cutter arm 653 attached to the movable member 656 are lowered. Next, CONT702 shown in Fig. 17 is used to pressurize the bonding tip (flow shown in Fig. 16).
receives a tip pressurization instruction from the control information ΔC of the register 701, closes the valve _V5 for a certain period of time, and transmits the air pressure reduction to the pipe Ab3 in FIG. Due to the reduction in air pressure, the cylinder 642 changes from pressing the right end of the arm 644 to no pressure, and the spring 647 lowers the arm 644 in a see-saw manner, and the tip 645 attached to the tip of the arm 644 moves downward. 4
As shown in the lower part of the figure, the wire 664 is pressed against the starting point pad 8. Next, a bonding current application instruction is taken from the control information ΔC of the register 701 in FIG. 17, and the bonding current of the power supply (PS) 637, which is set to a predetermined voltage as described above, is output to the terminal 619 in FIG. Instructions via signal line 717
Give to PS637. The bonding current output from PS637 is transmitted through cable 618, rotary relay terminal 635, cable 620 in FIG.
The chip 645, which is applied to the cable 634, arm 644, and chip 645 in FIG. 8 through the relay terminal 619 and cable 634 in FIG. 3, and pressurizes the wire 664, generates resistance heat (flow in FIG. 16). The heat generated by the chip 645 heats the wire 664 and pad 8 in FIG.
At the same time as the insulating coating is melted and removed, the solder previously attached to the surface of the pad 8 is melted and the wire 664 and the pad 8 are soldered together.

Next, CONT 702 in FIG. 2 receives a bonding tip raising instruction from control information ΔC in register 701 and opens valve V ₆ in accordance with the instruction, and air pressure is sent to pipe Ab 3 in FIG. The cylinder 642 presses the right end, and the tip 645 attached to the left end of the bonding arm 644 rises in an arc shape (FIG. 16 flow). Subsequently, the CONT 702 takes in an instruction to raise the bonding unit from the control information ΔC, and opens the valve _V5 in accordance with the instruction. When the valve _V5 opens, air pressure is sent to the pipe Ab2 in FIG.
4 will rise (flow in Figure 16).
In this way, the bonding work to the starting point pad 8 shown in FIG. 4 is completed.

Next, as shown in FIG. 5, the operation of pulling out the wire 664 whose one end is bonded to the starting point pad 8 to the ending point pad 9, bonding it to the ending point pad 9, and cutting it will be described. First, in order to take in the next data, the MC 18c reads the second data 1 from the memory 18m (flow in FIG. 16). MC1
After reading data 1, 8c obtains the deviation addresses △x, △Y in the same way as the flowchart in FIG. Register 7 of control unit 1c
Transfer to 01. Below is the flow mentioned earlier,
By performing the same operation as above, the head is aligned with the wiring direction (flow), the XY table is moved (flow), and the wire 664 is stretched from pad 8 to pad 9 as shown in FIG. At this time, it is checked by tension detection or the like that the wire 664 is pulled out from the wire bobbin 15 in FIG. 1 due to the movement of the XY table (flow).

Next, in order to bond this wire 664 in accordance with the direction of the pad 9 (Fig. 5), the pad deviation angle is determined (flow) in the same manner as in the flow described above, and the head is rotated by the deviation angle. (flow), and as in the flow described above, wire feeding (flow), feeding check (flow), bonding voltage setting (flow), bonding unit lowering (flow), bonding tip pressurization (flow) , application of bonding current (Flow 〓), and raising of the bonding chip (Flow 〓).

Next, in order to cut the left end of the wire 664 shown in Fig. 5, air pressure is applied to the pipe Ab4 shown in Fig. 8. Therefore, the following explanation will be omitted and will be explained assuming that air pressure is supplied to each cylinder.) The cylinder 643 is connected to the cutter arm 6.
53 is lowered (FIG. 16 flow diagram), the cutter 652 cuts the left end of the wire 664 in FIG. 5, and the wiring between the pads is completed. Next, after a certain period of time, the air pressure in the cylinder 643 is reduced, and the cutter arm 653 is raised by a spring (not shown) (flow). Next, air pressure is supplied to the pipe Ab2 in FIG. 8, and the cylinder 641 pulls up the bonding unit 607 and cutter unit 609 (flow). Next, air pressure is applied to the pipe AW2 in FIG. 6, and the cylinder 660 pulls up the wire guide movable part 675 (flow).

Next, the MC 18c in FIG. 17 checks whether the next data 2 (not shown) exists in the memory 18m (flow), and if there is data, returns to the first flow in FIG. Repeat until it's gone. If there is no data in the memory 18m in Figure 17, the MC will newly read the FD reader 1.
7 to read new wiring data (for example, 64 words), write the wiring data in the memory 18m, and repeat the operation from the flowchart of FIG. 16. In this way, when the wiring data on the floppy disk 16 is also used up, the wiring operation ends.

In the embodiments described above, the wiring data input means is an example of a floppy disk, but it is also possible to input by paper tape, paper card, mark card, mark sheet, magnetic tape, magnetic disk, magnetic card, and other input means. Needless to say. Furthermore, it goes without saying that the wiring data may be directly inputted one by one into the microcomputer MC from the input means without temporarily storing a fixed amount of wiring data in the internal memory (core memory, IC memory, etc.). In addition, as a wiring data processing means for processing wiring data data by data, AND gate, OR gate,
Needless to say, it may be realized by combining logic elements such as flip-flops, or it may be realized by a microprogram. It goes without saying that the function of the wiring data processing means may be provided to the main body control section side without giving the various commands shown in the flowchart in FIG. 16 from the wiring data processing means to the main body control section 1C. do not have. It goes without saying that instead of using air pressure to perform the mechanical operations of each unit, hydraulic pressure may be used, or electrical signals may be applied to cause the units to operate magnetically.

As described above, the present invention provides the following effects.

(1) If a large current is supplied to a work unit that rotates around a vertical axis through a circumferential area that does not include the vertical axis, the area of the axis may be reserved for other uses. Since wiring work can be monitored in the shaft area, accurate monitoring from the vertical direction of the printed circuit board is possible.

(2) If a rotary terminal capable of revolution and rotation is provided in a donut-shaped case and a very thick cable is connected through the terminal, and the cable is housed in the case in a circumferential manner, the rotational movement of the working unit will be affected. Allows for smooth transmission without causing any damage.

[Brief explanation of the drawing]

FIG. 1 is an overall perspective view of a printed circuit board wiring device according to an embodiment of the present invention, FIG. 2 is a diagram showing the configuration of its functional blocks, and FIG. 3 is a head section 6 of FIG. 1.
4 and 5 are views showing how wiring is applied to the printed circuit board, and FIG. 6 is a front view of the wire guide unit 610 of FIG. 3.
FIG. 7 is a cross-sectional view of the wire rod feeding part 667 in FIG.
FIG. 8 shows the bonding unit 607 of FIG.
A front view of the cutter unit 609, FIG.
10 is a conceptual diagram showing the operation of FIG. 6, FIGS. 11 and 12 are sectional views showing the air pressure transmission device to the rotating body (head part), The figure is a cross-sectional view showing a device that accommodates a cable that transmits a large current for bonding to a working unit, Figure 14 is an enlarged cross-sectional view showing its rotary relay terminal, and Figures 15 a to c are how the cable is housed. 16 is a flowchart showing the operation of the present wiring device, and FIG. 17 is a diagram showing the logic of the present wiring device. 1... Main body, 2... Voltage setting section, 3... XY table, 6, 4... Head section, 7... Monitor camera section, 11... Printed wiring board, 16... Floppy disk, 17... Flotspy disc (FD)
Reader, 18...FD control unit, 1C...control unit,
601... Rotating cylinder, 602... Fixed cylinder, 60
6... Monitor optical system tube, 607... Bonding unit, 609... Wire cutter unit,
610... Wire guide unit, 644... Bonding arm, 645... Bonding chip, 646... Fulcrum, 647... Spring, 652...
...Cutter, 633...Ring, 635...Rotary terminal, 630...Movable case, 613...Fixed case, 618, 634...High current cable.

Claims (1)

[Claims] 1 A device for supplying power via a set of cables from a fixed main body to a rotating body that rotates around a substantially vertical axis, which includes a case attached to the main body and housing the cable, and a case that is attached to the main body and houses the cable, and the rotating body. a rotary terminal having an insulating disc rotatably attached to the central axis around a support supported by the insulating disc; and a connecting terminal attached to the disc for connecting the cable on the main body side to the cable on the rotating body side; A device for transmitting driving force to a rotating body, comprising: a donut-shaped case that accommodates the cable that is fixed around the rotating body and pulled out from the case as the rotating body rotates.