JPS625635U - - Google Patents
Info
- Publication number
- JPS625635U JPS625635U JP9708885U JP9708885U JPS625635U JP S625635 U JPS625635 U JP S625635U JP 9708885 U JP9708885 U JP 9708885U JP 9708885 U JP9708885 U JP 9708885U JP S625635 U JPS625635 U JP S625635U
- Authority
- JP
- Japan
- Prior art keywords
- resist film
- coated substrate
- plate
- heating body
- shaped heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Coating Apparatus (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Description
第１図は本考案に係る熱処理装置の一実施例を
示す外観斜視図、第２図ａ，ｂは同装置の一部破
断正面図および部分的右側面図、第３図は熱プレ
ートの透視図、第４図は本考案の他の実施例を示
す熱処理装置の斜視図、第５図ａ，ｂは同装置の
一部破断正面図および部分的側断面図、第６図は
クリーンオープンを使用した従来装置の一部破断
斜視図、第７図はホツトプレートを使用した従来
装置の断面図である。
３……フオトマスクブランク、９……基板、１
１……レジスト膜、２０……熱プレート（板状加
熱体）、２１……ヒーター、２３……板体、２４
……ホルダー、２５……温度制御・調整用コント
ローラ、２８……放熱板、３０……バイメタル、
５０……箱体、５１……ホルダー。
Figure 1 is an external perspective view showing one embodiment of the heat treatment apparatus according to the present invention, Figures 2a and b are a partially cutaway front view and a partial right side view of the same apparatus, and Figure 3 is a transparent view of the heat plate. 4 is a perspective view of a heat treatment apparatus showing another embodiment of the present invention, FIGS. FIG. 7 is a partially cutaway perspective view of the conventional device used, and FIG. 7 is a sectional view of the conventional device using a hot plate. 3...Photomask blank, 9...Substrate, 1
1... Resist film, 20... Heat plate (plate-shaped heating body), 21... Heater, 23... Plate body, 24
...Holder, 25 ... Temperature control/adjustment controller, 28 ... Heat sink, 30 ... Bimetal,
50...Box body, 51...Holder.
Claims (1)
付基板を加熱処理する熱処理装置において、前記
板状加熱体に前記レジスト膜付基板のレジスト膜
を対面させて前記レジスト膜付基板を保持する放
熱手段を備えたホルダーと、前記レジスト膜付基
板近傍の温度を感知する温度感知手段とを設け、
前記板状加熱体と前記ホルダーとは離間して配置
されていることを特徴とする熱処理装置。 In a heat treatment apparatus that heats a resist film-coated substrate with a plate-shaped heating body having a built-in heat source, the heat dissipation device holds the resist film-coated substrate with the resist film of the resist film-coated substrate facing the plate-shaped heating body. a holder equipped with a means, and a temperature sensing means for sensing the temperature near the resist film coated substrate,
A heat treatment apparatus characterized in that the plate-shaped heating body and the holder are arranged apart from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985097088U JPH0234822Y2 (en) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985097088U JPH0234822Y2 (en) | 1985-06-26 | 1985-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS625635U true JPS625635U (en) | 1987-01-14 |
| JPH0234822Y2 JPH0234822Y2 (en) | 1990-09-19 |
Family
ID=30963661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985097088U Expired JPH0234822Y2 (en) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0234822Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101877403B1 (en) * | 2016-01-12 | 2018-07-13 | 에이피시스템 주식회사 | Substrate processing apparatus and method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10206691B2 (en) | 2015-10-29 | 2019-02-19 | Medtronic Xomed, Inc. | Method and apparatus to select vibration |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52142972A (en) * | 1976-05-25 | 1977-11-29 | Toshiba Corp | Semiconductor production device |
| JPS5726433A (en) * | 1980-07-23 | 1982-02-12 | Hitachi Ltd | Bake of photoresist or the like and apparatus therefor |
| JPS5961027A (en) * | 1982-09-29 | 1984-04-07 | Toshiba Corp | Semiconductor substrate heating apparatus |
| JPS59211243A (en) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | Semiconductor substrate treating device |
-
1985
- 1985-06-26 JP JP1985097088U patent/JPH0234822Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52142972A (en) * | 1976-05-25 | 1977-11-29 | Toshiba Corp | Semiconductor production device |
| JPS5726433A (en) * | 1980-07-23 | 1982-02-12 | Hitachi Ltd | Bake of photoresist or the like and apparatus therefor |
| JPS5961027A (en) * | 1982-09-29 | 1984-04-07 | Toshiba Corp | Semiconductor substrate heating apparatus |
| JPS59211243A (en) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | Semiconductor substrate treating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101877403B1 (en) * | 2016-01-12 | 2018-07-13 | 에이피시스템 주식회사 | Substrate processing apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0234822Y2 (en) | 1990-09-19 |