JPS6256591A - 電気めつき方法 - Google Patents

電気めつき方法

Info

Publication number
JPS6256591A
JPS6256591A JP19555085A JP19555085A JPS6256591A JP S6256591 A JPS6256591 A JP S6256591A JP 19555085 A JP19555085 A JP 19555085A JP 19555085 A JP19555085 A JP 19555085A JP S6256591 A JPS6256591 A JP S6256591A
Authority
JP
Japan
Prior art keywords
plating
nickel
plated
electroplating
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19555085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0319307B2 (cs
Inventor
Toru Murakami
透 村上
Hiroshi Uotani
魚谷　鴻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP19555085A priority Critical patent/JPS6256591A/ja
Publication of JPS6256591A publication Critical patent/JPS6256591A/ja
Publication of JPH0319307B2 publication Critical patent/JPH0319307B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
JP19555085A 1985-09-04 1985-09-04 電気めつき方法 Granted JPS6256591A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19555085A JPS6256591A (ja) 1985-09-04 1985-09-04 電気めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19555085A JPS6256591A (ja) 1985-09-04 1985-09-04 電気めつき方法

Publications (2)

Publication Number Publication Date
JPS6256591A true JPS6256591A (ja) 1987-03-12
JPH0319307B2 JPH0319307B2 (cs) 1991-03-14

Family

ID=16342964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19555085A Granted JPS6256591A (ja) 1985-09-04 1985-09-04 電気めつき方法

Country Status (1)

Country Link
JP (1) JPS6256591A (cs)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04116191A (ja) * 1990-09-04 1992-04-16 C Uyemura & Co Ltd 電気めっき方法
JPH05331676A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JPH05331677A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JP2009168691A (ja) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd ピンホールの評価方法
JP2009168692A (ja) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd ピンホールの評価方法
WO2018015168A1 (en) * 2016-07-18 2018-01-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
EP3839103A1 (en) * 2015-06-30 2021-06-23 MacDermid Enthone Inc. Cobalt filling of interconnects in microelectronics

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04116191A (ja) * 1990-09-04 1992-04-16 C Uyemura & Co Ltd 電気めっき方法
JPH05331676A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JPH05331677A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JP2009168691A (ja) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd ピンホールの評価方法
JP2009168692A (ja) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd ピンホールの評価方法
EP3839103A1 (en) * 2015-06-30 2021-06-23 MacDermid Enthone Inc. Cobalt filling of interconnects in microelectronics
US11434578B2 (en) 2015-06-30 2022-09-06 Macdermid Enthone Inc. Cobalt filling of interconnects in microelectronics
WO2018015168A1 (en) * 2016-07-18 2018-01-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
CN109477234A (zh) * 2016-07-18 2019-03-15 巴斯夫欧洲公司 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物
EP3885475A1 (en) * 2016-07-18 2021-09-29 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
CN114059125A (zh) * 2016-07-18 2022-02-18 巴斯夫欧洲公司 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物

Also Published As

Publication number Publication date
JPH0319307B2 (cs) 1991-03-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees