JPS6257251B2 - - Google Patents

Info

Publication number
JPS6257251B2
JPS6257251B2 JP56160493A JP16049381A JPS6257251B2 JP S6257251 B2 JPS6257251 B2 JP S6257251B2 JP 56160493 A JP56160493 A JP 56160493A JP 16049381 A JP16049381 A JP 16049381A JP S6257251 B2 JPS6257251 B2 JP S6257251B2
Authority
JP
Japan
Prior art keywords
electronic component
mount
conductive
taping
taped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56160493A
Other languages
Japanese (ja)
Other versions
JPS5861620A (en
Inventor
Kozaburo Ookubo
Norio Takeda
Michiko Tachibana
Emiko Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichicon Corp
Original Assignee
Nichicon Capacitor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichicon Capacitor Ltd filed Critical Nichicon Capacitor Ltd
Priority to JP56160493A priority Critical patent/JPS5861620A/en
Publication of JPS5861620A publication Critical patent/JPS5861620A/en
Publication of JPS6257251B2 publication Critical patent/JPS6257251B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【発明の詳細な説明】 本発明はテーピングされた電子部品連の改良に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a series of taped electronic components.

従来の電子部品連は第1図に示すように複数の
電子部品1より導出したリード線2および3を連
続状の台紙4と粘着テープ5からなるテーピング
材6に挾持したものが使用されていた。しかし電
子部品が電解コンデンサのような場合、リード線
2および3を第1図のように封口部の根本近辺で
成形してテーピング材6に装着すると、コンデン
サの封口部が弾性封口体などを用いて密封されて
いるので、成形時の機械的ストレスがリード線
2,3を通じて電極箔に伝わり、酸化皮膜に損傷
を与え、漏れ電流が増加する欠点があつた。
As shown in FIG. 1, a conventional electronic component chain has been used in which lead wires 2 and 3 led out from a plurality of electronic components 1 are sandwiched between a taping material 6 consisting of a continuous mount 4 and adhesive tape 5. . However, when the electronic component is an electrolytic capacitor, if the lead wires 2 and 3 are formed near the base of the sealing part and attached to the taping material 6 as shown in Figure 1, the capacitor's sealing part will be closed using an elastic sealant or the like. Since the electrode foil is sealed, mechanical stress during molding is transmitted to the electrode foil through the lead wires 2 and 3, damaging the oxide film and increasing leakage current.

また一般に電解コンデンサを長時間保管してお
くと漏れ電流が増加する傾向があり、再度電圧を
印加してエージングされることがあるが、上述の
ようにテーピングされたコンデンサは、容易に通
電できない欠点があつた。
In general, if electrolytic capacitors are stored for a long time, leakage current tends to increase, and they may be aged by applying voltage again, but capacitors that are taped as mentioned above have the disadvantage that they cannot be easily energized. It was hot.

本発明は上述の欠点を除去し、テーピングされ
た電子部品に容易に通電できる電子部品連を提供
するものである。
The present invention eliminates the above-mentioned drawbacks and provides an electronic component chain that allows easy energization of taped electronic components.

以下、本発明を第2図〜第5図に示す実施例に
より説明する。
The present invention will be explained below with reference to embodiments shown in FIGS. 2 to 5.

第2図はテーピングされた電子部品の要部分解
正面図で、台紙4にはアルミニウムなどの2本の
導電性テープ7a,7bが設けられ、その片方の
導電性テープ7aのリード線2と交差するところ
は絶縁材8によつて絶縁されている。9は送り用
孔、10は粘着テープで、電子部品1の一方のリ
ード線2は導電性テープ7aと接触し、他方のリ
ード線3は導電性テープ7bと接触するので、電
子部品1はテーピングされた状態では全数並列に
接続されることになる。
FIG. 2 is an exploded front view of the main part of the taped electronic component. Two conductive tapes 7a and 7b made of aluminum or the like are provided on the mount 4, and the lead wire 2 of one of the conductive tapes 7a intersects with the lead wire 2. The parts that are connected to each other are insulated by an insulating material 8. 9 is a feed hole, 10 is an adhesive tape, one lead wire 2 of the electronic component 1 contacts the conductive tape 7a, and the other lead wire 3 contacts the conductive tape 7b, so the electronic component 1 is not taped. In this state, all the units will be connected in parallel.

したがつて電子部品1がテーピングされ、リー
ル巻、つづら折りなどの方法で梱包された電子部
品連はテーピング台紙4の端部から導電性テープ
7a,7bを通して電子部品1を通電することが
できるので、電解コンデンサのようにエージング
を必要とする場合はテーピング台紙4の一端部か
ら容易に電圧を印加することができる。
Therefore, since the electronic component 1 is taped and the electronic component series packed by a method such as reel winding or zigzag folding, electricity can be applied to the electronic component 1 from the end of the taping mount 4 through the conductive tapes 7a and 7b. If aging is required, such as with an electrolytic capacitor, a voltage can be easily applied from one end of the taping mount 4.

第3図〜第4図は他の実施例で、第3図におい
ては、台紙4にはスリツト11が設けられ、リー
ド線2が台紙の裏側から挿通されて、粘着テープ
10を貼り付けることにより、導電性テープ7a
と接触し、同時にリード線3も導電性テープ7b
と接触するもので、上述と同様な効果がある。
3 and 4 show other embodiments. In FIG. 3, the mount 4 is provided with a slit 11, the lead wire 2 is inserted from the back side of the mount, and the adhesive tape 10 is pasted. , conductive tape 7a
At the same time, the lead wire 3 also contacts the conductive tape 7b.
This has the same effect as described above.

第4図は台紙4の片面に電子部品1の一方のリ
ード線2を、台紙4の他面に電子部品1の他方の
リード線3を配置し、導電性を有する粘着テープ
12,13で、リード線2,3をそれぞれ接触さ
せて台紙4に固定したもので、同様な効果があ
る。
In FIG. 4, one lead wire 2 of the electronic component 1 is placed on one side of the mount 4, and the other lead wire 3 of the electronic component 1 is placed on the other side of the mount 4, and conductive adhesive tapes 12 and 13 are placed on the mount 4. The lead wires 2 and 3 are brought into contact with each other and fixed to the mount 4, and the same effect can be obtained.

なお、上述の導電性テープ7a,7bの連続上
の通電用導電材の代りに、台紙4に連続上に金属
蒸着して通電路を設けたり、細い柔軟性のある導
線を配置してもよい。また通電用導電材は粘着テ
ープ10側に設けてもよく、いずれにおいてもテ
ーピング材の少なくとも一部分が連続状の通電用
導電材からなり、該導電材に電子部品1のリード
線2,3を接触させて保持されているもので、
種々の組合せができる。
In addition, instead of the conductive material for conducting electricity on the continuous conductive tapes 7a and 7b described above, a conducting path may be provided by metal vapor deposition on the continuous mount 4, or a thin flexible conducting wire may be arranged. . Further, the conductive material for current supply may be provided on the adhesive tape 10 side, and in either case, at least a portion of the taping material is made of a continuous conductive material for current flow, and the lead wires 2 and 3 of the electronic component 1 are contacted to the conductive material. What is being held is
Various combinations are possible.

また上述の通電用導電材の一方の極側に着色す
ることにより、通電する際の極性区分をより明確
にし安全性を高めることができる。
Further, by coloring one pole side of the above-mentioned conductive material for energization, the polarity classification when energizing can be made clearer and safety can be improved.

第5図は定格50WV1μFの電解コンデンサに
おいて、本発明によりテーピングした試料をエー
ジング処理したものと、エージング処理した後テ
ーピングしてなる従来品との漏れ電流特性を比較
したもので、図から明らかのように本発明のもの
は漏れ電流が著しく低減し安定していることが確
認された。また漏れ電流のバラツキも少なく、効
果のあることが実証された。
Figure 5 compares the leakage current characteristics of an electrolytic capacitor with a rating of 50 WV 1 μF, which is obtained by aging a sample taped according to the present invention and by a conventional product which is taped after aging. It was confirmed that the device of the present invention has significantly reduced leakage current and is stable. Furthermore, the variation in leakage current was small, and it was proven to be effective.

叙上のように本発明の電子部品連は品質並びに
通電処理の面において極めて有利となり、工業的
ならびに実用的価値の大なるものである。
As mentioned above, the electronic component series of the present invention is extremely advantageous in terms of quality and energization processing, and is of great industrial and practical value.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のテーピングされた電子部品連の
正面図、第2図〜第4図は本発明の電子部品連の
それぞれ異なる実施例で、第2図および第3図は
要部分解正面図、第4図は側面図、第5図は本発
明品と従来品とを比較した電解コンデンサの漏れ
電流特性図である。 1:電子部品、2,3:リード線、4:台紙、
5:粘着テープ、6:テーピング材、7a,7
b:導電性テープ、12,13:導電性を有する
粘着テープ。
FIG. 1 is a front view of a conventional taped electronic component chain, FIGS. 2 to 4 are different embodiments of the electronic component chain of the present invention, and FIGS. 2 and 3 are exploded front views of main parts. , FIG. 4 is a side view, and FIG. 5 is a leakage current characteristic diagram of an electrolytic capacitor comparing a product of the present invention and a conventional product. 1: Electronic components, 2, 3: Lead wires, 4: Mounting paper,
5: Adhesive tape, 6: Taping material, 7a, 7
b: conductive tape, 12, 13: adhesive tape having conductivity.

Claims (1)

【特許請求の範囲】[Claims] 1 複数の電子部品のリード線を所定の間隔でテ
ーピングしてなる電子部品連において、該テーピ
ング材の一部分に少なくとも2本の連続状の通電
用導電材を設け、該導電材に電子部品のリード線
を各々接触させて保持してなることを特徴とする
電子部品連。
1. In an electronic component series formed by taping the lead wires of a plurality of electronic components at predetermined intervals, at least two continuous electrically conductive materials are provided in a portion of the taping material, and the leads of the electronic components are attached to the conductive material. A series of electronic parts characterized by holding wires in contact with each other.
JP56160493A 1981-10-07 1981-10-07 Electronic part series Granted JPS5861620A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56160493A JPS5861620A (en) 1981-10-07 1981-10-07 Electronic part series

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56160493A JPS5861620A (en) 1981-10-07 1981-10-07 Electronic part series

Publications (2)

Publication Number Publication Date
JPS5861620A JPS5861620A (en) 1983-04-12
JPS6257251B2 true JPS6257251B2 (en) 1987-11-30

Family

ID=15716126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56160493A Granted JPS5861620A (en) 1981-10-07 1981-10-07 Electronic part series

Country Status (1)

Country Link
JP (1) JPS5861620A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113698U (en) * 1984-01-09 1985-08-01 関西日本電気株式会社 Taping structure of electronic parts
JP2775834B2 (en) * 1989-04-18 1998-07-16 松下電器産業株式会社 Electronic component manufacturing method

Also Published As

Publication number Publication date
JPS5861620A (en) 1983-04-12

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