JPS6260244A - Method and apparatus for sealing semiconductor device - Google Patents

Abstract

PURPOSE:To improve the sealing feature by a method wherein the capping member and base member isolated from each other in a package to house airtight a semiconductor device is accommodated in a chamber, inert gas is introduced into the chamber, heat is applied to melt a sealing agent, and pressure is applied for the junctioning of the surfaces. CONSTITUTION:A glass-based sealing agent 9 is applied to the junction surfaces of the capping member Pc and base member Pb for a package P, whereafter the junction surfaces of the capping member Pc and phase member Pb are positioned to face each other and then put together. The assembly is dropped, with the capping member Pc facing down, into a package hole 3a provided in a package fixing mount 3. A fixing needle mount 5 is caused to descend for the lower end of a fixing needle 6 to abut against the upper surface of the base member Pb of the package P. A great quantity of inert gas is present in the package P when the capping member Pc meets the base member Pb, which ensures that there will no shortage of inert gas inside the package P sealed airtight. This method simplifies and improves the device in structure and airtightness.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for hermetically sealing a semiconductor device and an apparatus used for carrying out the method, and more specifically, the present invention relates to a method for hermetically sealing a semiconductor device and an apparatus used for carrying out the method.
This paper proposes a highly reliable method for hermetically sealing a semiconductor device and an apparatus used to carry out the method.

[Prior art]

To hermetically seal a semiconductor device such as a semiconductor integrated circuit in a package, solder sealing, glass sealing, or welding sealing is used. In the solder sealing and glass sealing, as shown in FIG. After being clamped with the clips 4, it is placed in a chamber for airtight sealing, and after replacing the gas in the chamber with an inert gas, the sealant 3 is heated and melted to seal the joint. Thereafter, the clip 4 is removed to obtain a hermetically sealed semiconductor device.

[Problem that the invention seeks to solve]

In the conventional sealing method described above, the joint surfaces of the cap member 1 and the base member 2, which face each other with the sealant 3 sandwiched between them, are processed to be flat in order to further improve the airtightness after the sealing. Therefore, the package P is in a somewhat airtight state before being hermetically sealed, and there is a possibility that the amount of inert gas introduced into the package P may be insufficient. In addition, due to the heating of the sealant 3 for airtight sealing, a large amount of gas is generated from the semiconductor chip and Guipond material inside the package P as well as melting the sealant 3, passing through the softened sealant 3. In some cases, gas leaks from inside the package P, causing gas leakage in the sealant 3, which hardens the sealant 3 and impairs the hermetic sealing of the package P.

[Means for solving problems]

The present invention introduces an inert gas into a chamber while separating a cap member and a base member of a package containing a semiconductor device to be hermetically sealed, melts the sealant by heating, and It is an object of the present invention to solve the above-mentioned problems by applying a pressing force to the joint surfaces of the cap member and the base member to join the cap member and the base member.

That is, the method for sealing a semiconductor device according to the present invention is a method for hermetically sealing a semiconductor device with a package including a cap member and a base member in a chamber that obtains a vacuum state, the cap member and the base member being in the chamber. a step of introducing an inert gas while separating the base member; a step of heating the cap member or the base member; and a step of polymerizing the cap member and the base member via a sealant after the heating step. The present invention is characterized in that it includes the steps of heating and curing the sealant by heating, and applying a pressing force to the bonding surface between the polymerized cap member and the base member.

Further, a semiconductor device sealing device according to the present invention is a device for sealing a semiconductor device with a package including a cap member and a base member in a chamber that obtains a vacuum state, and a package for positioning one member of the package. The present invention is characterized in that it includes a fixing base and a fixing needle that can move up and down with respect to the package fixing base and can attract the other member of the package.

〔Example〕

The present invention will be explained in detail below with reference to drawings showing embodiments thereof.

FIG. 1 is an internal structural diagram of a chamber equipped with a hermetically sealed device for a semiconductor device according to the present invention. In FIG. 1, 1 is a chamber in which a vacuum state can be obtained, and a gas inlet 1a for introducing an inert gas is connected to a vacuum evacuation device such as a vacuum pump to evacuate the inside of the chamber 1. It is equipped with an exhaust port 11). The chamber 1 is, for example, a bell-shaped chamber whose interior can be opened by lifting it up, so that utensils can be taken in and out of the chamber 1 freely. At the bottom of the chamber l, there is disposed a package fixing table 3 having a heating element 2, such as an electric heater, on the lower side.
It can be heated up to 00℃. Further, the heating element 2 is energized from outside the chamber 1 by a cable (not shown). The package fixing table 3 has a package P for hermetically sealing the semiconductor device on its upper surface.
Package holes 3a having depths approximately equal to the thicknesses of the packages P are opened side by side at appropriate intervals so as to allow the package P to fall into the package P.

Note that the number of pan cage holes 3a, which is two, is merely an example, and is not limited to this number.

On both sides of the package fixing base 3, support columns 4 are slidably inserted into the fixing base 3 and can be moved up and down in conjunction with each other.
4, and these support columns 4, 4 are driven up and down by a drive mechanism (not shown) such as a motor. A fixed needle mounting base 5 is provided at the upper end of the support column 4.degree. 4, parallel to the package fixing base 3 and extending in the 2-j direction. Small diameter tubular fixing nails 6, 6 extending downward are attached to the lower surface of the fixed needle count stand 5 at positions facing the package hole 3a. The tip side of the fixing nail 6 has a diameter that gradually becomes smaller toward the tip.
The tip portion is formed into a flat surface that can come into contact with the upper surface of the package P dropped into the package hole 3a. The length dimension of the fixed needle 6 is such that when the fixed needle attaching base 5 is raised to a predetermined position, the tip of the fixed needle 6 is located on one side of the package fixing base 3 from the second side. Number of stitches (=j units 5
is selected such that, before it is lowered to its lowest limit, it is brought into contact with the upper surface of the package I), which is provided with a dowel p, which falls into the package aperture a. Further, an exhaust hole 6a passing through the center of the fixed nail 6 in the length direction is communicated with a common exhaust hole 5a formed inside the fixed needle mount 5. The open end of the common exhaust hole 5a is airtightly connected to one end of a flexible exhaust pipe 7 that does not interfere with the upper movement of the fixed number of stitches 5, and the other end of the flexible exhaust pipe 7 is The end communicates with an adsorption exhaust port 8 which is attached to pass through the chamber 1 airtightly, and is airtightly connected to the inner end thereof.

By connecting a vacuum pump (not shown) to the outer end of the suction exhaust port 8 and evacuating the suction, suction force is generated on the flat surface side of the lower end of the fixed needle 6.

Next, a method of hermetically sealing a semiconductor device such as a semiconductor integrated circuit with glass using a ceramic package using the sealing device according to the present invention will be described with reference to FIGS. 1 to 4. FIGS. 2 and 3 are enlarged views showing the operation process of hermetically sealing the package, and FIG. 4 is a temperature characteristic diagram showing the thermal cycle during hermetically sealing.

When a package P consisting of a ceramic cap member Pc and a base member pb containing a semiconductor device and having leads l in contact with the semiconductor device is used for hermetically sealing with glass, the cap member Pc and the base member Pb of the package P are sealed.
A glass-based sealant 9 is applied to each joint surface of the
(see figure), the cap member Pc and the base member Pb are overlapped with their joint surfaces facing each other, and the cap member Pc
The person falls into the package hole 3a of the package fixing base 3 with the package facing downward. Thereafter, as shown in FIG. 1, the fixed needle mounting base 5 is lowered to bring the lower end surface of the fixed nail 6 into contact with the upper surface of the base member ph of the package P. Next, the exhaust port 11 of chamber 1
Chamber 1 is evacuated by a vacuum pump (not shown).
At the same time, by evacuating the inside of the needle 6 and evacuating it from the suction exhaust port 8 to create a vacuum inside the flexible exhaust pipe 7, the common exhaust hole 5a, and the exhaust hole 6a, a suction force is applied to the lower end surface of the fixed needle 6. is caused to attract the base member ph of the package P. At this time, the cap member Pc remains in the package hole 3a. Then, the heating element 1 is energized to heat the cap member Pc that has fallen into the package hole 3a of the package fixing base 3. This heating is performed until the glass-based sealant 9 reaches its softening point of 150 to 160 DEG C., as shown in the thermal cycle temperature characteristics shown in FIG. and sealant 9
After the temperature remains constant for a predetermined period of time, when time T is reached, an inert gas is introduced into the chamber 1 through the inert gas inlet 1a to inert the inside of the chamber 1. Not full of gas. At this time, since the package P is separated into the cap member Pc and the base member pb, their surfaces are covered with inert gas. Also,
The cap member Pc is already heated and the cap member P
Gas is emitted.

Thereafter, by driving the support columns 4, 4 and lowering the fixed needle mount 5, the base member ph, which is attracted to the fixed needle 6, is superimposed on the cap member Pc, and the fixed needle 6 is placed on the joint surface in a predetermined manner. Apply pressing force. In this pressed state, the amount of electricity supplied to the heating element 2 is increased to further increase the amount of heat generated.
As shown in FIG.
After raising the temperature by degrees Celsius and keeping the temperature constant, it is continued for a predetermined period of time.

As the temperature reaches PM220~230'c, the sealant 9 is cured, and the sealant 9 is completely cured with a predetermined pressing force applied to the bonding surface of the pan cage P. A hermetically sealed state can be obtained. After the hermetic sealing is completed, the power supply to the heating element 2 is stopped to lower the temperature of the package P, and the inside of the chamber 1 is returned to normal pressure, and exhaust operation is performed from the adsorption exhaust port 8. The package P of the semiconductor device, which is hermetically sealed from inside the chamber J, is also stopped.
can be obtained.

In the operation for airtightly sealing the cap member Pc and the base member Ph of the package P in this manner, the cap member Pc
Since the cap member Pc and the base member Ph are exposed to an inert gas atmosphere in the separated state F, a large amount of inert gas is present in the package P when the cap member Pc and the base member ph are polymerized. Therefore, there will be no situation where the amount of inert gas introduced into the hermetically sealed package P is insufficient. Also, the cap member Pc and the base member p
Since the cap member Pc is heated first and exhausts all the gas released in a state where the cap member PC and b are separated, there is less gas released after the cap member Pc and the base member pH are polymerized, and the cap member PC Since the pressing force from the fixed needle 6 is applied to the bonding surface between the base member Pc and the base member Pc to be polymerized while the sealant 9 is in the middle of curing, gas is generated from inside the package P in the polymerized state. Therefore, no gas leak passage is formed at the bonding surface, and no defective package P due to gas leak occurs.

In addition, when the above-mentioned outgassing is more important, the timing of bringing the bonding surfaces of the base member ph and the cap member Pc into contact with each other is adjusted so that the temperature of the sealant 9 ranges from 150 to 160°C to 2.0°C.
If the temperature is within the range of 20 to 230°C, and the sealing agent 9 is not applied any pressing force to the package P until a little before it hardens, the bonding process will be simply performed. Eliminates the inconvenience of gas leaks.

In this embodiment, the fixed needle mount 5 is moved up and down by a motor, but it may be moved up and down by a hydraulic cylinder. With a hydraulic cylinder, the amount of elevation can be finely adjusted, and the pressing force can also be adjusted smoothly. In addition, the heating temperature of the sealant 9 is 150 to 1
60°C and 220-230°C are just examples,
It is selected individually depending on the material of the sealant 9, and is not specified in this embodiment.

Furthermore, in the embodiment, the cap member Pc is mounted on the package fixing base 3.
It goes without saying that the base member Ph may also be positioned.

〔effect〕

As described in detail above, in the method for hermetically sealing a semiconductor device of the present invention, the cap member Pc is used when hermetically sealing a semiconductor device.

and base member pb are placed in an inert gas atmosphere in a separated state for one month and then polymerized and sealed, so that there is no shortage of inert gas in the hermetically sealed package.

Furthermore, since the cap member Pc and the base part JJPh are heated in a separated state, the gas released when the pan cage P is hermetically sealed can be halved, and the sealing can be performed by applying a pressing force to the joint surface. Since the inhibitor 9 is cured, no leakage defects due to outgassing occur.

According to the hermetic sealing device of the present invention, the same effects as described above can be obtained, and the provision of the pan cage fixing base 3 and the fixing needle 6 makes it possible to separate the cap member Pc and the base member pb. The polymerization is extremely smooth, there is no misalignment of the members during polymerization, the structure is simple, the operation is easy, and there are no defects in hermetic sealing.

Therefore, the present invention makes it possible to improve the yield of pancakes containing semiconductor devices and to manufacture highly reliable semiconductor device packages with complete hermetic sealing, thereby greatly contributing to industry.

[Brief explanation of drawings]

FIG. 1 is a schematic structural diagram of the inside of a chamber equipped with a sealing device according to the present invention, FIGS. 2 and 3 are explanatory diagrams of an airtight sealing operation by the sealing device according to the present invention, and FIG. FIG. 5 is a temperature characteristic diagram showing a thermal cycle during sealing, and is a diagram of a conventional operation state for hermetically sealing a package. 1... Chamber 2... Heating element 3... Package fixing base 5... Fixed needle mounting base 6... Fixed needle 9
...Sealant P...Package Pb...Base member Pc...Cap part (A Patent Applicant E-Yo Denki Co., Ltd. Agent Patent Attorney llI Noboru Drawing C Engraving (No change in content) )! Arithmetic 1 Fig. 1 Keyaki', ''''S ■1 Time opening - Ear 4 Fig.? Written amendment to the filing procedure (method) December 3, 1985

Claims (1)

[Claims] 1. A method for hermetically sealing a semiconductor device with a package consisting of a cap member and a base member in a chamber that obtains a vacuum state, the cap member and the base member being separated in the chamber. a step of heating the cap member or the base member; and after the heating step, polymerizing the cap member and the base member via a sealant and heating the sealant. A method for sealing a semiconductor device, comprising: a step of curing; and a step of applying a pressing force to a bonding surface between a polymerized cap member and a base member. 2. In an apparatus for sealing a semiconductor device with a package consisting of a cap member and a base member in a chamber that obtains a vacuum state, a package fixing stand for positioning one member of the package, and a package fixing stand for positioning one member of the package; A sealing device for a semiconductor device, comprising a fixed needle that can move up and down and that can attract the other member of the package.