JPS6261202A - Polystyrene film for electric insulation - Google Patents

Polystyrene film for electric insulation

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Publication number
JPS6261202A
JPS6261202A JP19995785A JP19995785A JPS6261202A JP S6261202 A JPS6261202 A JP S6261202A JP 19995785 A JP19995785 A JP 19995785A JP 19995785 A JP19995785 A JP 19995785A JP S6261202 A JPS6261202 A JP S6261202A
Authority
JP
Japan
Prior art keywords
film
less
stretching
polystyrene
crystallinity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19995785A
Other languages
Japanese (ja)
Inventor
達也 伊藤
研二 綱島
矢部 健次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP19995785A priority Critical patent/JPS6261202A/en
Publication of JPS6261202A publication Critical patent/JPS6261202A/en
Pending legal-status Critical Current

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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Organic Insulating Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、コンデンサー、ケーブル、トランス等の絶縁
体あるいは誘電体として用いられるポリスチレンフィル
ムの改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to improvements in polystyrene films used as insulators or dielectrics in capacitors, cables, transformers, etc.

〈従来の技術〉 従来より配向ポリスチレンフィルムは、誘電損失(ta
nδ)が0.02%と極めて小さいばかシか誘電特性の
周波数依存性が小さいために、特に精度を要する通信機
用コンデンサーの誘電体とじて用いられている。しかし
ながら、使用されている原料がアタクチックであり結晶
化しないために。
<Prior art> Traditionally, oriented polystyrene films suffer from dielectric loss (ta
Since its dielectric properties (nδ) are extremely small at 0.02% and its frequency dependence is small, it is used as a dielectric material in capacitors for communication equipment, which particularly requires precision. However, because the raw materials used are atactic and do not crystallize.

熱寸法安定性が悪く80°0以上になると極めて大きな
熱収縮を生じる。このため、コンデンサーとしての使用
温度条件が限定されたり、金属蒸着タイプのコンデンサ
ーを製造しようとすると、金属蒸着時にフィルムが大き
く収縮し、フィルムが変形したり、蒸着金属膜にクラッ
ク等を生じ実用に供し得ないのが現状であった。
Thermal dimensional stability is poor, and when the temperature exceeds 80°0, extremely large thermal contraction occurs. For this reason, the temperature conditions for use as a capacitor are limited, and if you try to manufacture a metal vapor deposition type capacitor, the film may shrink significantly during metal vapor deposition, deform the film, or cause cracks in the vapor deposited metal film, making it difficult to put it into practical use. The current situation was that it could not be provided.

また、アイソタクチックポリスチレンは、古りから学術
的、技術的な検討が成されてきた(例えば、繊維学会誌
23巻、1号、1967年、PlB−p 24.あるい
は特開昭48−1999 )、 l、かじながらアイソ
タクチックポリスチレンの欠点として。
In addition, isotactic polystyrene has been studied academically and technically since ancient times (for example, Journal of the Japan Society of Fibers and Textiles Vol. 23, No. 1, 1967, PlB-p 24. ), l, as a drawback of isotactic polystyrene.

(1)結晶化速度が極めて遅く、結晶化させるため長い
アニール時間が必要であり、コストアップの原因となる
(1) The crystallization speed is extremely slow, and a long annealing time is required for crystallization, which causes an increase in cost.

(2)非晶状態の配向フィルムを結晶化させると極めて
もろくなる。
(2) When an amorphous oriented film is crystallized, it becomes extremely brittle.

等の問題があった。There were other problems.

〈発明が解決しようとする問題点〉 ア 本発明は結晶性ティツタクチツクポリスチレンの製膜技
術によシ、耐熱性、U溶剤性良好な電気絶縁用ポリスチ
レンフィルムを供せんとするものである。
<Problems to be Solved by the Invention> A. The object of the present invention is to provide a polystyrene film for electrical insulation which has good heat resistance and U-solvent property using crystalline polystyrene film forming technology.

く問題全解決するための手段〉 本発明は上記問題点を解決するために次の構成すなわち
、アイソタクチックポリスチレンを主体とした配向フィ
ルムであって、該フィルムのアイソタクチックインデッ
クスが85係以上、結晶化度が65チ以上55俤以下、
面配向が6×10 以+5 上12 x 10  以下であり、かつ、内部ヘイズが
2チ以下である電気絶縁用ポリスチレンフィルムである
ことを特徴とする。
Means for Solving All Problems> In order to solve the above problems, the present invention has the following configuration: an oriented film mainly made of isotactic polystyrene, the film having an isotactic index of 85 or more. , the degree of crystallinity is 65 or more and 55 or less,
It is characterized by being a polystyrene film for electrical insulation having a plane orientation of 6 x 10 to +5 to 12 x 10 and an internal haze of 2 or less.

本発明におけるアイソタクチックポリスチレンを主体と
した樹脂とは、アイソタクチックポリスチレンホモポリ
マーあるいは他樹脂とのブレンド物あるいは共重合物で
あって、ブレンドする樹脂としてはαポリオレフィン、
ポリフェニレンニーテル、共重合するモノマとしては、
αメチルスチレン、無水マレイン酸等が挙げられるが、
耐溶剤性を良好とするためには、アイソタクチックポリ
スチレンの重量分率は90%以上、好1しくけ95チ以
上としておくことが好ましい。さらに該樹脂のアイソタ
クチックインデックス(以下、IIと略称する)は、8
5%以」二であることが必要であり、95%以上である
ことが好ましい。IIが」1記範囲以下であると、高配
向させても結晶化度が低く、熱寸法安定性に劣り高温(
特に80’o以ト)で大きな熱収縮を生じ絶縁破壊の原
因となる。
In the present invention, the resin mainly composed of isotactic polystyrene is an isotactic polystyrene homopolymer or a blend or copolymer with other resins, and the resin to be blended is α-polyolefin,
Polyphenylene ether, the monomer to be copolymerized is
Examples include α-methylstyrene, maleic anhydride, etc.
In order to improve solvent resistance, the weight fraction of isotactic polystyrene is preferably 90% or more, preferably 95% or more. Furthermore, the isotactic index (hereinafter abbreviated as II) of the resin is 8.
It is necessary that it is 5% or more, and preferably 95% or more. If II is below the range 1, the degree of crystallinity will be low even if highly oriented, the thermal dimensional stability will be poor, and high temperature (
Particularly at temperatures below 80'o), large thermal contraction occurs, causing dielectric breakdown.

また本発明のフィルムの結晶化度は、35%以上55係
以下であることが必要であり、40チ以上55チ以下で
あることが好ましい。結晶化度が上記範囲より小さいと
、熱寸法安定性に劣る。一方、上記範囲より大きいと寸
法安定性は良好となるが、フィルムがもろくなり、クラ
ック等を生じ易くなり電気特性が悪化する。
Further, the crystallinity of the film of the present invention needs to be 35% or more and 55% or less, and preferably 40% or more and 55% or less. If the crystallinity is less than the above range, the thermal dimensional stability will be poor. On the other hand, if it is larger than the above range, the dimensional stability will be good, but the film will become brittle, prone to cracks, etc., and the electrical properties will deteriorate.

さらに9本発明フィルムの極限粘度c以下、〔η〕と略
称する)は1以上6以下であるのが好捷しく。
Furthermore, it is preferable that the intrinsic viscosity of the film of the present invention is c or less (abbreviated as [η]) of 1 or more and 6 or less.

1.2以」二4以下であることがより好ましい、〔η〕
が上記範囲にあると押出特性、延伸性等の製膜性が良好
となり均一なフィルムが得られるばかりでなく機械特性
も良好となる。
More preferably, it is 1.2 or more and 24 or less, [η]
When it is within the above range, not only film forming properties such as extrusion properties and stretchability will be good, and a uniform film will be obtained, but also mechanical properties will be good.

また本発明フィルムのDECによシ観測される融解ピー
クは、220°0近傍及び200℃近傍の2つがあるが
、これらピーク面積の比r=A20o/A22o(A2
oo、A2□。はそれぞれ200℃、220℃のピーク
面積)は、0.05以以下1′5以下であると熱寸法安
定性が良好となり好ましい。
Furthermore, there are two melting peaks observed by DEC of the film of the present invention, near 220° 0 and near 200°C, and the ratio of these peak areas r = A20o/A22o (A2
oo, A2□. (peak areas at 200° C. and 220° C., respectively) are preferably 0.05 or more and 1'5 or less because thermal dimensional stability is good.

本発明のフィルムは2機械特性を良好とするために少な
くとも一軸に配向していることが必要であり、二軸に配
向していることが好ましい。
The film of the present invention needs to be at least uniaxially oriented in order to have good biaxial mechanical properties, and preferably biaxially oriented.

この際、フィルム長手方向の屈折率’feNX*フィル
ム厚み方向の屈折率を N2としたときに面配向(以下
、Δnと略称する。Δn−[Nx + Nx ]/ 2
−Nz )が3 x 10−5以上12 x 10−3
以下であることが必要であり、4x1()−’以上、 
10 x 10−’以下であることが好ましい。面配向
が上記範囲よりも小さいとフィルムがもろくなシ、絶縁
破壊電圧が低下する。
At this time, when the refractive index in the longitudinal direction of the film is 'feNX* and the refractive index in the thickness direction of the film is N2, plane orientation (hereinafter abbreviated as Δn.Δn-[Nx + Nx]/2
-Nz) is 3 x 10-5 or more 12 x 10-3
It must be less than or equal to, and greater than or equal to 4x1()-',
It is preferably 10 x 10-' or less. If the plane orientation is smaller than the above range, the film will not be brittle and the dielectric breakdown voltage will decrease.

一方、面配向が上記範囲より大きいとフィルムが襞間し
易くなるためにクラックを生じ、絶縁破壊電圧が低下す
る。
On the other hand, if the plane orientation is larger than the above range, the film is likely to have folds, resulting in cracks and a decrease in dielectric breakdown voltage.

また1本発明のフィルムの内部ヘイズは2チ以下である
ことが必要であり、1%以下であることが好ましい、内
部ヘイズは、フィルム中のボイドあるいは結晶境界での
光散乱に関係しくポリスチレンの場合特に後者)、これ
らがフィルム中に多い程あるいは結晶サイズが大きい程
内部ヘイズは大きくなる。内部ヘイズが上記範囲内であ
ると。
In addition, the internal haze of the film of the present invention must be 2% or less, preferably 1% or less.The internal haze is related to light scattering at voids or crystal boundaries in the film. Especially in the latter case), the more these are present in the film or the crystal size is larger, the larger the internal haze will be. The internal haze is within the above range.

結晶化による機械特性の低下を小さくできると共に絶縁
破壊電圧等の電気特性も良好となる。
Decrease in mechanical properties due to crystallization can be reduced, and electrical properties such as dielectric breakdown voltage can also be improved.

また1本発明フィルムには、有機または無機の結晶核剤
を添加しても良い。核剤を添加すると結晶が微分散し9
機械特性がより向上するので好ましいが、一方で電気特
性を悪化させる原因となるため添加量は1重量係以下と
しておくことが好ましい。また本発明フィルムにおいて
、電気特性を悪化させない範囲で熱安定剤、酸化防止剤
等を添加しても良い。
Furthermore, an organic or inorganic crystal nucleating agent may be added to the film of the present invention. When a nucleating agent is added, the crystals are finely dispersed9.
This is preferable because it further improves the mechanical properties, but on the other hand, it causes deterioration of the electrical properties, so it is preferable that the amount added is 1 part by weight or less. Further, in the film of the present invention, a heat stabilizer, an antioxidant, etc. may be added to the extent that the electrical properties are not deteriorated.

さらに9本発明フィルムに含まれる灰分は1[10pp
m以下、好1しくけ60ppm以下であると絶縁破壊電
圧が高く、特に、コンデンサー用フィルムとして良好で
ある。
Furthermore, the ash content contained in the film of the present invention is 1[10pp].
m or less, preferably 60 ppm or less, the dielectric breakdown voltage is high and it is particularly good as a capacitor film.

次に1本発明ポリスチレンフィルムの製造方法について
述べる。
Next, a method for manufacturing the polystyrene film of the present invention will be described.

まず、アインタクチックボリスチレンは9例えばスチレ
ンモノマーを芳香族炭化水素に溶解させチーグラーナツ
タ触媒を用い重合を行う0重合体は重合系にメタノール
と塩酸との混合液を加えることにより沈殿物として得ら
れ、該沈殿物は触媒を取り除くために十分にメタノール
で洗浄する。
First, intactic polystyrene is obtained by dissolving styrene monomer in an aromatic hydrocarbon and polymerizing it using a Ziegler-Natsuta catalyst.The polymer is obtained as a precipitate by adding a mixture of methanol and hydrochloric acid to the polymerization system. The precipitate is thoroughly washed with methanol to remove the catalyst.

さらに、非結晶成分(アタクチック成分)を除去するた
めに、あるいはメチルエチルケトン等にょシ抽出を行い
、必要な1. I、とする。こうして得られた原料パウ
ダーは押出機により溶融押出し、ガツト状に押出しベレ
ット化しておく。
Furthermore, in order to remove amorphous components (atactic components), extraction such as methyl ethyl ketone is performed to remove the necessary 1. Let I be. The raw material powder thus obtained is melt-extruded using an extruder and extruded into gut-shaped pellets.

次に、こうして得られたアイソタクチックポリスチレン
ベレットを250°C以上520 ℃以下で押出機にて
T型ダイ全通してシート状に溶融押出し、冷却ドラム上
に密着し冷却固化させる。また円型ダイを用いて冷却マ
ンドレル」二で冷却固化しても良い。この際、キャスト
フィルムの温度を80°C以上、好ましくは90°0以
」二に保っておくとフィルムが割れにくくなるので好ま
しい、引き続き該キャストフィルムを延伸温度105°
C以上160″C以下、好ましくは115°C以上15
゛0’。
Next, the isotactic polystyrene pellet thus obtained is melt-extruded into a sheet form through a T-shaped die using an extruder at a temperature of 250° C. or more and 520° C. or less, and is tightly attached to a cooling drum and cooled and solidified. Alternatively, a circular die may be used for cooling and solidifying with a cooling mandrel. At this time, it is preferable to maintain the temperature of the cast film at 80°C or higher, preferably 90°C or lower, since this will prevent the film from cracking.
C or higher and 160″C or lower, preferably 115°C or higher and 15
゛0'.

以下で少なくとも一方向に2倍以上10倍以下。2 times or more and 10 times or less in at least one direction.

好ましくは2.5倍以上6倍以下延伸する。延伸温度が
上記範囲より低いと延伸時にクラックが入り。
Preferably, the stretching is 2.5 times or more and 6 times or less. If the stretching temperature is lower than the above range, cracks will occur during stretching.

1.5倍以り延伸できない。また上記範囲以上であると
ドロー延伸となり有効な配向が得られないばかりか場合
によっては結晶化が進行し延伸できなくなる。延伸方法
としては、−軸延伸、同時二軸延伸、逐次二軸延伸のい
ずれでも良いが、フィルム特性を良好とするためには二
軸に配向させる二軸延伸法が好ましい。また、延伸倍率
が2倍以下好ましくは25倍以下であると十分な面配向
が得られず熱処理後のフィルムがもろく割れ易くなる。
It cannot be stretched more than 1.5 times. Moreover, if it exceeds the above range, not only will effective orientation not be obtained due to draw stretching, but in some cases crystallization will progress and stretching will not be possible. The stretching method may be -axial stretching, simultaneous biaxial stretching, or sequential biaxial stretching, but in order to improve film properties, a biaxial stretching method in which the film is oriented biaxially is preferred. Further, if the stretching ratio is 2 times or less, preferably 25 times or less, sufficient planar orientation cannot be obtained and the film after heat treatment becomes brittle and easily cracks.

また延伸倍率が10倍以上、好ましくは6倍以上である
とフィルムが延伸方向に割れ易くなり機械特性が悪化す
る。
Furthermore, if the stretching ratio is 10 times or more, preferably 6 times or more, the film tends to crack in the stretching direction, resulting in poor mechanical properties.

こうして得られた延伸フィルムは引続き、該延伸温度以
上、200°C以下、好ましくは160 ’a以上19
0 ℃以下で、延伸方向の少なくとも一方向について、
1チ以上20%以下に延伸しながら熱固定を行う。熱固
定温度が延伸温度未満、好ましくは160℃未満である
とフィルムの結晶化度がほとんど上がらず、熱寸法安定
性が悪化する。
The stretched film thus obtained is subsequently stretched at a temperature higher than the stretching temperature and lower than 200°C, preferably higher than 160'a19
At 0°C or less, in at least one direction of the stretching direction,
Heat setting is performed while stretching to 1 inch or more and 20% or less. If the heat setting temperature is lower than the stretching temperature, preferably lower than 160°C, the crystallinity of the film will hardly increase and the thermal dimensional stability will deteriorate.

一方、熱固定温度が2 D D ’oを超える範囲、好
ましくは190°Cより高いと延伸フィルムの結晶化速
度に比較して9分子鎖の動きの活発化のためか′ に配向緩和十優先し未延伸フィルムと同等になってしま
い9機械特性が悪化しまたり、熱固定時特にフィルムが
溶融する。また熱固定時の延伸倍率が上記範囲より小さ
いと配向緩和が大きく、また結晶ダイズも大きくなるた
めに内部ヘイズが高くなり9機械特性が悪化する。また
、上記範囲よシ大きい場合はフィルム破れを生じ易く、
安定した製膜はできない、また熱固定時間としては長い
方が結晶化が進み安定した品質が得られるが9本発明で
は結晶化度は上述の条件において約10分で飽和するの
で、10分以内で十分である。
On the other hand, if the heat setting temperature exceeds 2D D'o, preferably higher than 190°C, orientation relaxation will occur due to the activation of the movement of the nine molecular chains compared to the crystallization rate of the stretched film. However, the film becomes equivalent to that of an unstretched film, resulting in poor mechanical properties, and the film especially melts during heat setting. Furthermore, if the stretching ratio during heat setting is smaller than the above range, the orientation relaxation will be large and the crystal soybean size will also become large, resulting in high internal haze and deterioration of mechanical properties. In addition, if it is larger than the above range, the film is likely to tear,
It is not possible to form a stable film, and the longer the heat setting time, the more crystallization progresses and stable quality can be obtained.9 In the present invention, the degree of crystallinity is saturated in about 10 minutes under the above conditions, so it is possible to form a film within 10 minutes. is sufficient.

また、熱固定の方法としては」二連の方法で第一段熱処
理行なった後に* D S Cの結晶融点の最も低いピ
ーク温度(Tm)と第一段熱処理温度との間の温度で、
リラックスをOqb以」二10%以下としながら第二段
熱処理を行うとフィルム中のひずみが取り除かれ、熱寸
法安定性がさらに良好となる。
In addition, as a method of heat fixation, after performing the first stage heat treatment in a two-step method, * at a temperature between the lowest peak temperature (Tm) of the crystal melting point of DSC and the first stage heat treatment temperature,
If the second stage heat treatment is performed while the relaxation is less than 210%, the strain in the film is removed and the thermal dimensional stability becomes even better.

〈発明の効果〉 本発明は、ポリスチレンフィルムのI、 Iを85チ以
上、結晶化度を35%以J二55 %以下、かっ面配向
を5 x 10−3以上、 12 x 10−’以下内
部ヘイズを2%以下とすることにより次の様な効果を有
す。
<Effects of the Invention> The present invention provides a polystyrene film with I and I of 85 or more, crystallinity of 35% or more and J255% or less, and diagonal orientation of 5 x 10-3 or more and 12 x 10-' or less. By controlling the internal haze to 2% or less, the following effects can be obtained.

(1)熱寸法安定性、l溶剤性に優れている。(1) Excellent thermal dimensional stability and solvent resistance.

(2)経時による結晶化度の変化が小さお、クラック、
寸法変化等を生じない。
(2) Small change in crystallinity over time, cracks,
No dimensional changes occur.

(3)高温での絶縁破壊電圧の低下が小さい。(3) The drop in dielectric breakdown voltage at high temperatures is small.

シタがってコンデンザー、ケーブル、トランス等の電気
絶縁用途に好適であシ、その中でも低いtanδ及び高
い絶縁破壊電圧を要求するコンデンサー用絶縁フィルム
として好適である。
It is therefore suitable for electrical insulation applications such as capacitors, cables, and transformers, and is particularly suitable as an insulating film for capacitors that requires low tan δ and high dielectric breakdown voltage.

ここで9本発明で用いている用語及び測定法を以下にま
とめて説明しておく。
Here, the terms and measurement methods used in the present invention will be summarized and explained below.

(1)II:サンプルW (mg)  をソックスレー
抽出器に入れて、沸騰メチルエチルケトンで6時間抽出
した後、十分に乾燥した後の重量をW’(mg)とする
とIIは次式で求められる。
(1) II: Sample W (mg) was placed in a Soxhlet extractor, extracted with boiling methyl ethyl ketone for 6 hours, and then thoroughly dried, where W' (mg) is the weight, and II is determined by the following formula.

II(%)−100xW’/W (2)極限粘度(〔η〕): A S T M−D−1601にそって135°Cテト
ラリン中で測定する。単位dj/g (3)結晶化度(Xc ) : サンプル密度d8をASTM−D  1505に従って
測定し、アイソタクチックポリスチレンの非晶の密度d
A、結晶の密度d。をそれぞれ dA= 1.052 (g/師3) doe= 1.127 (g/cm )とし。
II (%) - 100xW'/W (2) Intrinsic viscosity ([η]): Measured in tetralin at 135°C according to ASTM D-1601. Unit dj/g (3) Crystallinity (Xc): The sample density d8 is measured according to ASTM-D 1505, and the amorphous density d of isotactic polystyrene is
A, crystal density d. dA = 1.052 (g/meter 3) doe = 1.127 (g/cm ), respectively.

で計算される。is calculated.

(4)DSC融解ピーク面積比(F):パーキンエルマ
ー社製D S C−’f(型に試I)5mgを入れ、雰
囲気を窒素置換する。次に、昇温速度20’O/分で昇
温する際に、アイソタクチックポリスチレンの結晶融点
は200 ’o近傍の吸熱ビークP2.。及び220 
’o近傍の吸熱ビークP220として観測される。ピー
ク面積比はベースラインから測った”2[10のピーク
面積A2oo及びP220のビーク面積A2□。の比と
して F”” A200 /A2/[+ で計算される。
(4) DSC melting peak area ratio (F): 5 mg of DSC-'f manufactured by PerkinElmer (Test I) was placed in a mold, and the atmosphere was replaced with nitrogen. Next, when the temperature is raised at a heating rate of 20'O/min, the crystalline melting point of isotactic polystyrene reaches an endothermic peak P2 of around 200'o. . and 220
It is observed as an endothermic peak P220 near 'o. The peak area ratio is calculated as A200/A2/[+ as the ratio of the peak area A2oo of 2[10 and the peak area A2□ of P220 measured from the baseline.

(5)面配向(Δ0):アツベの屈折洲を用いてフィル
ムの長手方向の屈折率(NY9.幅方向の屈折率(NX
)#および厚み方向の屈折率(N2)を測定し。
(5) Planar orientation (Δ0): The refractive index in the longitudinal direction of the film (NY9) and the refractive index in the width direction (NX
) # and the refractive index (N2) in the thickness direction were measured.

Δn 圀(Nx + Ny K Nz として求める。なお、測定時の光源にはナトリウムD線
を用い、マウント液としてはヨウ化メヂレンを用いる。
Determined as Δn (Nx + Ny K Nz). Note that sodium D line is used as the light source during measurement, and methylene iodide is used as the mounting liquid.

(6)熱収縮率:フィルムから、長さ200nxn。(6) Heat shrinkage rate: From film, length 200nxn.

幅10mmの試料を切りとる(熱収縮率を測定する方向
を長さ方向とする)。この試料を120°Cの熱風循環 オーブン中に15分間保持した後、室温中に取り出し、
その長さを測定する。その長さf L (mm )とす
れば、熱収縮率は次式で求められる。
Cut a sample with a width of 10 mm (the direction in which the heat shrinkage rate is measured is the length direction). The sample was kept in a hot air circulation oven at 120°C for 15 minutes, then taken out to room temperature.
Measure its length. If the length is f L (mm), the thermal shrinkage rate can be determined by the following formula.

熱収縮率(%)−10Qx(200−L)/200(力
 絶縁破壊電圧(BDV): A S T M−D−149に準じ、20℃にて測定す
る。
Thermal shrinkage rate (%) - 10Qx (200-L)/200 (force) Breakdown voltage (BDV): Measured at 20°C according to ASTM-D-149.

(8)  剰油性 フィルムをコンデンサー用植物油中80℃24時間浸漬
した時に、溶解したりクラックを生じた場合をランクC
1殆ど溶解しない場合、油浸前のサンプル重量をW+ 
(g) e油浸後のサンプル重量をW2(g)とした時
に次式で定義される重量増加ΔW(%)=100x ”
   ’− が0%以上、6チ以下をランクA、6%より太きい場合
全ランクBとする。コンデンサー用としては、ランクA
は使用可能であるがランクB、Cでは使用不可能である
(8) If the residual oil film dissolves or cracks occur when it is immersed in vegetable oil for condensers at 80°C for 24 hours, it will be ranked C.
1 If there is almost no dissolution, the sample weight before oil immersion is W +
(g) eWhen the sample weight after oil immersion is W2 (g), weight increase ΔW (%) = 100x defined by the following formula
'- is 0% or more and 6 inches or less is ranked A, and all cases that are thicker than 6% are ranked B. Rank A for capacitors
can be used, but cannot be used in ranks B and C.

(9)灰分(Ash )は、JIS−C−2560に従
って測定した。
(9) Ash content (Ash) was measured according to JIS-C-2560.

(10)内部ヘイズ A S T M−D−1003−52法に準じ、フィル
ムを流動ハラフィン中に浸漬して、フィルムヘイズを測
定する。フィルム標準厚みは12μmとし、フィルム厚
みが該厚みと異なる盲は、12tt・厚傘に換算し、フ
ィルムヘイズとした。
(10) Internal Haze According to the ASTM D-1003-52 method, the film is immersed in liquid halafine and the film haze is measured. The standard thickness of the film was 12 μm, and the film haze different from this thickness was converted to 12 tt/thick umbrella and was defined as film haze.

〈実施例〉 次に、実施例に基づき本発明について説明を行う。<Example> Next, the present invention will be explained based on examples.

実施例1 スチレンモノマーをトルエンに溶解し、四塩化チタン−
トリエチルアルミニウムを触媒として。
Example 1 Styrene monomer was dissolved in toluene and titanium tetrachloride was dissolved in toluene.
triethylaluminum as a catalyst.

重合を行なった。重合後、メタノールと塩酸の混合液を
重合液に加え1重合体の沈殿を得た。こうして得られた
重合体粉末をメタノールで洗浄し。
Polymerization was carried out. After the polymerization, a mixed solution of methanol and hydrochloric acid was added to the polymerization solution to obtain a precipitate of one polymer. The polymer powder thus obtained was washed with methanol.

さらにアセトンで洗浄し、アイソタクチックポリスチレ
ンパウダーを得た。
It was further washed with acetone to obtain isotactic polystyrene powder.

該パウダーを二軸押出機を用い300°Cにてガツト状
に溶融押出しベレットとした。
The powder was melt-extruded into pellets at 300° C. using a twin-screw extruder.

この様にして得られたアイソタクチックポリスチレンベ
レットはアイソタクチックインデックスll−96係、
極限粘度〔η] = 2.0 d ll g*灰分80
ppmであった。
The isotactic polystyrene pellets thus obtained had an isotactic index of 11-96.
Intrinsic viscosity [η] = 2.0 d ll g * Ash content 80
It was ppm.

次に該ぺ1/ツトを290°0にて押出機を用いてシー
ト状に押出し95°Cのドラム上にエアー圧で密着、冷
却固化した。次に該シートを160°Cにて縦方向に3
.3倍に延伸し、引き続いてステンターに送り込んで、
140℃にて横方向に6.0倍延伸し9幅方向に3係延
伸しながら、175°Cにて60秒間熱固定を行なった
。この結果、フィルム厚み12μm、結晶化度40%、
融解ピーク面積比r−0,11面配向6X10 、内部
ヘイズD、5%の二軸延伸フィルムを得た。該フィルム
の熱収縮率は長手方向(以下、MDと略す)1.0%9
幅方向(以下、TDと略す)0.5%と小さくBDVも
360 V / )tと電気絶縁用として好適であり、
耐油性もランクAであり油浸電気絶縁用としても使用可
能であることが分った。なお1表1に主な条件。
Next, the pellet was extruded into a sheet using an extruder at 290.degree. C., adhered to a drum at 95.degree. C. using air pressure, and solidified by cooling. Next, the sheet was heated at 160°C for 3 times in the longitudinal direction.
.. Stretch it three times, then feed it into a stenter,
The film was stretched 6.0 times in the transverse direction at 140° C., and then heat-set at 175° C. for 60 seconds while being stretched by 3 times in the width direction. As a result, the film thickness was 12 μm, the crystallinity was 40%,
A biaxially stretched film with a melting peak area ratio r-0, an 11-plane orientation of 6×10, and an internal haze D of 5% was obtained. The heat shrinkage rate of the film is 1.0% in the longitudinal direction (hereinafter abbreviated as MD)9
It has a small BDV of 0.5% in the width direction (hereinafter abbreviated as TD) and is suitable for electrical insulation with a BDV of 360 V/)t.
It was found that the oil resistance was also rank A, and that it could be used for oil-immersed electrical insulation. The main conditions are shown in Table 1.

フィルム特性、評価結果をまとめて示した。The film characteristics and evaluation results are summarized.

比較例1 実施例1と同様に延伸まで行い、熱固定を幅方向に2チ
延伸しながら100°Cにて90秒間熱処理を行なった
。該フィルムの結晶化度は5%と低く、またF−0であ
り、このだめ熱収縮率が太き(、BDVも低いことが分
ったNまた耐油性のランクを調べたところCであった。
Comparative Example 1 Stretching was performed in the same manner as in Example 1, and heat treatment was performed at 100° C. for 90 seconds while stretching 2 inches in the width direction. The crystallinity of the film is as low as 5%, and it is F-0, and the heat shrinkage rate is high (and the BDV is low. Ta.

表1参照。See Table 1.

実施例2 実施例1と同じ原料を用い、同様な未延伸フィルムをキ
ャストした後に、該未延伸フィルムを同時二軸延伸ステ
ンターに送り込んで130 ’aにて3×3倍の同時二
軸延伸を行い、引き続いてMD。
Example 2 Using the same raw materials as in Example 1, a similar unstretched film was cast, and then the unstretched film was fed into a simultaneous biaxial stretching stenter to undergo simultaneous biaxial stretching of 3×3 times at 130′a. Do it, then MD.

TDの両方向に2%延伸しながら180°Cにて60秒
間熱処理を行なった。こうして得られたフィルムの特性
は表1に示す様に結晶化度は40係、面配向8俤であり
、内部ヘイズ0.ろ係、熱収縮はMD、TD双方共に2
.0係と小さかった。また絶縁破壊電圧は380kv/
mmと極めて高く、コンデンサー用として好適であるこ
とが分った。表1参九実施例6 延伸工程までを実施例1と同様に行い、熱固定を175
℃にてTDに20%引張りながら30秒間行なった後に
、195°Cでリラックス0チにて30秒間熱固定を行
なった。該フィルムの結晶化度を測定したところ45%
と高く、また熱収縮率はMD、TD共に0チと良好であ
p、BDVも380V/μと高く、電気絶縁用として好
適であった1表1参照。
Heat treatment was performed at 180°C for 60 seconds while stretching 2% in both TD directions. As shown in Table 1, the properties of the film thus obtained are that the degree of crystallinity is 40, the plane orientation is 8, and the internal haze is 0. Filtering staff, heat shrinkage is 2 for both MD and TD.
.. It was small with 0 staff. Also, the dielectric breakdown voltage is 380kv/
It was found that it was extremely high in mm, making it suitable for use in capacitors. See Table 1 Example 6 The stretching process was carried out in the same manner as in Example 1, and heat setting was carried out at 175
After 30 seconds at 20% tension in TD at 195°C, heat setting was carried out at 195°C for 30 seconds at 0°. The crystallinity of the film was measured and was 45%.
In addition, the heat shrinkage rate was good at 0 in both MD and TD, and the p and BDV were high at 380 V/μ, making it suitable for electrical insulation.See Table 1.

実施例4 実施例1と同様な重合法によpxI=90%〔η)−2
,5dl/gのアイソタクチックポリスチレンベレット
を得た。
Example 4 pxI=90% [η)-2 by the same polymerization method as Example 1
, 5 dl/g of isotactic polystyrene pellets were obtained.

該ベレット’i、500℃にて押出機を用いてシート状
に押出し、95°0の冷却ドラム上にエアー圧で密着冷
却固化した。次に該シートを同時二軸ステンターにてM
D、TD両方向に160℃にて6倍延伸し、2%伸長し
ながら175°Cにて60秒間熱固定を行った。この結
果、フィルム厚み10μmのフィルムを得た。該フィル
ムの特性は表1に示す通りであり、電気絶縁用として良
好な特性を有しており、耐油性もランクAと優れていた
The pellet 'i was extruded into a sheet using an extruder at 500°C, and cooled and solidified in close contact with air pressure on a cooling drum at 95°C. Next, the sheet is M
It was stretched 6 times in both D and TD directions at 160°C, and heat-set at 175°C for 60 seconds while elongating by 2%. As a result, a film having a thickness of 10 μm was obtained. The properties of the film are as shown in Table 1, and it had good properties for electrical insulation, and was also excellent in oil resistance, ranking A.

比較例2,3 市販のアタクチックポリスチレンベレット(II=20
%、〔η]=2.0(d7/3))を用い、実施例4と
同様に押出、延伸、熱固定を行なったが、熱固定時にフ
ィルムが溶融し製膜できなかった(比較例2)、そこで
、熱固定は行なわずに延伸フィルムを得た。
Comparative Examples 2 and 3 Commercially available atactic polystyrene pellets (II=20
%, [η] = 2.0 (d7/3)), extrusion, stretching, and heat setting were performed in the same manner as in Example 4, but the film melted during heat setting and could not be formed (Comparative Example 2), a stretched film was obtained without heat setting.

該フィルムの結晶化度は0%であり、また熱収縮率も3
0%と大きいばかりか、BDVも低く耐油性もランクC
と悪かった。表1参照。
The film has a crystallinity of 0% and a heat shrinkage rate of 3.
Not only is it large at 0%, but its BDV is low and oil resistance is rank C.
It was bad. See Table 1.

実施例5 実施例1の重合法で得られたアイソタクチックポリスチ
レンを溶媒抽出法により、さらにIII高め、ll−9
8係、〔η] x 2.2 d 17g、とした。
Example 5 The isotactic polystyrene obtained by the polymerization method of Example 1 was further increased to 11-9 by a solvent extraction method.
8, [η] x 2.2 d 17g.

該ベレツ)’i300°0にて溶融押出し、冷却ドラム
」二で冷却固化した後に、130℃にてMDに35倍延
伸し引続きステンターにて140°Cで3゜0倍延伸し
9次に175℃、延伸倍率5%にて60秒間熱処理し二
軸配向フィルムを得た。
After melt extrusion at 300°0, cooling and solidifying on a cooling drum, it was stretched 35 times in the MD at 130°C, then stretched 3°0 times at 140°C in a stenter, and then 175 A biaxially oriented film was obtained by heat treatment for 60 seconds at a stretching ratio of 5%.

該フィルムの結晶化度は48%と高く、熱収縮率は0%
、BDVも390 V/μと良好であった。
The film has a high crystallinity of 48% and a heat shrinkage rate of 0%.
The BDV was also good at 390 V/μ.

表1参照。See Table 1.

実施例6 実施例5と同様に未延伸フィルムを製造し、今度は、該
フイルノ・を140°Cにて5倍MD方向に延伸し、1
75°C9延伸倍率0%にて60秒間熱固定を行なった
Example 6 An unstretched film was produced in the same manner as in Example 5, and this time the film was stretched 5 times in the MD direction at 140°C.
Heat setting was carried out for 60 seconds at 75° C.9 and a stretching ratio of 0%.

こうして得られた一軸延伸フイルムは、2軸延伸フイル
ムに比較、て、MD力方向さけ易いものの結晶化度が5
0係と高く、熱収縮率がMD2.5%。
The uniaxially stretched film thus obtained is easier to avoid in the MD force direction than the biaxially stretched film, but has a crystallinity of 5.
It has a high coefficient of 0 and a heat shrinkage rate of MD 2.5%.

’[’D−1,0%であ!l、B D V 350V/
μも高く、マた耐油性もランクAと良好であった。表1
参照。
'['D-1,0%! l, BD V 350V/
μ was also high, and the oil resistance was also good with rank A. Table 1
reference.

比較例4 ′実施例5と同様に未延伸フィルムを得て、今度は延伸
を行なわないで175’aにて熱固定を1.20秒間行
なった。
Comparative Example 4' An unstretched film was obtained in the same manner as in Example 5, and this time heat setting was performed at 175'a for 1.20 seconds without stretching.

こうして得られたフィルムの結晶化度は30%と低く、
内部ヘイズは5%であり極めてフイルノ・はもろかった
。またBDVも200V/lzと低く。
The crystallinity of the film thus obtained was as low as 30%.
The internal haze was 5% and the film was extremely brittle. Also, the BDV is low at 200V/lz.

1ij油性テストでも油中で大きく膨潤しランクはCで
あった。表1参照。
Even in the 1ij oil test, it swelled greatly in oil and was ranked C. See Table 1.

実施例7と比較例5 実施例1及び比較例1で得られた二軸延伸フィルムを誘
電体とし、電極にはA7箔を用いて箔巻きコンデンサー
実施例7及び比較例5を作成した。
Example 7 and Comparative Example 5 Foil-wrapped capacitors Example 7 and Comparative Example 5 were prepared using the biaxially stretched films obtained in Example 1 and Comparative Example 1 as dielectrics and using A7 foil as electrodes.

なお、各コンデンサーの静電容量は0.01μFとなる
ようにした。
Note that the capacitance of each capacitor was set to 0.01 μF.

実施例7.比較例5のコンデンサーをそれぞれ20個用
意し、80°Cにてコロナ放電開始電圧の1.5倍の交
流電圧(5DHz )をかけライフテストを行なった。
Example 7. Twenty capacitors of Comparative Example 5 were each prepared, and a life test was conducted at 80° C. by applying an AC voltage (5 DHZ) that was 1.5 times the corona discharge starting voltage.

この結果を図に示した。横軸に課電時間(hr)、縦軸
に破壊しなかったコンデンサーの数を生存率(チ)で示
した。図から明らかの様に、比較例5では課電開始直後
に約半数のコンデンサーが破壊してし壕うが、実施例7
のコンデンサーでは破壊するものは僅かであり、コンデ
ンサーとして安定な性能を有していることがわかる。
The results are shown in the figure. The horizontal axis shows the electrification time (hr), and the vertical axis shows the number of capacitors that did not break down as the survival rate (ch). As is clear from the figure, in Comparative Example 5, about half of the capacitors were destroyed immediately after the start of energization, but in Example 7,
It can be seen that there is very little damage in the capacitor, and it has stable performance as a capacitor.

【図面の簡単な説明】[Brief explanation of the drawing]

図は、実施例7.比較例5で作成したコンデンサーの生
存率を示す特性曲線である。
The figure shows Example 7. 3 is a characteristic curve showing the survival rate of the capacitor prepared in Comparative Example 5.

Claims (1)

【特許請求の範囲】[Claims]  アイソタクチックポリスチレンを主体とした配向フィ
ルムであつて、該フィルムのアイソタクチックインデッ
クスが85%以上、結晶化度が35%以上55%以下、
面配向が3×10^−^3以上12×10^−^3以下
であり、かつ、内部ヘイズが2%以下である電気絶縁用
ポリスチレンフィルム。
An oriented film mainly made of isotactic polystyrene, the film having an isotactic index of 85% or more and a crystallinity of 35% or more and 55% or less,
A polystyrene film for electrical insulation having a plane orientation of 3 x 10^-^3 or more and 12 x 10^-^3 or less, and an internal haze of 2% or less.
JP19995785A 1985-09-10 1985-09-10 Polystyrene film for electric insulation Pending JPS6261202A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19995785A JPS6261202A (en) 1985-09-10 1985-09-10 Polystyrene film for electric insulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19995785A JPS6261202A (en) 1985-09-10 1985-09-10 Polystyrene film for electric insulation

Publications (1)

Publication Number Publication Date
JPS6261202A true JPS6261202A (en) 1987-03-17

Family

ID=16416410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19995785A Pending JPS6261202A (en) 1985-09-10 1985-09-10 Polystyrene film for electric insulation

Country Status (1)

Country Link
JP (1) JPS6261202A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006230474A (en) * 2005-02-22 2006-09-07 Nutri Kk Fluid dosing device and method
WO2007090878A1 (en) * 2006-02-10 2007-08-16 Total Petrochemicals Research Feluy Production of isotactic polystyrene

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006230474A (en) * 2005-02-22 2006-09-07 Nutri Kk Fluid dosing device and method
WO2007090878A1 (en) * 2006-02-10 2007-08-16 Total Petrochemicals Research Feluy Production of isotactic polystyrene

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