JPS6262003B2 - - Google Patents

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Publication number
JPS6262003B2
JPS6262003B2 JP55055769A JP5576980A JPS6262003B2 JP S6262003 B2 JPS6262003 B2 JP S6262003B2 JP 55055769 A JP55055769 A JP 55055769A JP 5576980 A JP5576980 A JP 5576980A JP S6262003 B2 JPS6262003 B2 JP S6262003B2
Authority
JP
Japan
Prior art keywords
heat treatment
alloy
layer
wire
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55055769A
Other languages
Japanese (ja)
Other versions
JPS56152106A (en
Inventor
Yoshimitsu Ikeno
Takashi Saito
Tsukasa Kono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Cable Works Ltd
Original Assignee
Fujikura Cable Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Cable Works Ltd filed Critical Fujikura Cable Works Ltd
Priority to JP5576980A priority Critical patent/JPS56152106A/en
Publication of JPS56152106A publication Critical patent/JPS56152106A/en
Publication of JPS6262003B2 publication Critical patent/JPS6262003B2/ja
Granted legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

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  • Superconductors And Manufacturing Methods Therefor (AREA)

Description

【発明の詳細な説明】 この発明はNb3Sn系の超電導線を製造する方法
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a Nb 3 Sn-based superconducting wire.

周知の如く金属間化合物であるNb3Sn系の超電
導材料は、他の金属間化合物系超電導材料や合金
系超電導材料と比較して超電導特性が優れている
ため、核融合炉に使用される超電導磁石等の超電
導線として有望視されている。しかしながら
Nb3Snは金属間化合物の状態ではきわめて脆く、
加工性、特に延性や展性が悪いため一般の塑性加
工によりNb3Snの棒材を所望の径の線材に加工す
ることは困難である。そのため、Nb3Sn系の超電
導線の実際的な製造方法としていくつか提案がな
されているが、その内の一つとしてブロンズ法と
称される方法がある。このブロンズ法は、Cu−
Sn合金(ブロンズ)の基地中に多数のNb芯材を
埋込み、未だ金属間化合物のNb3Snが生成されて
いない状態で縮径加工を施した後、熱処理によつ
てNbとSnを相互に拡散させるとともにNb3Snを
生成するものである。この方法ではCuがSn拡散
のキヤリヤとして作用するためNb3Snの生成に要
する熱処理時間が比較的短時間で済み、またCu
−Sn合金は工業的に縮径加工可能であり、これ
らの点から実際に適用可能である。しかしながら
この方法では前述のように縮径加能であるとは言
うものの、効率良くNb3Snを生成させるため比較
的Sn濃度の高いCu−Sn合金を用いれば、加工硬
化が生じ易くなるため、縮径加工工程中途におけ
る中間焼鈍の回数が著しく多くなり、その結果作
業能率が著しく低下するとともに製造コストが蓄
しく上昇する問題がある。
As is well known, Nb 3 Sn-based superconducting materials, which are intermetallic compounds, have superior superconducting properties compared to other intermetallic compound-based superconducting materials and alloy-based superconducting materials, so they are the most popular superconducting materials used in nuclear fusion reactors. It is seen as promising as a superconducting wire for magnets, etc. however
Nb 3 Sn is extremely brittle in the state of an intermetallic compound;
Because of poor workability, especially ductility and malleability, it is difficult to process Nb 3 Sn rods into wire rods of a desired diameter by general plastic working. Therefore, several proposals have been made as practical methods for manufacturing Nb 3 Sn-based superconducting wires, one of which is a method called the bronze method. This bronze method
A large number of Nb core materials are embedded in a base of Sn alloy (bronze), and after being subjected to diameter reduction processing before the intermetallic compound Nb 3 Sn is formed, heat treatment is performed to mutually combine Nb and Sn. It diffuses and generates Nb 3 Sn. In this method, Cu acts as a carrier for Sn diffusion, so the heat treatment time required to generate Nb 3 Sn is relatively short;
-Sn alloys can be industrially reduced in diameter and can be practically applied from these points of view. However, although this method allows diameter reduction as mentioned above, if a Cu-Sn alloy with a relatively high Sn concentration is used to efficiently generate Nb 3 Sn, work hardening is likely to occur. There is a problem that the number of intermediate annealing operations during the diameter reduction process increases significantly, resulting in a significant decrease in work efficiency and a significant increase in manufacturing costs.

そこでこの発明の発明者等は上述の問題を解決
するため、ブロンズ法の改良法を既に提案してい
る。この方法はCu−Sn合金としてSn10重量%未
満の低Sn濃度のCu−Sn合金を用い、そのCu−
Sn合金基地中に前記同様にNb芯材を多数埋込ん
でなる複合線に縮径加工を施した後、その複合線
の表面(すなわちCu−Sn合金表面)にSnメツキ
を施し、その後において熱処理を施してSn拡散
およびNb3Sn生成を行うようにしたものである。
この方法ではCu−Sn合金基地が低Sn濃度である
ため加工性が良好であつて中間焼鈍の回数を少な
くすることができ、また外側のSnメツキ層によ
りCu−Sn合金におけるSnの不足を補うため高Sn
濃度のCu−Sn合金を用いたブロンズ法と同程度
のNb3Sn生成効率を得ることができる等の利点が
ある。
Therefore, the inventors of the present invention have already proposed an improved method of the bronze method in order to solve the above-mentioned problems. This method uses a Cu-Sn alloy with a low Sn concentration of less than 10% Sn as the Cu-Sn alloy.
After reducing the diameter of a composite wire made by embedding a large number of Nb core materials in a Sn alloy base in the same manner as described above, the surface of the composite wire (i.e., the Cu-Sn alloy surface) is Sn-plated, and then heat-treated. was applied to perform Sn diffusion and Nb 3 Sn generation.
In this method, the Cu-Sn alloy base has a low Sn concentration, so it has good workability and the number of intermediate annealing can be reduced, and the outer Sn plating layer compensates for the lack of Sn in the Cu-Sn alloy. High Sn
This method has advantages such as being able to obtain Nb 3 Sn production efficiency comparable to that of the bronze method using a Cu-Sn alloy with a high concentration.

ところで上述の改良ブロンズ法(ブロンズ−
Snメツキ法)においてSnを拡散させかつNb3Sn
を生成するための熱処理としては、縮径加工およ
びSnメツキ後の複合線にNb3Snの生成温度すなわ
ち700〜800℃の温度で数10〜100時間程度の熱処
理を施すことが考えられている。Snメツキ層の
厚みが薄い場合にはこの熱処理法で特に支障はな
いが、良好な超電導特性を得るべく多量のNb3Sn
を生成させるためにSnメツキ層の厚みを厚くし
た場合、上述の熱処理法では処理後の線材表面に
黒色を呈する極めて脆い部分が発生する間題があ
る。この黒色部分は、超電導特性を持たない別の
金属間化合物であるNb3Sn2であると思われ、ま
たこのNb3Sn2層は、前述の熱処理時に表面のSn
メツキ層からCu−Sn合金基地中へのSnの拡散
と、Cu−Sn合金基地からNb芯材へのSnの拡散と
が同時的に行なわれず、表面のSnメツキ層から
のSn拡散が遅れ、そのためNb3Snよりも生成速度
が速いNb3Sn2層が表面層に生成されてしまうた
めであると思われる。このような黒色のNb3Sn2
層は前述のように極めて脆くしかも超電導特性を
持たないから、この層が発生すれば超電導線の機
械的特性を低下させるとともに、Nb3Sn層の生成
量が少なくなつて超電導線の超電導特性が低下す
る問題が生じる。一方、前述のように縮径加工し
てSnメツキを施した後、直接Nb3Sn生成温度で熱
処理せず、一旦400℃附近で数時間から数10時間
程度の熱処理を施してからNb3Snの生成温度
(700〜800℃)で数10〜100時間程度の熱処理を施
す方法も試みられているが、この方法でもSnメ
ツキ層の厚みが厚い部分には黒色のNb3Sn2層が
生成されてしまうことを確実には防止し得ないの
が実情であつた。
By the way, the above-mentioned improved bronze method (bronze-
In the Sn plating method), Sn is diffused and Nb 3 Sn
It is considered that heat treatment for producing Nb 3 Sn is performed on the composite wire after diameter reduction and Sn plating at a temperature of 700 to 800°C for several tens to 100 hours. . There is no particular problem with this heat treatment method when the thickness of the Sn plating layer is thin, but in order to obtain good superconducting properties, a large amount of Nb 3 Sn
When the thickness of the Sn plating layer is increased in order to produce , the problem with the above-mentioned heat treatment method is that extremely brittle parts that appear black appear on the wire surface after treatment. This black part is thought to be Nb 3 Sn 2 , which is another intermetallic compound that does not have superconducting properties, and this Nb 3 Sn 2 layer is formed by the Sn on the surface during the heat treatment mentioned above.
The diffusion of Sn from the plating layer into the Cu-Sn alloy base and the diffusion of Sn from the Cu-Sn alloy base to the Nb core material do not occur simultaneously, and the diffusion of Sn from the surface Sn plating layer is delayed. This seems to be because an Nb 3 Sn 2 layer, which has a faster formation rate than Nb 3 Sn, is formed on the surface layer. This kind of black Nb 3 Sn 2
As mentioned above, this layer is extremely brittle and does not have superconducting properties, so if this layer is generated, it will deteriorate the mechanical properties of the superconducting wire, and the amount of Nb 3 Sn layer produced will decrease, causing the superconducting properties of the superconducting wire to deteriorate. The problem of deterioration arises. On the other hand, after diameter reduction and Sn plating as described above, the Nb 3 Sn is not directly heat treated at the Nb 3 Sn formation temperature, but is heat treated at around 400°C for several hours to several tens of hours before forming the Nb 3 Sn. A method of applying heat treatment for several tens to 100 hours at the formation temperature (700 to 800 degrees Celsius) has also been attempted, but even with this method, a black Nb 3 Sn 2 layer is generated in the thick part of the Sn plating layer. The reality is that it is impossible to reliably prevent this from happening.

以上のような事情から、この発明の発明者等
は、前述の改良ブロンズ法(ブロンズ−Snメツ
キ法)においてSnメツキ層が厚い場合でも黒色
のNb3Sn2層が生成されないように熱処理する方
法、換言すれば良好な超電導特性を得るべく
Nb3Snを多量に生成させるためにSnメツキ層を厚
くしても、機械的強度を損うことなく実際に良好
な超電導特性を得ることができるようにする熱処
理方法を開発するべく鋭意実験・研究を重ねたと
ころ、最適な熱処理条件を見出し、この発明をな
すに至つたのである。
In view of the above circumstances, the inventors of the present invention developed a heat treatment method that prevents the formation of a black Nb 3 Sn 2 layer even when the Sn plating layer is thick in the aforementioned improved bronze method (bronze-Sn plating method). In other words, in order to obtain good superconducting properties
In order to develop a heat treatment method that can actually obtain good superconducting properties without compromising mechanical strength, even if the Sn plating layer is thickened in order to generate a large amount of Nb 3 Sn, we conducted extensive experiments and experiments. After repeated research, they found the optimal heat treatment conditions and came up with this invention.

すなわちこの発明の方法は、前述のように低
Sn濃度のCu−Sn合金基地中に多数のNb芯材を埋
込んだ複合線に縮径加工を施して表面にSnメツ
キ層を形成した後、Snの融点(約232℃)よりも
低くかつ100℃以上の温度で1次熱処理を施し、
続いてSnの融点よりも高くNb3Snの生成温度より
も低い温度において2次熱処理を施し、その後
Nb3Sn生成温度の700〜800℃で3次熱処理を施す
ことを特徴とするものである。
In other words, the method of this invention has low
A composite wire with a large number of Nb core materials embedded in a Cu-Sn alloy base with a Sn concentration is subjected to diameter reduction processing to form a Sn plating layer on the surface. First heat treatment is performed at a temperature of 100℃ or higher,
Next, a secondary heat treatment is performed at a temperature higher than the melting point of Sn and lower than the formation temperature of Nb 3 Sn, and then
It is characterized by performing tertiary heat treatment at 700 to 800°C, which is the Nb 3 Sn generation temperature.

以下この発明の方法につきより詳細に説明す
る。
The method of this invention will be explained in more detail below.

この発明の製造方法においては先ず既に提案さ
れている方法と同様にCu−Sn合金の基地中に純
Nbからなる芯材を多数埋込んで複合線を作り、
その複合線に縮径加工を施して所望の線径とした
後、表面にSnメツキを施す。このSnメツキまで
の工程について説明すると、先ず上述のような複
合線を作るためには、例えば第1図Aに示すよう
にCu−Sn合金からなる中空な管材1にNbの粉
末、線材もしくは棒材等からなるNb芯材2を挿
入し、さらにその管を複数本集合して第1図Bに
示すようにCu−Sn合金からなる管材3に挿入
し、さらに必要に応じてそれを複数本集合して第
1図Cに示すようにCu−Sn合金製の管材4に挿
入し、同様の過程を必要に応じて1回または2回
以上繰返せば良く、またその間、必要に応じて押
出加工、スエージング加工、伸線・引抜加工等の
縮径加工を施せば良い。このようにして得られた
複合線に対し最終的に所望の線径となるまで縮径
加工を施せば、第1図Dに示すようにCu−Sn合
金基地5中に極細線状のNb芯材2が多数本埋込
まれた極細多芯構造線が得られるから、続いて第
1図Eに示すようにその表面すなわちCu−Sn合
金基地5の表面に所望の厚みのSnメツキ層6を
電気メツキ等により形成すれば良い。なおここで
Cu−Sn合金としてはSn含量が10重量%以上では
加工性が悪くなつて縮径加工中に加工硬化が生じ
易くなるから中間焼鈍の回数を減少させる効果が
得られず、したがつてSn含量は10%未満とする
ことが望ましく、またSn含量が少な過ぎれば外
側のSnメツキ層からSnを補給しても充分な量の
Nb3Snを生成できなくなるからSnは少くとも2重
量%以上であることが望ましく、さらに、特に加
工性を良好にしてしかも充分な量のNb3Snを生成
させるための最適範囲は5〜6重量%程度であ
る。
In the manufacturing method of this invention, first, as in the previously proposed method, a pure metal is added to the base of the Cu-Sn alloy.
A composite wire is made by embedding a large number of core materials made of Nb,
The composite wire is subjected to diameter reduction processing to obtain the desired wire diameter, and then Sn plating is applied to the surface. To explain the process up to this Sn plating, first, in order to make the above-mentioned composite wire, for example, as shown in Figure 1A, a hollow tube material 1 made of Cu-Sn alloy is injected with Nb powder, wire rod or rod. Insert the Nb core material 2 made of Nb alloy, etc., and then assemble multiple tubes and insert them into the tube material 3 made of Cu-Sn alloy as shown in Figure 1B. As shown in FIG. Diameter reduction processing such as processing, swaging processing, wire drawing/pulling processing, etc. may be performed. If the composite wire obtained in this way is subjected to diameter reduction processing until it finally reaches the desired wire diameter, an ultrafine wire-shaped Nb core is formed in the Cu-Sn alloy base 5 as shown in FIG. 1D. Since an ultrafine multifilamentary structure wire in which a large number of materials 2 are embedded is obtained, a Sn plating layer 6 of a desired thickness is then formed on its surface, that is, on the surface of the Cu-Sn alloy base 5, as shown in FIG. 1E. It may be formed by electroplating or the like. Furthermore, here
For Cu-Sn alloys, if the Sn content is 10% by weight or more, the workability deteriorates and work hardening tends to occur during diameter reduction processing, so the effect of reducing the number of intermediate annealing cannot be obtained. It is desirable that the Sn content be less than 10%, and if the Sn content is too low, even if Sn is replenished from the outer Sn plating layer, there will be no sufficient amount of Sn.
Since it becomes impossible to generate Nb 3 Sn, it is desirable that the Sn content be at least 2% by weight.Furthermore, in order to improve processability and generate a sufficient amount of Nb 3 Sn, the optimum range is 5 to 6%. It is about % by weight.

上述のようにしてSnメツキ層が形成された極
細多芯構造線には、3段階にわたつて熱処理を施
す。最初の1次熱処理は、Snの融点すなわち約
232℃よりも低くかつ100℃以上の温度、好ましく
は150℃〜200℃の温度において25時間〜200時間
施せば良く、またこの一次熱処理は真空中または
不活性ガス雰囲気中で行えば良い。この1次熱処
理により表面のSnメツキ層のSnと内側のCu−Sn
合金基地中のCuとが相互に拡散し、これによつ
て表面はSn濃度の高いCu−Sn合金層となる。続
いてSnの融点(約232℃)よりも高くかつNb3Sn
生成温度(700〜800℃)よりも低い温度、好まし
くは350℃〜500℃程度、より好ましくは400℃程
度で10時間〜100時間程度2次熱処理を前記同様
な雰囲気で行う。この2次熱処理により表面の
Sn濃度の高いCu−Sn合金層中のSnが内部のSn濃
度の余り高くない基地中へ拡散する。引続いて
Nb3Sn生成温度、すなわち700〜800℃の温度にて
50時間〜150時間程度の3次熱処理を前記同様な
雰囲気で行う。この3次熱処理によりSnがNb芯
材に拡散してNb3Snが生成される。
The ultrafine multifilamentary structural wire on which the Sn plating layer was formed as described above was subjected to heat treatment in three stages. The first primary heat treatment is carried out at the melting point of Sn, which is approximately
The primary heat treatment may be carried out at a temperature lower than 232°C and above 100°C, preferably between 150°C and 200°C, for 25 hours to 200 hours, and this primary heat treatment may be carried out in vacuum or in an inert gas atmosphere. Through this primary heat treatment, the Sn of the surface Sn plating layer and the Cu-Sn of the inner layer are separated.
Cu in the alloy matrix diffuses into each other, thereby forming a Cu--Sn alloy layer with a high Sn concentration on the surface. Next, the melting point of Sn (approximately 232℃) and Nb 3 Sn
Secondary heat treatment is performed at a temperature lower than the production temperature (700 to 800°C), preferably about 350 to 500°C, more preferably about 400°C, for about 10 to 100 hours in the same atmosphere as described above. This secondary heat treatment improves the surface
Sn in the Cu-Sn alloy layer with a high Sn concentration diffuses into the internal base where the Sn concentration is not very high. Subsequently
At Nb 3 Sn formation temperature, i.e. temperature of 700-800℃
Tertiary heat treatment for about 50 to 150 hours is performed in the same atmosphere as above. Through this tertiary heat treatment, Sn diffuses into the Nb core material and Nb 3 Sn is generated.

以上の3段熱処理過程において、1次熱処理時
には表面のSnメツキ層が合金化されるから、次
の2次熱処理時には表面が溶融流動することな
く、Cu−Sn合金基地と外側の合金層(Snメツキ
層であつた部分)のSn濃度が均一化され、内部
までSn濃度が高くなる。したがつてNb3Sn生成温
度の3次熱処理時にはすみやかにNb3Snが生成さ
れ、またこの際SnがNb芯材へ拡散されるのみな
らずNbもCu−Sn合金層中へ拡散されるが、その
拡散時にはすでに高Sn濃度の表面のSnメツキ層
(Sn単独層)はほとんど存在しなくなつているか
ら、表面にNb3Sn2層が生成されることが防止さ
れる。
In the above three-stage heat treatment process, the Sn plating layer on the surface is alloyed during the first heat treatment, so the surface does not melt and flow during the second heat treatment, and the Cu-Sn alloy base and the outer alloy layer (Sn The Sn concentration in the hot plating layer is made uniform, and the Sn concentration increases to the inside. Therefore, during the tertiary heat treatment at the Nb 3 Sn formation temperature, Nb 3 Sn is quickly generated, and at this time, not only Sn is diffused into the Nb core material but also Nb is diffused into the Cu-Sn alloy layer. At the time of diffusion, the Sn plating layer (Sn alone layer) on the surface with a high Sn concentration has already almost disappeared, so the formation of a Nb 3 Sn 2 layer on the surface is prevented.

以上のようにして、黒色の脆いNb3Sn2層が表
面に生成されることなくNb3Snが効率良く生成さ
れる。
As described above, Nb 3 Sn is efficiently generated without forming a black brittle Nb 3 Sn 2 layer on the surface.

次にこの発明の実施例および比較例を記す。 Next, examples and comparative examples of the present invention will be described.

比較例 1 Sn6重量%を含有するCu−Sn合金基地中に、
1045本のNb芯材を埋込み、外径0.2mmφ、一方の
Nb芯材の径が約2.8μmとなるまで縮径加工を施
して複合線を作り、その複合線の表面に3.0μm
以下のメツキ層を形成した後、直接740℃にて100
時間熱処理を施したところ、Nb3Sn2の黒色相を
生成することなく、Nb3Sn系超電導線を得ること
ができ、その超電導特性を測定したところ、
4.2K、4Tの磁場における臨界電流値ICが50Aな
る良好な特性を得ることができた。
Comparative Example 1 In a Cu-Sn alloy matrix containing 6% by weight of Sn,
Embedded with 1045 Nb core materials, outer diameter 0.2mmφ, one side
A composite wire is made by reducing the diameter of the Nb core material until it becomes approximately 2.8 μm, and a 3.0 μm
After forming the following plating layer, directly heat the plate at 740℃ for 100℃.
When subjected to heat treatment for a period of time, an Nb 3 Sn-based superconducting wire could be obtained without forming a black phase of Nb 3 Sn 2 , and when its superconducting properties were measured,
Good characteristics were obtained with a critical current value I C of 50 A in a magnetic field of 4.2 K and 4 T.

比較例 2 比較例1と同様な複合線に3.5μmのSnメツキ
層を生成し、直接740℃にて100時間熱処理を施し
たところ、表面に黒くて脆いNb3Sn2層が生成さ
れることが確認された。また、あらかじめ180℃
×72時間熱処理を施した後740℃にて100時間熱処
理した場合、およびあらかじめ400℃×10時間熱
処理を施した後740℃にて100時間熱処理した場合
も前記同様に黒色の脆いNb3Sn2層が生成され
た。
Comparative Example 2 When a 3.5 μm Sn plating layer was formed on the same composite wire as in Comparative Example 1 and directly heat treated at 740°C for 100 hours, a black and brittle Nb 3 Sn 2 layer was formed on the surface. was confirmed. Also, please set the temperature to 180℃ in advance.
When heat-treated for ×72 hours and then heat-treated at 740°C for 100 hours, and when heat-treated at 740°C for 100 hours after previously heat-treated at 400°C for 10 hours, the same black brittle Nb 3 Sn 2 layer has been generated.

実施例 比較例1と同様な複合線に3.5μmのSnメツキ
層を形成した後、1次熱処理として180℃×72時
間熱処理し、続いて2次熱処理として400℃×8
時間処理し、さらに3次熱処理として740℃×100
時間熱処理したところ、線材表面に黒色の脆い部
分が発生することなく、Nb3Sn系超電導線を得る
ことができ、またその超電導特性を測定したとこ
ろ、4.2K、4Tの磁場中における臨界電流値が
70Aとなつて、高い特性を有することが確認され
た。
Example After forming a 3.5 μm Sn plating layer on the same composite wire as in Comparative Example 1, it was heat treated at 180°C for 72 hours as a primary heat treatment, and then at 400°C for 8 hours as a secondary heat treatment.
740℃×100 as a third heat treatment.
After time heat treatment, a Nb 3 Sn based superconducting wire was obtained without any black brittle parts appearing on the surface of the wire, and when its superconducting properties were measured, the critical current value in a magnetic field of 4.2 K and 4 T was obtained. but
70A, and it was confirmed that it has high characteristics.

以上の説明で明らかなようにこの発明の製造方
法によれば、ブロンズ−Snメツキ法において表
面のSnメツキ層の厚みを厚くしても表面に黒色
の脆いNb3Sn2を生成することなくNb3Snを生成さ
せることができ、したがつて多量のNb3Snを生成
するべく表面のSnメツキ層を厚くして、高い超
電導特性を有する超電導線を実際的に安定して製
造することができ、しかも機械的特性を低下させ
ることがない等、種々の効果を得ることができ
る。
As is clear from the above explanation, according to the manufacturing method of the present invention, even if the thickness of the Sn plating layer on the surface is increased in the bronze - Sn plating method, Nb 3Sn , and therefore, by thickening the Sn plating layer on the surface to generate a large amount of Nb3Sn , it is possible to practically and stably manufacture superconducting wires with high superconducting properties. Moreover, various effects can be obtained, such as not deteriorating mechanical properties.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図A〜Eはこの発明の前提となるブロンズ
−Cuメツキ法の一例を段階的に説明するための
略解図である。 2……Nb芯材、5……Cu−Sn合金基地、6…
…Snメツキ層。
FIGS. 1A to 1E are schematic illustrations for step-by-step explanation of an example of the bronze-Cu plating method that is the premise of this invention. 2...Nb core material, 5...Cu-Sn alloy base, 6...
...Sn metal layer.

Claims (1)

【特許請求の範囲】 1 Cu−Sn合金の基地中に多数のNb芯材を埋込
んで複合線を作り、その複合線に縮径加工を施し
た後Cu−Sn合金基地の表面にSnメツキを施し、
しかる後Snを拡散させてNb3Snを生成するNb3Sn
系超電導線の製造方法において、 前記Snメツキ後にSnの融点よりも低くかつ100
℃以上の温度で1次熱処理を施し、次いでSnの
融点より高くかつNb3Sn生成温度よりも低い温度
で2次熱処理を施し、さらにNb3Sn生成温度で熱
処理を施してNb3Snを生成させることを特徴とす
るNb3Sn系超電導線の製造方法。
[Claims] 1 A composite wire is made by embedding a large number of Nb core materials in a Cu-Sn alloy base, and after the composite wire is subjected to diameter reduction processing, Sn plating is applied to the surface of the Cu-Sn alloy base. administer,
After that, Sn is diffused to produce Nb 3 Sn .
In the method for manufacturing a superconducting wire, after the Sn plating, the temperature is lower than the melting point of Sn and 100%
First heat treatment is performed at a temperature of ℃ or higher, then second heat treatment is performed at a temperature higher than the melting point of Sn and lower than the Nb 3 Sn formation temperature, and further heat treatment is performed at the Nb 3 Sn formation temperature to generate Nb 3 Sn. A method for manufacturing a Nb 3 Sn-based superconducting wire, characterized by:
JP5576980A 1980-04-25 1980-04-25 Method of manufacturing nb3sn superconductive wire Granted JPS56152106A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5576980A JPS56152106A (en) 1980-04-25 1980-04-25 Method of manufacturing nb3sn superconductive wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5576980A JPS56152106A (en) 1980-04-25 1980-04-25 Method of manufacturing nb3sn superconductive wire

Publications (2)

Publication Number Publication Date
JPS56152106A JPS56152106A (en) 1981-11-25
JPS6262003B2 true JPS6262003B2 (en) 1987-12-24

Family

ID=13008067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5576980A Granted JPS56152106A (en) 1980-04-25 1980-04-25 Method of manufacturing nb3sn superconductive wire

Country Status (1)

Country Link
JP (1) JPS56152106A (en)

Also Published As

Publication number Publication date
JPS56152106A (en) 1981-11-25

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