JPS6262451U - - Google Patents

Info

Publication number: JPS6262451U
Authority: JP; Japan
Prior art keywords: semiconductor device; substrate; stacked; selectively; utility
Prior art date: 1985-10-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1985152772U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-10-04

Filing date

1985-10-04

Publication date

1987-04-17

1985-10-04 Application filed filed Critical

1985-10-04 Priority to JP1985152772U priority Critical patent/JPS6262451U/ja

1987-04-17 Publication of JPS6262451U publication Critical patent/JPS6262451U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Semiconductor Integrated Circuits (AREA)

JP1985152772U 1985-10-04 1985-10-04 Pending JPS6262451U (it)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1985152772U JPS6262451U (it)	1985-10-04	1985-10-04

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1985152772U JPS6262451U (it)	1985-10-04	1985-10-04

Publications (1)

Publication Number	Publication Date
JPS6262451U true JPS6262451U (it)	1987-04-17

Family

ID=31071051

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1985152772U Pending JPS6262451U (it)	1985-10-04	1985-10-04

Country Status (1)

Country	Link
JP (1)	JPS6262451U (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2008541431A (ja) *	2005-05-04	2008-11-20	スパンジョン・リミテッド・ライアビリティ・カンパニー	マルチチップモジュールおよび製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5892230A (ja) *	1981-11-27	1983-06-01	Mitsubishi Electric Corp	半導体装置

1985
- 1985-10-04 JP JP1985152772U patent/JPS6262451U/ja active Pending

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5892230A (ja) *	1981-11-27	1983-06-01	Mitsubishi Electric Corp	半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2008541431A (ja) *	2005-05-04	2008-11-20	スパンジョン・リミテッド・ライアビリティ・カンパニー	マルチチップモジュールおよび製造方法
JP4785917B2 (ja) *	2005-05-04	2011-10-05	スパンションエルエルシー	マルチチップモジュールの製造方法

Publication	Publication Date	Title
JPS61166342U (it)	1986-10-15
JPH0332445U (it)	1991-03-29
JPS61141907U (it)	1986-09-02
JPS6247152U (it)	1987-03-23
JPS6244448U (it)	1987-03-17
JPH0270458U (it)	1990-05-29
JPS59144759U (ja)	1984-09-27	鉛蓄電池の収納ケ−ス
JPS6228454U (it)	1987-02-20
JPS6258042U (it)	1987-04-10
JPS643238U (it)	1989-01-10
JPS6290541U (it)	1987-06-10
JPS61184274U (it)	1986-11-17
JPS6232534U (it)	1987-02-26
JPS6281156U (it)	1987-05-23
JPS6296522U (it)	1987-06-19
JPS6194012U (it)	1986-06-17
JPS61153199U (it)	1986-09-22
JPS6195302U (it)	1986-06-19
JPS6163852U (it)	1986-04-30
JPS6044442U (ja)	1985-03-28	電源装置
JPS633065U (it)	1988-01-09
JPH01161331U (it)	1989-11-09
JPS61188309U (it)	1986-11-25
JPH0188459U (it)	1989-06-12
JPH01154653U (it)	1989-10-24