JPS626261A - Automatic exposing device for printed wiring board - Google Patents

Abstract

PURPOSE:To obtain a small-sized, efficient device by using one mechanism to convey a substrate onto an exposing machine by a conveying machine and press and fixing the substrate as it is, and then to expose and convey the substrate. CONSTITUTION:The carrier 5 of the conveying machine 30 moves onto the substrate 2 which is maintained by a throwing-in machine 1 at specific height and the substrate is lifted by a sucker 6 for conveyance and moved as shown by an arrow E onto the glass plate 10 of an exposure part, thereby placing the substrate on the glass plate 10 at a specific position. When vacuum suction is carried out through a suction hole 80 by a vacuum device provided to the exposure part, a soft film 40 deforms along the substrate 2, sucker 6 for conveyance, and packing 70 to contact the substrate 2, which is fixed. Then, light from a light source 12 reaches the substrate 2 through the glass plate 10 of the exposure part and the substrate is exposed to a circuit pattern drawn on the glass plate 10. The vacuum suction is carried on even after the exposure to lift the substrate 2 by the sucker 6 for conveyance and the carrier 5 is moved right onto a receiving machine 13 and the suction of the sucker 6 for conveyance is released to place the substrate 2 on the receiving machine 13, thus completing the exposure.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an automatic exposure machine that exposes a necessary circuit pattern onto a copper foil provided on the outside of a printed wiring board.

[Conventional technology]

After the printed wiring board is integrally molded with copper foil on the outside.

The necessary circuit pattern is exposed, unnecessary parts are peeled off, and the remaining parts are subjected to surface treatment such as plating to complete the process. FIG. 5 is a sectional view showing a conventional automatic exposure machine for exposing a circuit pattern necessary for a printed wiring board.

In the figure, reference numeral 1) is a loading machine on which a printed wiring board (2) is placed and sequentially conveyed to a conveyor (3), and the board 12) is always held at a fixed position by a loading machine drive unit (4). Also(
5) is a carrier equipped with a conveying suction cup (6) for sucking up and conveying substrates (2) one by one, and is moved by a moving part (8) along a guide (7) in the left-right direction of arrow A. (9) is carried by the carrier (3) and moves up and down in the direction of arrow B with a substrate holder that presses down the substrate (2) placed on the exposure section glass plate a. 2) Fix. @
is a light source that exposes the fixed substrate (2) via the exposure glass plate aQ. At the opposite end is a receiving machine that receives the substrate (2) carried by the carrier machine (3) after exposure.

The conventional automatic exposure apparatus for printed wiring boards is configured as described above, and the board (2) before 0 exposure is exposed in the secondary manner.
are sequentially held in a fixed position by a feeding machine (!), sucked up by a conveying suction cup (6) on a conveying machine (3), and fixed to a carrier (5). Next, the carrier (5) is moved in the direction of arrow A along the guide (7) onto the glass plate α in the exposure area, the suction by the transport suction cup (6) is released, and the substrate (2) is moved in the exposure area. The carrier (5) is placed on the glass plate α and returns to the top of the loading machine (1).

Thereafter, the substrate holder (9) moves in the direction of arrow B, and the substrate (
2) in the specified position, and use the vacuum suction cup aυ to hold the board (2).
) is closely fixed to the exposure glass plate α1, and then a predetermined circuit pattern is exposed on the copper foil portion of the substrate (2) using light from a light source az. After the exposure is completed, the substrate holder (9) moves above the arrow B, and the gear rear (5), which had been returned to the top of the loading machine (1), moves to the top of the exposed substrate (2), and the transfer suction cup ( 6
), the substrate (2) is sucked up and moved to the receiving machine @3, and the substrate (2) is placed on the receiving mechanism in preparation for the ninth step.

[Problem that the invention seeks to solve]

In the conventional automatic exposure apparatus for printed wiring boards, as described above, the board is transported by the transporter to the top of the glass plate in the exposure area, and after the board is placed on the glass plate in the exposure area, the substrate holder is first lowered from above. The substrate is fixed in a predetermined position using a vacuum suction cup, and the device is tightly attached and fixed to the exposure glass plate using a vacuum suction cup. Therefore, since the structure is such that six substrates are transported by two devices, a transporter and a substrate holder, chips and the like easily get stuck on the substrates and the glass plate in the exposure area, and the chips cause abnormal rotation patterns to be exposed. There was a problem that it could be done.

In addition, since the substrate is transported and fixed by two mechanisms, a transporter and a substrate holder, there is a problem that the equipment tends to be large-sized, and the occupied area and cost become large.

The automatic exposure apparatus for printed wiring boards according to the present invention has been made in order to solve the above-mentioned problems.

The purpose is to create a compact and efficient device by having a single mechanism perform the work of transporting the board onto the exposure machine using a transport machine, fixing it as it is, pressing the board, exposing it, and then transporting it to the receiving machine. shall be.

[Means for solving problems]

An automatic exposure apparatus for printed wiring boards according to the present invention is provided.

A feeding machine for the printed wiring board and a flexible film are provided on the support plate, and a suction cup for suctioning the printed wiring board and transporting it to the exposure machine is provided. This automatic exposure apparatus has a conveyor that performs a series of operations such as evacuating the substrate through a suction port, fixing the substrate with a soft film, and conveying the evacuated substrate after exposure to a receiving machine.

[For production]

An automatic exposure apparatus for printed wiring boards according to the present invention is provided.

The substrate t'' is transported by a transport machine to an exposure machine, and the substrate is fixed together with a vacuum device provided in the exposure machine and exposed.

After exposure, the vacuum is released, the substrate is continuously transported to the receiving machine by the transport machine, and then the substrate is transported to the receiving machine. To eliminate the need for an independent substrate holding mechanism during pre-light.

〔Example〕

1 to 4 show an automatic exposure device for printed wiring boards according to an embodiment of the present invention, and FIG. 1 is a front view of this device;
FIG. 2 is a side view seen from the direction of arrow C in FIG.

Figures 3 and 4 are cross-sectional views taken along the line D-D in Figure 2, Figure 3 shows the state in which the substrate has been transported to the exposure machine, and Figure 4 shows the state in which the substrate is fixed. . In the figure, Oite Ix+,
(21, (4) ~ (81, al, αa.

The return is either the same as the previous example or a different product. (to) is a conveyor for conveying the substrate (2), which is provided on the support plate (50) of the conveyance suction cup (6) of the i-carrier (5) with a soft film (40) made of synthetic resin or rubber. (60) is a support part located in the exposure area and to which the exposure area glass plate lle is fixed, and on the surface on which the exposure area glass temporary holder rests, a gasket (70) made of rubber or synthetic resin is used to hold the exposure area glass temporary holder. It is surrounded by

Reference numeral (80) denotes a suction hole provided in the support portion (60) of the exposure section, which is directly connected to a vacuum device (not shown) provided in the exposure section.

The automatic exposure apparatus for a printed wiring board according to one embodiment is constructed as described above, and the board is exposed as follows. First, the carrier (5) of the conveying machine (to) is moved onto the substrate (2) which is maintained at a predetermined height by the loading machine (1).

Lift the substrate (2) with the transport suction cup (6), move it in the direction of arrow E, reach above the exposure section glass plate α, and place it at a predetermined position on the exposure section glass device as shown in Fig. 3. board (2)
t- put.

A vacuum device (not shown) installed in the exposure section
When vacuum is drawn from the suction hole (80) in the direction of arrow F in FIG. 4, the soft film (40) is removed.

The air in the space consisting of the support part (60) and the packing (70) is sucked, and the soft film (40) is
As shown in Figure 4, the board (2) and the suction cup for transportation ((i)
, deforms along the packing (70), comes into close contact with the substrate (2), and fixes the substrate (2). Next, the light from the light source Q3 passes through the exposure glass plate αIt and reaches the substrate (2), where it is exposed with the circuit pattern written on the exposure glass plate α. After exposure, release the vacuum by the vacuum device (not shown), lift the substrate (2) with the transport suction cup (6), move the carrier (5) to the right, transport it onto the receiver 0, and transport it. The suction of the suction cup (6) is released, the substrate (2) is placed on the receiver Q3, and the exposure is completed.

〔Effect of the invention〕

As described above, the automatic exposure apparatus for printed wiring boards according to the present invention has a feeding device that automatically feeds printed wiring boards, and a suction cup that sucks and conveys the printed wiring boards after feeding, and a support plate that supports the suction cups. It is transported laterally to the exposure machine along with the provided soft film.

After moving the substrate up and down and setting it in a predetermined position, it is evacuated by the vacuum device installed in the exposure machine, the soft film is brought into close contact with the substrate, exposed, the vacuum is released, and the substrate is lifted with a suction cup and received. Since it is comprised of a transport machine that transports the substrate to the machine and a receiver that receives the board after it has been transported, it has the effect of eliminating the need for a separate holding mechanism that holds the board during exposure.

A soft film is also provided on the support plate of the carrier.

The board is sucked up by the suction cup supported by this support plate,
When placed on a glass plate in the exposure area and evacuated using a vacuum device installed in the exposure area, the soft film adheres to the substrate regardless of the shape of the suction cup.

This has the effect of ensuring that the substrate and the glass plate of the exposure section are in close contact with each other, allowing for accurate exposure.

In addition, since the substrate is not transferred and exposed using a conveyor and a substrate holding mechanism, the frequency of dust entering the exposure area glass plate is reduced, which has the effect of preventing abnormal circuit patterns from being exposed. be.

[Brief explanation of drawings]

FIG. 1 is a front view showing an automatic exposure apparatus for printed wiring boards according to an embodiment of the present invention, and FIG. 2 shows the side plate of FIG.
4 are sectional views taken along line DD in FIG. 2. FIG. 5 is a diagram showing a conventional automatic exposure apparatus for printed wiring boards. In the figure, (1) is the loading machine, (2) is the printed wiring board, (
6) is a suction cup for transportation, III is the exposure glass plate, (1:
I is the receiver, (40) is the soft film, (50)
The holder is a forklift stand, and (80) is a suction port. The same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] A loading machine that automatically inputs printed wiring boards, a transporting machine that moves horizontally and vertically, and a transporting suction cup that attracts and transports the loaded printed wiring boards, and a transporter that moves horizontally and vertically. , an automatic exposure device for printed wiring boards consisting of an exposure unit that exposes printed wiring boards aligned on a glass plate, and a receiver that receives the printed wiring boards transported by a transport machine after exposure. A soft film is attached to the support plate that supports the suction cup, and when the printed wiring board is exposed, a vacuum is drawn from the suction port provided in the support of the exposed glass plate, and this soft film is tightly fixed to the printed wiring board. An automatic exposure apparatus for a printed wiring board, characterized in that, after exposure, the vacuum is released and the printed wiring board is taken out.