JPS627191A - Heat radiating/shielding plate for printed wiring board - Google Patents
Heat radiating/shielding plate for printed wiring boardInfo
- Publication number
- JPS627191A JPS627191A JP14460285A JP14460285A JPS627191A JP S627191 A JPS627191 A JP S627191A JP 14460285 A JP14460285 A JP 14460285A JP 14460285 A JP14460285 A JP 14460285A JP S627191 A JPS627191 A JP S627191A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- metal plate
- resin
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229920005989 resin Polymers 0.000 description 32
- 239000011347 resin Substances 0.000 description 32
- 230000000694 effects Effects 0.000 description 9
- 238000005452 bending Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明はプリント配線基板に用いられる放熱。[Detailed description of the invention] [Industrial application field] This invention is a heat dissipation device used in printed wiring boards.
シールド板に関するものである。This relates to a shield plate.
従来、プリント配線基板としては、樹脂板に・配線層、
スルホールが形成された樹脂プリント配線基板がある。Conventionally, printed wiring boards are made of resin plates, wiring layers,
There is a resin printed wiring board in which through holes are formed.
しかし、電子装置の小型化が進むにつれて、プリント配
線基板上への部品実装密度が上昇しているので、実装部
品から発せられる熱量が増大しているのに対し、樹脂プ
リント配線基板は放熱性が十分ではないため、樹脂プリ
ント配線基板およびその近傍の温度が上昇し、実装部品
の機能低下を起こして、大きな問題となっている。そこ
で、実装部品に放熱用フィン等を設けることも行なわれ
ているが、この場合には実装部品が高価になるという欠
点がある。また、実装部品が増大すると。However, as electronic devices become smaller, the density of component mounting on printed wiring boards has increased, and the amount of heat emitted from mounted components has increased, whereas resin printed wiring boards have poor heat dissipation. As a result, the temperature of the resin printed wiring board and its vicinity increases, causing a decline in the functionality of the mounted components, which has become a serious problem. Therefore, it has been attempted to provide heat dissipation fins or the like to the mounted components, but this has the disadvantage that the mounted components become expensive. Also, when the number of mounted parts increases.
樹脂プリント配線基板は曲げ剛性が小さいから、プリン
ト配線基板に反りが生ずるので、プリント配線基板を電
子装置に差し込むことが不能となり。Since the resin printed wiring board has low bending rigidity, the printed wiring board will warp, making it impossible to insert the printed wiring board into an electronic device.
あるいは電子装置に差し込めたとしても、近接するプリ
ント配線基板ｉ接触して、回路に重大な影響を与えるこ
とがある。さらに、樹脂プリント配線基板はシールド効
果が悪いため、ノイズ等を防止することができない。Or even if it can be inserted into an electronic device, it may come into contact with a nearby printed wiring board and have a serious effect on the circuit. Furthermore, since the resin printed wiring board has poor shielding effect, it is impossible to prevent noise and the like.
この発明は上述の問題点を解決するためになされたもの
で、樹脂プリント配線基板の放熱性を良好にし、樹脂プ
リント配線基板の曲げ剛性を大きくし、かつ樹脂プリン
ト配線基板のシールド効果をよくすることができるプリ
ント配線基板用放熱。This invention was made to solve the above-mentioned problems, and improves the heat dissipation of a resin printed wiring board, increases the bending rigidity of the resin printed wiring board, and improves the shielding effect of the resin printed wiring board. It can dissipate heat for printed wiring boards.
シールド板を提供することを目的とする。The purpose is to provide a shield plate.
この目的を達成するため、この発明においては金属板の
表面に絶縁層を設け、その絶縁層の表面に接着シートを
設け、その接着シートにカバー紙を貼着する。In order to achieve this object, in the present invention, an insulating layer is provided on the surface of a metal plate, an adhesive sheet is provided on the surface of the insulating layer, and a cover paper is adhered to the adhesive sheet.
このプリント配線基板用放熱、シールド板においては、
カバー紙を剥がして接着シートにより樹脂プリント配線
基板の表面に接着すれば、金属板を介して熱が放出され
、また金属板により曲げ剛性が大きくなり、さらに金属
板により電界、磁界を遮蔽することができるとともに、
絶縁層によりプリント配線基板の配線層と金属板とが導
通するのを有効に防止することが可能である。In this heat dissipation and shield board for printed wiring boards,
If you peel off the cover paper and adhere it to the surface of a resin printed wiring board using an adhesive sheet, heat will be released through the metal plate, the metal plate will increase bending rigidity, and the metal plate will also shield electric and magnetic fields. At the same time,
The insulating layer can effectively prevent conduction between the wiring layer of the printed wiring board and the metal plate.
第１図はこの発明に係るプリント配線基板用放熱、シー
ルド板の一部を示す断面図である０図において、ｌは金
属板、２は金属板１の表面、に設けられたプリプレーグ
等からなる絶縁層、３は絶縁層２の表面に設けられた接
着シート、４は接着シート３に貼着されたカバー紙であ
る。FIG. 1 is a sectional view showing a part of a heat dissipating and shielding plate for a printed wiring board according to the present invention. In FIG. The insulating layer 3 is an adhesive sheet provided on the surface of the insulating layer 2, and 4 is a cover paper stuck to the adhesive sheet 3.
第２図はこの発明に係る他のプリント配線基板用放熱、
シールド板の一部を示す断面図である。FIG. 2 shows another heat dissipation for a printed wiring board according to the present invention.
It is a sectional view showing a part of a shield plate.
この放熱、シールド板においては、金属板１の表面に凹
凸５が設けられている。In this heat dissipation and shielding plate, irregularities 5 are provided on the surface of the metal plate 1.
第３図は第１図に示した放熱、シールド板を樹脂プリン
ト配線基板に接着したものの一部を示す断面図である０
図において、６は樹脂板、７は樹脂板６に多層に形成さ
れた配線層、８は配線層７を接続するスルホールで、樹
脂プリント配線基板に接着シート３により金属板ｌが接
着されている。Figure 3 is a cross-sectional view showing a part of the heat dissipation and shield plate shown in Figure 1 bonded to a resin printed wiring board.
In the figure, 6 is a resin board, 7 is a wiring layer formed in multiple layers on the resin board 6, 8 is a through hole that connects the wiring layer 7, and a metal plate l is adhered to the resin printed wiring board by an adhesive sheet 3. .
９は金属板１等に設けられたリード線用穴で、リード線
用穴９の中心線はスルホール８の中心線と一致しており
、リード線用穴９の直径はスルホール８の直径よりも大
きい。Reference numeral 9 denotes a lead wire hole provided in the metal plate 1 etc. The center line of the lead wire hole 9 coincides with the center line of the through hole 8, and the diameter of the lead wire hole 9 is smaller than the diameter of the through hole 8. big.
つぎに、第３図に示したように樹脂プリント配線基板に
放熱、シールド板を接着する方法を第４図により説明す
る。まず、放熱、シールド板にリード線用穴９を設ける
（第４図（ａ））、つぎに、カバー紙４を接着シート３
から剥がす（第４図（ｂ））。Next, a method of bonding a heat dissipating and shielding plate to a resin printed wiring board as shown in FIG. 3 will be explained with reference to FIG. 4. First, holes 9 for lead wires are provided in the heat dissipation and shield plate (Fig. 4(a)), and then the cover paper 4 is attached to the adhesive sheet 3.
(Figure 4(b)).
ついで、第４図（ｃ）に示す樹脂プリント配線基板に接
着シート３により金属板１を接着する。この場合、リー
ド線用穴９の中心線とスルホール８の中心線とを一致さ
せる。最後に、樹脂プリン庫配線基板と金属板１とをロ
ーラ圧着または熱圧着する。Then, the metal plate 1 is bonded to the resin printed wiring board shown in FIG. 4(c) using the adhesive sheet 3. In this case, the center line of the lead wire hole 9 and the center line of the through hole 8 are made to coincide. Finally, the resin pudding cabinet wiring board and the metal plate 1 are bonded by roller pressure or thermocompression.
このように、樹脂プリント配線基板の表面に金属板１を
接着すれば、金属板ｌを介して熱が放出されるから、樹
脂プリント配線基板の放熱性が良好となる。そして、第
２図に示すように、金属板１の表面に凹凸５を設ければ
、さらに放熱性を良好にすることができる。また、金属
板１により曲げ剛性が大きくなる。さらに、金・肩板１
により電界、磁界を遮蔽することができるので、樹脂プ
リント配線基板のシールド効果がよくなる。さらに、カ
バー紙４を剥がして、接着シート３により樹脂プリント
配線基板に金属板１を接着するだけで、樹脂プリント配
線基板に金属板１を取付けることができるので、放熱性
が良好であり、曲げ剛性が大きく、しかもシールド効果
がよい樹脂プリント配線基板を極めて簡単に製造するこ
とができる。When the metal plate 1 is bonded to the surface of the resin printed wiring board in this way, heat is released through the metal plate 1, so that the resin printed wiring board has good heat dissipation properties. Further, as shown in FIG. 2, if unevenness 5 is provided on the surface of the metal plate 1, heat dissipation can be further improved. Further, the metal plate 1 increases bending rigidity. In addition, gold shoulder plate 1
Since the electric field and magnetic field can be shielded by this, the shielding effect of the resin printed wiring board is improved. Furthermore, since the metal plate 1 can be attached to the resin printed wiring board by simply peeling off the cover paper 4 and gluing the metal plate 1 to the resin printed wiring board using the adhesive sheet 3, heat dissipation is good and bending is possible. A resin printed wiring board with high rigidity and good shielding effect can be manufactured extremely easily.
また、金属板１と樹脂プリント配線基板とが絶縁層２を
介して接着されるから、樹脂プリント配線基板の金属板
１側表面に配線層７が形成されたとしても、その配線層
７と金属板１とが導通するのを有効に防止することがで
きる。Furthermore, since the metal plate 1 and the resin printed wiring board are bonded together via the insulating layer 2, even if the wiring layer 7 is formed on the surface of the resin printed wiring board on the metal plate 1 side, the wiring layer 7 and the metal Electrical conduction with the plate 1 can be effectively prevented.
なお、金属板１としては、アルミニウム板、銅板、鉄板
、アルミニウム合金板等を用いることができる。また、
接着シート３としてはエポキシ樹脂接着剤等からなるも
のを用いることができる。Note that as the metal plate 1, an aluminum plate, a copper plate, an iron plate, an aluminum alloy plate, etc. can be used. Also,
The adhesive sheet 3 may be made of epoxy resin adhesive or the like.
以上説明したように、この発明にかかるプリント配線基
板用放熱、シールド板においては、カバー紙を剥がして
樹脂プリント配線基板に金属板を接着すれば、極めて容
易に樹脂プリント配線基板に金属板を取付けることがで
き、この場合には樹脂プリント配線基板の放熱性が良好
となるか−ら。As explained above, in the heat dissipation and shield plate for printed wiring boards according to the present invention, the metal plate can be attached to the resin printed wiring board extremely easily by peeling off the cover paper and bonding the metal plate to the resin printed wiring board. In this case, the heat dissipation of the resin printed wiring board becomes better.
部品実装密度が高く、実装部品から発せられる熱量が多
くとも、実装部品の機能が低下することがないため、放
熱用フィン等を有する高価な実装部品を用いる必要がな
く、また曲げ剛性が大きいから、実装部品が増大したと
しても、プリント配線基板に反りが生ずることがないの
で、プリント配線基板を電子装置に差し込むのが容易で
あり、近接するプリント配線基板と接触することがなく
、さらに樹脂プリント配線基板のシールド効果がよくな
るため、ノイズ等を有効に防止することができる。また
、樹脂プリント配線基板の金属板側表面に形成された配
線層と金属板とが導通するのを有効に防止することがで
きるから、信頼性が高い。Because the mounting density of components is high and the functionality of the mounted components does not deteriorate even if a large amount of heat is emitted from the mounted components, there is no need to use expensive mounted components with heat dissipation fins, etc., and the bending rigidity is high. Even if the number of mounted components increases, the printed wiring board will not warp, so it is easy to insert the printed wiring board into an electronic device, there will be no contact with adjacent printed wiring boards, and the resin printed wiring board will not warp. Since the shielding effect of the wiring board is improved, noise etc. can be effectively prevented. Further, since electrical conduction between the wiring layer formed on the surface of the resin printed wiring board on the metal plate side and the metal plate can be effectively prevented, reliability is high.
このように、この発明の効果は顕著である。As described above, the effects of this invention are remarkable.
第１図、第２図はそれぞれこの発明に係るプリント配線
基板用放熱、シールド板の一部を示す断面図、第３図は
樹脂プリント配線基板に第１図に示した放熱、シールド
板を接着したものの一部を示す断面図、第４図は樹脂プ
リント配線基板に第１図に示した放熱、シールド板を接
着する方法の説明図である。
１・・・金属板 ２・・・絶縁層３・・・接
着シート ４・・・カバー紙５・・・凹凸Figures 1 and 2 are cross-sectional views showing a part of the heat dissipation and shield plate for printed wiring boards according to the present invention, respectively, and Figure 3 shows the heat dissipation and shield plates shown in Figure 1 bonded to the resin printed wiring board. FIG. 4 is a cross-sectional view showing a part of the structure, and is an explanatory diagram of a method of bonding the heat dissipating and shielding plate shown in FIG. 1 to the resin printed wiring board. 1...Metal plate 2...Insulating layer 3...Adhesive sheet 4...Cover paper 5...Irregularities
Claims (2)
と、その絶縁層の表面に設けられた接着シートと、その
接着シートに貼着されたカバー紙とを有することを特徴
とするプリント配線基板用放熱、シールド板。(1) A metal plate, an insulating layer provided on the surface of the metal plate, an adhesive sheet provided on the surface of the insulating layer, and a cover paper affixed to the adhesive sheet. Heat dissipation and shielding board for printed wiring boards.
る特許請求の範囲第１項記載のプリント配線基板用放熱
、シールド板。(2) The heat dissipation and shielding plate for a printed wiring board as set forth in claim 1, characterized in that the surface of the metal plate is provided with irregularities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14460285A JPS627191A (en) | 1985-07-03 | 1985-07-03 | Heat radiating/shielding plate for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14460285A JPS627191A (en) | 1985-07-03 | 1985-07-03 | Heat radiating/shielding plate for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS627191A true JPS627191A (en) | 1987-01-14 |
Family
ID=15365849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14460285A Pending JPS627191A (en) | 1985-07-03 | 1985-07-03 | Heat radiating/shielding plate for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS627191A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54162175A (en) * | 1978-06-12 | 1979-12-22 | Matsushita Electric Industrial Co Ltd | Method of producing printed circuit board |
-
1985
- 1985-07-03 JP JP14460285A patent/JPS627191A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54162175A (en) * | 1978-06-12 | 1979-12-22 | Matsushita Electric Industrial Co Ltd | Method of producing printed circuit board |
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