JPS627643B2 - - Google Patents
Info
- Publication number
- JPS627643B2 JPS627643B2 JP10187782A JP10187782A JPS627643B2 JP S627643 B2 JPS627643 B2 JP S627643B2 JP 10187782 A JP10187782 A JP 10187782A JP 10187782 A JP10187782 A JP 10187782A JP S627643 B2 JPS627643 B2 JP S627643B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- weight
- parts
- gold
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
Description
本発明は導体ペースト組成物の改良に関する。
導体ペーストして金ペースト、銀−パラジウム
ペースト、金−白金ペースト等が一般に使用され
ている。しかしこのような市販されているペース
トを用いて導体を形成するとその導体層の接着強
度は、アルミナ純度96％のアルミナ基板（以下96
％アルミナ基板という）を使用した場合は1.0〜
1.5Kg／mm2の接着強度を有するが、他の基板、例
えばアルミナ純度99.5％のアルミナ基板（以下
99.5％アルミナ基板という）やSiC基板を使用す
ると接着強度が弱く、耐半田性、ボンデイング性
の面で満足すべきものではない。
本発明はこれらの欠点のない導体ペースト組成
物を提供することを目的とするものである。
本発明は金粉、銀−パラジウム粉又は金−白金
粉100重量部にCu粉とMn粉との混合粉１〜４重
量部、結合剤及び溶媒を添加混合してなる導体ペ
ースト組成物に関する。
Cu粉とMn粉との配合割合については特に制限
はないが、Cu粉とMn粉との混合粉は金粉、銀−
パラジウム粉又は金−白金粉100重量部に対し１
〜４重量部添加することが必要であり、１重量部
未満の場合は接着強度が弱く、また４重量部を越
えると導体回路の比抵抗が急激に上昇し導体とし
ての性能が低下し本発明の目的を達成することが
できない。
また本発明において結合剤としてはエチルセル
ロース、ニトロセルロース、アクリル樹脂、エポ
キシ樹脂等が、また溶媒としてはテレピネオー
ル、カルビトールアセテート等が使用されるが、
これらの配合量については特に制限はない。
本発明の導体ペースト組成物には上記の他に必
要に応じホウケイ酸鉛ガラス、ホウケイ酸バリウ
ム等のガラス質成分が添加される。
以下実施例により本発明を説明する。
実施例 １
Au粉100重量部に第１表に示す量のCu粉とMn
粉との混合粉（Cu粉60重量％、Mn粉40重量
％）、さらに結合剤としてエチルセルロース６重
量部、溶媒としてテレピネオール40重量部及びガ
ラス質成分としてホウケイ酸鉛ガラス20重量部を
添加して擂潰機にて均一に混合してペースト化し
て導体ペーストを得た。
次に96％アルミナ基板、99.5％アルミナ基板及
びSiC基板上に前記で得た導体ペーストをスクリ
ーン印刷し、ついで850℃で焼成した後所定の金
属を半田付して接着強度試験を行なつた。その試
験結果も合わせて第１表に示す。
The present invention relates to improvements in conductor paste compositions. Gold paste, silver-palladium paste, gold-platinum paste, etc. are generally used as conductor pastes. However, when a conductor is formed using such a commercially available paste, the adhesive strength of the conductor layer is as low as that of an alumina substrate with an alumina purity of 96% (hereinafter referred to as 96%).
% alumina substrate) is used: 1.0~
Although it has an adhesive strength of 1.5Kg/ mm2 , it can be used with other substrates, such as alumina substrates with alumina purity of 99.5% (hereinafter referred to as
When using a 99.5% alumina substrate) or a SiC substrate, the adhesive strength is weak and the solder resistance and bonding properties are unsatisfactory. The object of the present invention is to provide a conductor paste composition that does not have these drawbacks. The present invention relates to a conductor paste composition prepared by adding and mixing 1 to 4 parts by weight of a mixed powder of Cu powder and Mn powder, a binder, and a solvent to 100 parts by weight of gold powder, silver-palladium powder, or gold-platinum powder. There is no particular restriction on the blending ratio of Cu powder and Mn powder, but the mixed powder of Cu powder and Mn powder is gold powder, silver powder, silver powder, etc.
1 per 100 parts by weight of palladium powder or gold-platinum powder
It is necessary to add up to 4 parts by weight; if it is less than 1 part by weight, the adhesive strength will be weak, and if it exceeds 4 parts by weight, the specific resistance of the conductor circuit will sharply increase and the performance as a conductor will deteriorate. unable to achieve its purpose. Furthermore, in the present invention, ethyl cellulose, nitrocellulose, acrylic resin, epoxy resin, etc. are used as the binder, and terpineol, carbitol acetate, etc. are used as the solvent.
There are no particular restrictions on the amounts of these ingredients. In addition to the above, glass components such as lead borosilicate glass and barium borosilicate may be added to the conductor paste composition of the present invention, if necessary. The present invention will be explained below with reference to Examples. Example 1 Add Cu powder and Mn in the amounts shown in Table 1 to 100 parts by weight of Au powder.
A mixed powder with powder (60% by weight of Cu powder, 40% by weight of Mn powder), further added 6 parts by weight of ethyl cellulose as a binder, 40 parts by weight of terpineol as a solvent, and 20 parts by weight of lead borosilicate glass as a vitreous component. A conductor paste was obtained by uniformly mixing and forming a paste using a crusher. Next, the conductive paste obtained above was screen printed on a 96% alumina substrate, a 99.5% alumina substrate, and a SiC substrate, and then baked at 850° C., and then predetermined metals were soldered to conduct an adhesive strength test. The test results are also shown in Table 1.
【表】
実施例 ２
銀−パラジウム粉100重量部に第２表に示す量
のCu粉とMn粉との混合粉（Cu粉60重量％、Mn
粉40重量％）、以下実施例１と同様の配合及び同
様の方法にて導体ペーストを得た。その後実施例
１と同様の方法にて接着強度試験を行なつた。そ
の試験結果を第２表に示す。[Table] Example 2 Mixed powder of Cu powder and Mn powder in the amounts shown in Table 2 to 100 parts by weight of silver-palladium powder (60% by weight of Cu powder, Mn powder)
powder (40% by weight), a conductor paste was obtained using the same formulation and method as in Example 1. Thereafter, an adhesive strength test was conducted in the same manner as in Example 1. The test results are shown in Table 2.
【表】【table】
【表】
実施例 ３
金−白金粉100重量部に第３表に示す量のCu粉
とMn粉との混合粉（Cu粉60重量％、Mn粉40重
量％）、以下実施例１と同様の配合及び同様の方
法にて導体ペーストを得た。その後実施例１と同
様の方法にて接着強度試験を行なつた。その試験
結果を第３表に示す。[Table] Example 3 A mixed powder of 100 parts by weight of gold-platinum powder and the amounts of Cu powder and Mn powder shown in Table 3 (60% by weight of Cu powder, 40% by weight of Mn powder), the same as in Example 1. A conductor paste was obtained using the same formulation and method. Thereafter, an adhesive strength test was conducted in the same manner as in Example 1. The test results are shown in Table 3.
【表】
第１表、第２表及び第３表からわかるように本
発明の実施例になる導体ペースト組成物を用いれ
ば、99.5％アルミナ基板及びSiC基板を使用して
も、96％アルミナ基板を使用したときのように
1.0〜1.5Kg／mm2の接着強度を有することがわか
る。
本発明は金粉、銀−パラジウム粉又は金−白金
粉100重量部にCu粉とMn粉との混合粉１〜４重
量部、結合剤及び溶媒を添加混合してなる導体ペ
ースト組成物を使用するので、99.5％アルミナ基
板及びSiC基板を使用しても1.0〜1.5Kg／mm2の接
着強度を有することができ、耐半田性、ボンデイ
ング性の面において満足すべきものとなる。[Table] As can be seen from Tables 1, 2, and 3, if the conductor paste composition according to the embodiment of the present invention is used, even if a 99.5% alumina substrate and a SiC substrate are used, a 96% alumina substrate can be used. like when using
It can be seen that the adhesive strength is 1.0 to 1.5 Kg/mm 2 . The present invention uses a conductor paste composition prepared by adding and mixing 1 to 4 parts by weight of a mixed powder of Cu powder and Mn powder, a binder, and a solvent to 100 parts by weight of gold powder, silver-palladium powder, or gold-platinum powder. Therefore, even if a 99.5% alumina substrate and a SiC substrate are used, an adhesive strength of 1.0 to 1.5 Kg/mm 2 can be obtained, which is satisfactory in terms of solder resistance and bonding properties.
Claims (1)
重量部に、Cu粉とMn粉との混合粉１〜４重量
部、結合剤及び溶媒を添加混合してなる導体ペー
スト組成物。1 Gold powder, silver-palladium powder or gold-platinum powder 100
A conductor paste composition prepared by adding and mixing 1 to 4 parts by weight of a mixed powder of Cu powder and Mn powder, a binder, and a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187782A JPS58218702A (en) | 1982-06-14 | 1982-06-14 | Conductor paste composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187782A JPS58218702A (en) | 1982-06-14 | 1982-06-14 | Conductor paste composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218702A JPS58218702A (en) | 1983-12-20 |
| JPS627643B2 true JPS627643B2 (en) | 1987-02-18 |
Family
ID=14312186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10187782A Granted JPS58218702A (en) | 1982-06-14 | 1982-06-14 | Conductor paste composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218702A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5817188B2 (en) * | 2011-04-11 | 2015-11-18 | Tdk株式会社 | Conductive paste, glass ceramic substrate and electronic component module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55149356A (en) * | 1979-05-09 | 1980-11-20 | Fujikura Kasei Kk | Electrically conductive coating |
| US4414143A (en) * | 1981-05-06 | 1983-11-08 | E. I. Du Pont De Nemours & Co. | Conductor compositions |
-
1982
- 1982-06-14 JP JP10187782A patent/JPS58218702A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58218702A (en) | 1983-12-20 |
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