JPS6276530U - - Google Patents

Info

Publication number
JPS6276530U
JPS6276530U JP16793685U JP16793685U JPS6276530U JP S6276530 U JPS6276530 U JP S6276530U JP 16793685 U JP16793685 U JP 16793685U JP 16793685 U JP16793685 U JP 16793685U JP S6276530 U JPS6276530 U JP S6276530U
Authority
JP
Japan
Prior art keywords
wafer
transmitting plate
light transmitting
support stage
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16793685U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16793685U priority Critical patent/JPS6276530U/ja
Publication of JPS6276530U publication Critical patent/JPS6276530U/ja
Pending legal-status Critical Current

Links

JP16793685U 1985-10-31 1985-10-31 Pending JPS6276530U (uk)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16793685U JPS6276530U (uk) 1985-10-31 1985-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16793685U JPS6276530U (uk) 1985-10-31 1985-10-31

Publications (1)

Publication Number Publication Date
JPS6276530U true JPS6276530U (uk) 1987-05-16

Family

ID=31100338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16793685U Pending JPS6276530U (uk) 1985-10-31 1985-10-31

Country Status (1)

Country Link
JP (1) JPS6276530U (uk)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105226A1 (ja) * 2007-02-26 2008-09-04 Dai Nippon Printing Co., Ltd. 露光機のワークステージ、露光方法及び構造体の製造方法
JP2012089641A (ja) * 2010-10-19 2012-05-10 Mitsubishi Electric Corp 半導体装置の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105226A1 (ja) * 2007-02-26 2008-09-04 Dai Nippon Printing Co., Ltd. 露光機のワークステージ、露光方法及び構造体の製造方法
GB2461653A (en) * 2007-02-26 2010-01-13 Dainippon Printing Co Ltd Work stage for exposure device, exposure method, and method of manufacturing structure body
GB2461653B (en) * 2007-02-26 2012-06-13 Dainippon Printing Co Ltd Work stage for exposing apparatus, exposing method and method of manufacturing a structure
JP5240185B2 (ja) * 2007-02-26 2013-07-17 大日本印刷株式会社 露光機のワークステージ、露光方法及び構造体の製造方法
US9158210B2 (en) 2007-02-26 2015-10-13 Dai Nippon Printing Co., Ltd. Work stage of exposing apparatus, exposing method and method of manufacturing a structure
JP2012089641A (ja) * 2010-10-19 2012-05-10 Mitsubishi Electric Corp 半導体装置の製造方法

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