JPS627872A - Formation of metallic pattern on surface of synthetic resin - Google Patents
Formation of metallic pattern on surface of synthetic resinInfo
- Publication number
- JPS627872A JPS627872A JP14622885A JP14622885A JPS627872A JP S627872 A JPS627872 A JP S627872A JP 14622885 A JP14622885 A JP 14622885A JP 14622885 A JP14622885 A JP 14622885A JP S627872 A JPS627872 A JP S627872A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molded body
- synthetic resin
- palladium
- cellulose fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 10
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 10
- 230000015572 biosynthetic process Effects 0.000 title 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229920003043 Cellulose fiber Polymers 0.000 claims abstract description 20
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 abstract description 22
- 239000011347 resin Substances 0.000 abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 13
- 238000007772 electroless plating Methods 0.000 abstract description 11
- 239000005011 phenolic resin Substances 0.000 abstract description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 5
- 229920001568 phenolic resin Polymers 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 5
- 229910000831 Steel Inorganic materials 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 4
- 239000010959 steel Substances 0.000 abstract description 4
- 238000007654 immersion Methods 0.000 abstract description 3
- 239000004640 Melamine resin Substances 0.000 abstract description 2
- 229920000877 Melamine resin Polymers 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 239000000017 hydrogel Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000000243 solution Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000008131 herbal destillate Substances 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- -1 pulp Polymers 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は９合成樹脂に充てんされたセルロース繊維を露
出させ、これをパラジウムヒドロゾルに浸漬した後、無
電解金属めっきすることを特徴とする。配線板の製造に
有用な金属パターン形成方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is characterized in that cellulose fibers filled with 9 synthetic resin are exposed, immersed in palladium hydrosol, and then subjected to electroless metal plating. The present invention relates to a metal pattern forming method useful for manufacturing wiring boards.
従来の技術
電子機器に用いられる配線板は９表面に銅を張った合成
樹脂板に配線パターンに従ってレジストポリマーをかぶ
せた後エツチングして不要の銅を除去する方法で製造さ
れている。この他、無電解めっきによる方法もあり、こ
れは、樹脂表面に。BACKGROUND OF THE INVENTION Wiring boards used in electronic equipment are manufactured by a method in which a synthetic resin board coated with copper on its surface is coated with a resist polymer according to a wiring pattern, and then etched to remove unnecessary copper. In addition, there is also a method using electroless plating, which is applied to the resin surface.
めっきの触媒となるパラジウムなどをパターンに従って
付与しておき２次に無電解めっきを施して配線パターン
を形成させるものである。また、配線を高密度化するた
め、樹脂の両側または内部にも配線する場合には、各層
を接続するため樹脂板に穴をあけ内部を金属めっきする
スルーホールめっきが施される。こうした、樹脂表面に
おける配線パターンの形成およびスルーホールめうきの
ためには、レジストの付与、エツチング、触媒の付与、
および無電解めっきを組み合わせた複雑な工程を必要と
する。Palladium or the like, which serves as a plating catalyst, is applied according to a pattern, and then electroless plating is performed to form a wiring pattern. Further, in order to increase the density of wiring, when wiring is to be made on both sides of the resin or inside the resin, through-hole plating is performed in which holes are made in the resin plate and the inside is plated with metal in order to connect each layer. In order to form wiring patterns and through-holes on the resin surface, resist application, etching, catalyst application,
It requires a complex process that combines electroless plating and electroless plating.
発明が解決しようとする問題点
本発明は、レジストを用いず、またエツチング操作を含
まない簡単な工程で配線パターンの形成およびスルーホ
ールめっきを行うことを目的としてなされたものである
。Problems to be Solved by the Invention The present invention has been made for the purpose of forming a wiring pattern and through-hole plating in a simple process that does not use a resist and does not include an etching operation.
問題点を解決するための手段
本発明者らは、簡単な操作で樹脂成形体の表面にパター
ン金属めっきを施す方法について鋭意研究した結果、充
てん剤としてセルロース繊維を含む合成樹脂成形体を用
いた場合、セルロース繊維の露出している部分にのみパ
ラジウムコロイドが吸着され、これを無電解めっきする
とこの部分のみが金属被覆されることを見出し１本発明
をなすに至った。Means for Solving the Problems As a result of intensive research into a method of applying pattern metal plating to the surface of a resin molded body using simple operations, the present inventors have developed a method using a synthetic resin molded body containing cellulose fibers as a filler. In this case, palladium colloid is adsorbed only on the exposed parts of the cellulose fibers, and when electroless plating is applied to these parts, only these parts are coated with metal, and the present invention has been completed.
すなわち９本発明は、セルロース繊維を充てんした樹脂
成形体の表面に所定のパターンに従ってセルロース繊維
を露出させた後、これをパラジウムヒドロゾル中に浸漬
してパラジウムコロイドをセルロース露出部分に吸着さ
せ９次いで無電解めっきすることを特徴とする樹脂成形
体表面上の金属パターン形成方法を提供するものである
。That is, the present invention exposes cellulose fibers according to a predetermined pattern on the surface of a resin molded body filled with cellulose fibers, and then immerses the cellulose fibers in palladium hydrosol to adsorb palladium colloid to the exposed cellulose parts. The present invention provides a method for forming a metal pattern on the surface of a resin molded body, which is characterized by electroless plating.
本発明方法において用いられる樹脂成形体は。The resin molded article used in the method of the present invention is as follows.
内部に充てん物として紙、パルプ、綿などのセルロース
繊維を均質に含むもので、その外形は板状。The inside is filled with cellulose fibers such as paper, pulp, and cotton, and the outside shape is plate-like.
棒状その他の任意の形状のものでよい。樹脂としては、
フェノール樹脂、メラミン樹脂、エポキシ樹脂などの熱
硬化性樹脂の他、ポリスチレン、ポリメチルメタクリレ
ートなどが用いられる。この目的のために得られる市販
品としては１紙を充てんしたフェノール樹脂板が最も一
般的なものである。It may be rod-shaped or any other shape. As a resin,
In addition to thermosetting resins such as phenol resin, melamine resin, and epoxy resin, polystyrene, polymethyl methacrylate, and the like are used. The most common commercially available product for this purpose is a phenolic resin board filled with paper.
本発明方法において用いられるパラジウムとドロゾルは
、塩化パラジウム（ｍなどのパラジウム塩水溶液を、ヒ
ドラジン、水素化ホウ素す）９ウムなどにより還元する
公知の方法により得られるもので、陽イオン性または陰
イオン性界面活性剤を安定剤として含むものが適する。The palladium and dorosol used in the method of the present invention are obtained by a known method of reducing an aqueous palladium salt solution such as palladium chloride (m) with hydrazine, borohydride, etc., and are either cationic or anionic. Those containing a surfactant as a stabilizer are suitable.
パラジウム濃度が低い場合には、安定剤を含まないパラ
ジウムヒドロゾルも適用できるが、こうしため不利であ
る。この他のポリビニルピロリドンなどの水溶性高分子
や、ポリエチレングリコール系の非イオン性界面活性剤
により安定化されたパラジウムヒドロゾルは、これに含
まれるパラジウムコロイドがセルロース露出部分に吸着
されないため用い得ない。If the palladium concentration is low, palladium hydrosols without stabilizers can also be applied, but this is disadvantageous. Palladium hydrosols stabilized with other water-soluble polymers such as polyvinylpyrrolidone or polyethylene glycol-based nonionic surfactants cannot be used because the palladium colloid contained therein is not adsorbed to exposed cellulose parts. .
本発明方法では、無電解金属めっき液が用いられるが、
これには還元剤として次亜リン酸ナトリウム、ヒドラジ
ン、ホルムアルデヒドなどを含む既存のニッケル、コバ
ルト、ｔ！４などの無電解めっき液が適用される。In the method of the present invention, an electroless metal plating solution is used,
This includes existing nickel, cobalt, t! Electroless plating solution such as No. 4 is applied.
本発明方法を実施するには、まず、セルロース繊維充て
ん合成樹脂成形体の表面に所定のパターンに従ってセル
ロース繊維を露出させる。このためには、たとえば鋼鉄
製のような硬い材質の刃物。To carry out the method of the present invention, first, cellulose fibers are exposed on the surface of a cellulose fiber-filled synthetic resin molded article according to a predetermined pattern. For this purpose, a knife made of a hard material, such as steel, is required.
ヤスリ、ドリルなどの工作用具を用いて樹脂を切削、研
摩、切断または穴あけし、または、加熱溶融して表面の
樹脂を一部除去するなどの手段がとられる。こうして所
定の部分にセルロース繊維をロゾル中に浸漬する。ここ
で、微量付着した油脂などの汚れを除（ため、浸漬に先
立ってエタノールなどの有機溶媒で洗浄し、のち水洗し
ておくのが望ましい。パラジウムヒドロゾル中のパラジ
ウム濃度は、 ０．０１〜５ ｍｇ−ａｔｏｍ／Ｊの
範囲が適し。Measures include cutting, polishing, cutting, or drilling the resin using a tool such as a file or drill, or removing a portion of the resin on the surface by heating and melting the resin. In this way, cellulose fibers are immersed in the Rosol at predetermined locations. Here, it is preferable to wash with an organic solvent such as ethanol and water before immersion to remove trace amounts of dirt such as oil and fat attached.The palladium concentration in the palladium hydrosol is 0.01~ A range of 5 mg-atom/J is suitable.
浸漬はＯ〜１００″Ｃ，通常は室温下で１分間以上必要
である。こうして、セルロース繊維の露出した部分にパ
ラジウムコロイドを吸着させた樹脂成形体を次に水洗し
、無電解めうき浴中に浸漬する。めっきの条件は、金属
、還元剤の種類により異なり。Immersion is required at O~100''C, usually at room temperature, for 1 minute or more.The resin molded body with the palladium colloid adsorbed on the exposed parts of the cellulose fibers is then washed with water and placed in an electroless plating bath. Plating conditions vary depending on the metal and type of reducing agent.
各々について公知の条件がとられる。無電解めっき後の
樹脂成形体は水洗され、乾燥した後、配線板などに供さ
れる。Known conditions are taken for each. The resin molded body after electroless plating is washed with water, dried, and then used as a wiring board or the like.
実施例
次に１本発明方法を実施例により、さらに詳細に説明す
る。EXAMPLES Next, the method of the present invention will be explained in more detail by way of examples.
実施ＶＡ１
塩化パラジウム（ＩＩ） （ＰｄＣＡ！ｚ） ０．０５
ｍｏｌを、塩化ナトリウム０．２５ ｍｏｌを含む純
水９４ ｍｌに溶解し。Implementation VA1 Palladium(II) chloride (PdCA!z) 0.05
mol was dissolved in 94 ml of pure water containing 0.25 mol of sodium chloride.
激しくか（はんしながら、これにステアリルトリメチル
アンモニウムクロライド１０ｍｇの水溶液１ｍｌを加え
、直ちに水素化ホウ素ナトリウム０．２ｍｏｌの水溶液
５ ｍｌを滴下して、黒かっ色透明なパラジウムヒドロ
ゾル１００ｍ１を得た。While stirring vigorously, 1 ml of an aqueous solution of 10 mg of stearyltrimethylammonium chloride was added thereto, and immediately 5 ml of an aqueous solution of 0.2 mol of sodium borohydride was added dropwise to obtain 100 ml of a blackish transparent palladium hydrosol.
紙充てんフェノール樹脂板（１ｍｍ厚、２５ｍｍＸ１５
ｍｍ）の表面を削って図に示すように、２胴幅の溝を形
成させ１表面と裏面の溝を、交互に直径２゜５ ｍｍの
穴をあけることにより連結した。こうしたパターンに従
って内部の紙（セルロース繊維）を露出させたフェノー
ル樹脂板をエタノール、水で順次洗浄し２次に先のパラ
ジウムヒドロゾル中に１時ｒｌＲ浸漬した。ひき上げて
、大量の純水中で１゜分間放置して洗浄した後、無電解
ニッケルめっき液（日本カニゼン製、シューマー５６８
０を純水で５倍に希釈したもの）１００ｍｌ中に浸漬す
ると。Paper-filled phenolic resin board (1mm thick, 25mm x 15
As shown in the figure, two grooves each having a width of 2 cylinders were formed by cutting the surface of the cylinder (mm), and the grooves on the first and back surfaces were connected by alternately drilling holes with a diameter of 2.5 mm. A phenolic resin board with the internal paper (cellulose fibers) exposed according to this pattern was washed sequentially with ethanol and water, and then immersed in the palladium hydrosol for 1 hour. After removing it and washing it by leaving it in a large amount of pure water for 1 minute, apply an electroless nickel plating solution (Nippon Kanigen, Schumer 568).
0 diluted 5 times with pure water).
数分の誘導期の後に削った溝、穴の内面、および周辺の
切断面が黒く変化してこの部分から発泡が始まり、室温
下に２０時間放置した後には、所定の部分（溝、穴、切
断面）がニッケルめっきされて銀色に変化した。ひき上
げ、水洗、乾燥したフェノール樹脂板では９図に示した
ＡＢ間で導通を示し、その抵抗値は５３Ωであった。こ
れは、溝および穴の内面がいずれも連続したニッケルに
より被覆されていることを示す。所定の部分以外のフェ
ノール樹脂板表面には、ニッケルめっきが全（起こらず
、従って導通も認められなかった。After an induction period of several minutes, the inner surfaces of the grooves, holes, and surrounding cut surfaces turned black, and foaming started from these areas.After being left at room temperature for 20 hours, the predetermined areas (grooves, holes, The cut surface) was nickel plated and turned silver. The phenol resin board that had been pulled up, washed with water, and dried showed conduction between A and B shown in Figure 9, and its resistance value was 53Ω. This indicates that both the inner surfaces of the groove and hole are coated with continuous nickel. No nickel plating occurred on the surface of the phenol resin plate other than the predetermined portions, and therefore no conductivity was observed.
実施例２
実施例の方法で調製したパラジウムヒドロゾルを、０．
０１９６ステアリルトリメチルアンモニウムクロライド
水溶液で２５倍に希釈し、これに、実施例１と同様のパ
ターンで内部の紙を露出させエタノール、次いで水によ
り洗浄した紙充てんフェノール樹脂板を１０分間浸漬し
た。水洗後、無電解鋼めっき液（Ａ液：ロッセル塩１７
０ｇ／Ａ’−水酸化ナトリウム５０ｇ／１．硫酸鋼３０
ｇ ／ ｌ！。Example 2 A palladium hydrosol prepared by the method of Example was prepared at a concentration of 0.
It was diluted 25 times with an aqueous solution of 0196 stearyltrimethylammonium chloride, and a paper-filled phenol resin board, which had been washed with ethanol and then water with the inner paper exposed in the same pattern as in Example 1, was immersed in this for 10 minutes. After washing with water, electroless steel plating solution (solution A: Rossel salt 17
0g/A'-sodium hydroxide 50g/1. Sulfuric acid steel 30
g/l! .
’ＥＤＴＡ２０ｇ／〕とＢ液：３７９６ホルマリンを容
積比５：１で混合）１ζ４分間浸漬し、直ちに水洗、乾
燥した。この場合も所定のパターンに従つて清めつきが
起こり、ＡＢ間の抵抗値は２８０ｇであった。EDTA 20g/] and B solution: 3796 formalin were mixed at a volume ratio of 5:1)1ζ for 4 minutes, and immediately washed with water and dried. In this case as well, cleaning occurred according to a predetermined pattern, and the resistance value between AB was 280 g.
発明の効果 実施例に示されたように９本発明方法により。Effect of the invention 9 by the method of the present invention as shown in Examples.
レジストやエツチング操作を用いることなく簡単な操作
により、樹脂表面上にパターン金属めっきおよびスルー
ホール金属めっきを施すことができ。Pattern metal plating and through-hole metal plating can be applied to resin surfaces by simple operations without using resist or etching operations.
いずれについても良好な導通状態が得られる。A good electrical conduction state can be obtained in both cases.
添付した図面は、実施例１および実施例２において用い
た紙充てんフェノール樹脂板について示したもので、斜
線を施した部分が内部の紙（セルロース繊維）の露出し
た部分である。
切断面The attached drawing shows the paper-filled phenolic resin board used in Examples 1 and 2, and the shaded area is the exposed part of the internal paper (cellulose fiber). Cut surface
Claims (1)
に所定のパターンに従ってセルロース繊維を露出させた
後、これをパラジウムヒドロゾルに浸漬し、次いで無電
解金属めっきすることを特徴とするセルロース繊維を充
てんした合成樹脂成形体表面上の金属パターン形成方法
。1. Filling with cellulose fibers, which is characterized by exposing cellulose fibers on the surface of a synthetic resin molded body filled with cellulose fibers according to a predetermined pattern, immersing them in palladium hydrosol, and then electroless metal plating. A method for forming a metal pattern on the surface of a synthetic resin molded product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14622885A JPH0243826B2 (en) | 1985-07-03 | 1985-07-03 | GOSEIJUSHIHYOMENJONOKINZOKUPATAANKEISEIHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14622885A JPH0243826B2 (en) | 1985-07-03 | 1985-07-03 | GOSEIJUSHIHYOMENJONOKINZOKUPATAANKEISEIHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS627872A true JPS627872A (en) | 1987-01-14 |
| JPH0243826B2 JPH0243826B2 (en) | 1990-10-01 |
Family
ID=15403004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14622885A Expired - Lifetime JPH0243826B2 (en) | 1985-07-03 | 1985-07-03 | GOSEIJUSHIHYOMENJONOKINZOKUPATAANKEISEIHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243826B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159410A (en) * | 1986-11-07 | 1988-07-02 | モンサント カンパニー | Selective catalytic activation of polymer film |
| US5070606A (en) * | 1988-07-25 | 1991-12-10 | Minnesota Mining And Manufacturing Company | Method for producing a sheet member containing at least one enclosed channel |
| USRE34651E (en) * | 1988-02-19 | 1994-06-28 | Minnesota Mining And Manufacturing Company | Sheet-member containing a plurality of elongated enclosed electrodeposited channels and method |
-
1985
- 1985-07-03 JP JP14622885A patent/JPH0243826B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159410A (en) * | 1986-11-07 | 1988-07-02 | モンサント カンパニー | Selective catalytic activation of polymer film |
| USRE34651E (en) * | 1988-02-19 | 1994-06-28 | Minnesota Mining And Manufacturing Company | Sheet-member containing a plurality of elongated enclosed electrodeposited channels and method |
| US5070606A (en) * | 1988-07-25 | 1991-12-10 | Minnesota Mining And Manufacturing Company | Method for producing a sheet member containing at least one enclosed channel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0243826B2 (en) | 1990-10-01 |
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