JPS6281296A - hot press - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a hot press suitable for bonding multilayer printed wiring boards of various electronic devices such as computers.

[Background of the invention]

A conventional hot press is, for example, disclosed in Japanese Patent Application Laid-Open No. 60-12713.
As described in Publication No. 5, as a measure to improve the temperature distribution in all steps of the bonding process, in order to equalize the flow rate in each passage in the hot plate, the branching loss of the distribution pipe and the passage in the hot plate are In order to equalize the loss and reduce the temperature difference between the hot plate inlet and outlet of the heating and cooling medium, the distance from the distribution pipe to the collecting pipe is as short as possible, and the passage arrangement is such that the temperature difference is canceled out. It was a hot plate with a However, when looking at the microscopic temperature distribution, there is a delay inside the hot plate (center) compared to the outer periphery of the hot plate when the temperature rises or falls. As a result, a similar delay occurs in the softening-melting-hardening cycle of the prepreg, and when the prepreg is melting inside the hot plate, it hardens from the outer periphery, making it impossible to completely flush out voids from the inside to the outer periphery, and the heat There is a risk that air bubbles may exist inside the board.6 [Object of the Invention] An object of the present invention is to provide a hot press capable of molding an adhered object without remaining air bubbles.

[Summary of the invention]

Usually, to mold adherends without residual air bubbles.

Uniform temperature distribution, including temperature rises and falls, was thought to be optimal. However, when the bonding pressure is lowered due to higher precision, when the temperature rises and falls, the temperature distribution inside the hot plate must be slightly ahead compared to the outer periphery of the hot plate to obtain a bonded object without residual air bubbles. There was found.

In order to obtain a temperature distribution that is slightly ahead of the inside of the hot plate, the present invention provides a hot plate with passages that allow heating and cooling media to flow from the inside of the hot plate to the outside of the hot plate. Features.

[Embodiments of the invention]

Embodiments of the hot press of the present invention will be described below with reference to FIGS. 1 to 3.

The hot press of the present invention mainly consists of a press main body 1. Hydraulic system 2. It is composed of a heating/cooling device 3, a control bag Ft4, etc.

In the press main body 1, a lower bolster 8 is placed on a ram 7 of a main ram cylinder 6 fixed to a lower press frame 5, and a heating plate 10 is placed on the lower bolster 8 via a non-insulated plate 9. is fixed, and an intermediate heating plate 11 is supported by a counter cylinder 12 at the upper part provided with an opening for carrying in and out of the adherend, and at the top, an upper heating plate 13 is thermally insulated by an upper heat insulating plate 14. It is fixed to an upper bolster 16 connected to the lower frame 5 by a support 15.

The hot plate 10.11.13 has upper and lower plates 17°18 water inlet 19. A side plate 21 with a drain port 20 is formed by a band plate 22 forming a steam cooling water passage.

In this hot press, a bonded object 23 such as a multilayer printed wiring board is inserted between a lower hot plate 10 and an intermediate hot plate 11, and between an intermediate hot plate 11 and an upper hot plate 13, and each hot plate 10, 11, 13 is controlled. Based on the command from the device 4, the heating/cooling control device 3 applies molding heat energy, and at the same time, the main ram cylinder 6
Hydraulic pressure is supplied from the hydraulic system 2 to the counter cylinder 12, and the object to be adhered 23 is pressurized and adhered.

In Figures 2 and 3, steam as a heat medium and cooling water in the cooling section enter the center of the hot plate through a water supply port 19, exchange heat in a spiral passage made up of strip plates 22, and are heated through a drain port 20. Return to cooling device 3.

According to this embodiment, since the steam or cooling water flows from the center of the hot plate toward the outer periphery, the temperature of the center of the hot plate increases quickly during the temperature rising process, and the center of the hot plate cools quickly during the cooling process. As a result, the temperature distribution during the heating and cooling process is such that the central part of the 4th plate takes the lead.

By subjecting the hot plate to the temperature distribution of heating or cooling described above, it is possible to mold an article to be adhered without remaining bubbles.

Figures 4 and 5 show another embodiment of the hot press of the present invention, in which the passage shape is divided into two parts at the center of the hot plate, upper and lower in the figure, so that the shape of the hot plate is suitable for large-sized products. .

By dividing the steam and cooling water passages into two in this way, the passage distance is shortened even in the case of large products, so that the temperature distribution described above can be obtained.

〔Effect of the invention〕

According to the hot press of the present invention, the temperature distribution during heating and cooling of the object to be adhered is such that the inside of the hot plate precedes the outside, so it is possible to mold the object without residual air bubbles. Become.

Therefore, when the adhered object is used, for example, in the work of bonding high-density multilayer printed wiring boards, great effects are achieved.

[Brief explanation of drawings]

Fig. 1 is a front view showing the structure of the hot press of the present invention and a control system diagram for hydraulic pressure and heating/cooling, and Fig. 2 and 3 show the steam and cooling water passages formed in the hot plate in the hot press of the present invention. 2 is a plan sectional view, FIG. 3 is a side sectional view, and FIGS. 4 and 5 show other embodiments of the steam and cooling water passages in the hot press of the present invention. 4 shows a plan sectional view, and FIG. 5 shows a side sectional view. DESCRIPTION OF SYMBOLS 1... Press body part, 2... Hydraulic system, 3... Heating cooling device, 4... Control device, 5... Lower frame,
6...Cylinder, 7...Ram, 8...Lower bolster-19...Lower new hot plate, 10...Lower hot plate, 11...
・Intermediate hot plate, 13... Upper hot plate, 14... Upper heat insulating plate,
16...Upper bolster-119...Water inlet, 20...
・Drain port, 21... Side plate, 22... Band plate, 23...
・Subject to be adhered. 1 Figure Z Z Z Figure f3 Figure 4 Figure 5 Exit

Claims (1)

[Claims] 1. A hot press comprising a ram cylinder, upper and lower bolsters, a hot plate, etc., in which a heating medium and a cooling medium flow from the inside of the hot plate to the outside of the hot plate. A hot press characterized in that a medium passage and a cooling medium passage are provided. 2. Claim 1, wherein the heating medium passage and the cooling medium passage are formed in a spiral shape.
Hot press as described in section. 3. The hot press according to claim 1, wherein the heating medium passage and the cooling medium passage are divided into two.