JPS6281715A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To improve the expanding condition and fitting condition of a solvent over a semiconductor substrate by forming an area of the edge plane of a nozzle as a circular area which is nearly the same as of a semiconductor substrate to be processed and providing plural solvent ejection holes on the edge plane. CONSTITUTION:The titled equipment is composed of a base 3 for vacuum- attracting a semiconductor it by a pulse motor 2, a lower lid 5 having an outlet 4 and an upper lid 8 having a nozzle 8 for dropping a chemical agent 6. An area of the edge plane 7a of the nozzle 7 for dripping a chemical agent 6 is a circular area which is nearly the same as of the semiconductor substrate 1. The edge plane 7a has plural solvent ejection holes 9, thereby dripping and expanding the chemical agent 6 over the semiconductor substrate 1 uniformly. Furthermore, after dripping the chemical agent 6, the base 3 carrying the semiconductor substrate 1 is rotated 10 through the pulse motor 2 by utilizing the surface tension of the chemical agent 6 without moving the position of the nozzle 7 and with the chemical agent 6 kept on the semiconductor substrate 1. As a result, the fall of the chemical agent 6 from the semiconductor substrate 1 is reduced and a pattern forming accuracy is improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to semiconductor manufacturing equipment, and in particular, to forming desired patterns on the surface of a semiconductor substrate by dropping or spraying various chemicals onto the surface of the semiconductor substrate. The present invention relates to semiconductor manufacturing equipment used for manufacturing.

[Conventional technology]

Conventionally, when forming a desired photosensitive resin pattern on the surface of a semiconductor substrate, a thin layer of photosensitive resin is applied to the surface of the semiconductor substrate (coating process), and then printing is performed using a photomask or pattern. This printing separates the photosensitive resin film in the areas separated by transfer (development process) to obtain the desired photosensitive resin/mother turn, but in this development process, the semiconductor substrate The nozzle 7 for dropping or spraying various solvents onto the surface has a structure that drops or sprays the chemical 6 onto the surface of the semiconductor substrate 1 through a pipe from directly above or from the side of the device, as shown in FIGS. There is. 2 is? 3 is a base, 4 is a drain port, 5 is a lower lid, and 8 is an upper lid.

[Problem that the invention seeks to solve]

With the nozzle shape of the equipment used in the conventional development processing process described above, the amount of solvent applied to the surface of the semiconductor substrate is not uniform, and due to fluctuations in the spray pressure and dropping pressure, the absorption of the solvent on the surface of the semiconductor substrate is small. As the size of the substrate increases, the solvent does not penetrate sufficiently to the periphery of the surface of the semiconductor substrate, causing the photosensitive resin film to remain partially, resulting in a decrease in yield in semiconductor manufacturing equipment. Furthermore, it is expected that the size of semiconductor substrates will further increase in the future, and this problem will become more serious. Although this problem can be reduced by increasing the amount of solvent dripped or spouted, this is not an appropriate measure from a cost standpoint.

SUMMARY OF THE INVENTION An object of the present invention is to provide a development processing apparatus that improves the spread and coverage of a solvent on the surface of a semiconductor substrate.

[Means for solving problems]

The present invention relates to semiconductor manufacturing equipment that includes a substrate that vacuum-chucks a semiconductor substrate and rotates it, and a nozzle that drops or sprays various solvents onto the surface of the semiconductor substrate. This semiconductor manufacturing apparatus is characterized in that the circular areas are approximately the same and that a plurality of solvent suction holes are provided on the end face.

〔Example〕

Next;・ζ An embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the apparatus of the present invention includes a base body 3 that vacuum-chucks a semiconductor substrate 1 sent from a transport section 7) and rotates it by a pulse motor 2, and a lower lid 5 having an ejection port 4.
and an upper lid 8 having a nozzle 7 for dropping the medicine 6, as shown in FIG.
The end face 7a has a circular area approximately the same size as the semiconductor substrate 1, and a plurality of solvent blowing holes 9 are provided in the end face 7a.

As described above, since the nozzle 7 that drops the chemical 6 has the same size as the semiconductor substrate 1 to be processed and has countless solvent suction holes 9, the chemical 6 is evenly dropped and spread over the semiconductor substrate 1. be able to. Furthermore, as shown in FIG.
After dropping the nozzle 7, the chemical 60 is placed on the semiconductor substrate 1 without moving, and the surface tension of the chemical 60 is utilized.
By rotating the base 3 on which the semiconductor substrate 1 is placed through the pulse motor 2, the drop of the chemical 6 placed on the semiconductor substrate 1 is reduced, and the accuracy of turn formation is improved. It can also contribute to improving the yield of semiconductor devices.

In the above-mentioned embodiments, the development process in the semiconductor device manufacturing process was used as an example. It is no wonder that it can also be used for equipment as well.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to improve the spread state of the solvent on the semiconductor substrate and the state in which the solvent is placed on the semiconductor substrate.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a semiconductor manufacturing apparatus showing one embodiment of the present invention, FIG. 2 is a perspective view showing a nozzle in the present invention, and FIG.
The figure is a diagram for explaining the operation of the present invention, and FIGS. 4 and 5 are cross-sectional views showing a conventional device. 1...Semiconductor substrate, 2...! Ruth motor, 3...
Base, 4... Drain port, 5... Lower lid, 6... Drug, 7... Nozzle, 7a... End surface, 8... Upper lid, 9
...Bath salt outlet. Figure 5

Claims (1)

[Claims] (1) In a semiconductor manufacturing device that has a base body that vacuum-chucks a semiconductor substrate and rotates it, and a nozzle that drops or sprays various chemicals onto the surface of the semiconductor substrate, the semiconductor substrate that processes the area of the end face of the nozzle. What is claimed is: 1. A semiconductor manufacturing device characterized in that the end face is provided with a plurality of solvent suction holes.