JPH02295108A - Resist coating device - Google Patents

Abstract

PURPOSE:To form a resist film having a uniform thickness on the surface of a large size semiconductor substrate by a method wherein resist is dropped onto the semiconductor substrate surface from nozzles whose number is increased so as to form coaxial circles of the resist. CONSTITUTION:Five nozzles 2 are provided above a wafer chuck 1. An object to be coated, for instance a semiconductor substrate 3 is placed on the wafer chuck 1 and attracted by vacuum suction holes 1a. If resist 4 is dropped onto the surface of the semiconductor substrate 3 from the five nozzles 2 while the wafer chuck 1 is rotated with a low speed, the resist is so dropped as to form coaxial circles of the resist 4 whose center is the center of rotation of the semiconductor substrate 3 by the respective nozzles 2. After that, if the wafer chuck 1 is rotated with a high speed, the resist 4 dropped onto the surface of the semiconductor substrate 3 is spread over the surface of the semiconductor substrate 3 instantaneously so as to form a continuous resist film and the resist film having a uniform thickness can be formed on the surface of the semiconductor substrate 3.

Description

[Detailed Description of the Invention] [Summary] Regarding the nozzles of the resist coating device for dropping the coating material onto the surface of the object to be coated, the present invention provides a resist coating device that is equipped with a plurality of nozzles that can be simply and easily installed. With the aim of In the resist coating apparatus, the resist coating apparatus forms a thin film of the resist on the surface of the object to be coated by rotating the wafer chuck at a high speed.

[Industrial application field]

The present invention relates to a resist coating device, and particularly to a nozzle for dropping a coating material onto the surface of an object to be coated.

In recent years, with the increasing integration and miniaturization of semiconductor devices, it has become necessary to stabilize the line width of patterns formed on the surface of semiconductor substrates, and for this purpose it is necessary to suppress variations in the thickness of the resist film formed. It has become. Under the above circumstances, there is a need for a resist coating apparatus that can form a resist film of uniform thickness on the surface of a semiconductor substrate.

[Conventional technology]

A conventional resist coating apparatus will be explained with reference to FIG.

In a conventional resist coating apparatus, as shown in FIG.
The wafer chuck 1 is mounted on the surface of the wafer chuck 1 and fixed by suction through a vacuum suction port 1a provided in the wafer chuck 1.

Next, a resist 4 is dropped onto the center of the semiconductor substrate 3 from a nozzle 2 provided at the top of the wafer chuck 1, and the wafer chuck 1 is rotated at high speed to form a thin film of the resist 4 on the surface of the semiconductor substrate 3. are doing.

[Problem to be solved by the invention]

In the conventional resist coating apparatus described above, the semiconductor substrate is vacuum-adsorbed and fixed to the wafer chuck.
The resist is dropped onto the center of the semiconductor substrate using a single nozzle, and the wafer chuck is rotated at high speed to form a thin film of resist on the surface of the semiconductor substrate. In the case of the board,
Because the distance between the droplet position of the resist and the periphery of the semiconductor substrate is large, the resist solvent evaporates during the process of spreading the resist over the surface of the semiconductor substrate, resulting in uneven resist film thickness. There was a problem.

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, it is an object of the present invention to provide a resist coating device equipped with a plurality of nozzles, which can be simply and easily installed.

[Means to solve the problem]

The resist coating device of the present invention mounts an object to be coated on a wafer chuck, suctions and fixes the object through a vacuum suction port provided on the wafer chuck, and applies resist through a nozzle provided at the top of the wafer chuck. A resist coating apparatus for forming a thin film of resist on the surface of an object by dropping a drop onto the surface of an object and rotating the wafer chuck at high speed is configured to include a plurality of nozzles on the upper part of the wafer chuck.

[Effect]

That is, in the present invention, a plurality of nozzles are provided on the upper part of the wafer chuck, the object to be coated mounted on the wafer chuck is fixed by vacuum suction, and while the wafer chuck is rotated at low speed, each nozzle is applied to the surface of the object to be coated. It is possible to drop resist from the nozzle in a concentric circle around the rotation center of the semiconductor substrate, and then rotate the wafer chuck at high speed to form a thin film of resist on the surface of the semiconductor substrate. becomes.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. 1 regarding a resist coating apparatus equipped with five nozzles.

In this embodiment, as shown in FIG. 1 (al), five nozzles 2 are provided on the upper part of the wafer chuck 1.

An object to be coated, such as a semiconductor substrate 3, mounted on the wafer chuck 1 is suctioned and fixed by the vacuum suction port 1a.

When the resist is dropped onto the surface of the semiconductor substrate 3 by the five nozzles 2 while rotating the wafer chuck 1 at a low speed, for example, 1 to 2 rpm, each nozzle 2 drops the resist onto the surface of the semiconductor substrate 3 as shown in FIG. 1(b). A resist 4 is dropped on a concentric circle centered on the rotation center of the resist 4.

After that, the wafer chuck 1 is rotated at high speed, for example, 5. O
When rotated with OOrpa+, the resist 4 dropped on the surface of the semiconductor substrate 3 instantly spreads in a continuous state over the surface of the semiconductor substrate 3, and a resist film with a film thickness of io, ooo 8 is formed on the surface of the semiconductor substrate 3. be done.

While rotating the wafer chuck 1 at a low speed in this manner, the resist 4 is dropped concentrically from the plurality of nozzles 2 onto the surface of the semiconductor substrate 3, and then the wafer chuck 1 is rotated at a high speed to coat the resist 4. Since a thin film is formed, it does not take time to spread the resist 4 over the surface of the semiconductor substrate 3, so the resist 4 is applied to the surface of the semiconductor substrate 3 before the solvent contained in the resist 4 evaporates. becomes possible.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the number of nozzles is increased to drop concentric resist on the surface of a semiconductor substrate, so that a resist film with a uniform thickness can be formed on the surface of an enlarged semiconductor substrate. It is now possible to form a pattern for a semiconductor device using this resist film, which has the advantage of being able to form a pattern with a uniform line width, and is a resist coating that can be expected to significantly improve reliability. Equipment can be provided.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional resist coating apparatus. In the figure, 1 is a wafer chunk, 1a is a vacuum suction port, 2 is a nozzle, 3 is a semiconductor substrate, and 4 is a resist. +at Side cross-sectional view A diagram showing a conventional resist coating device FIG. 2 fbl A diagram showing a large-scale embodiment according to the present invention as viewed from the A-A arrow FIG.

Claims (1)

[Claims] A vacuum suction port (1a) provided on the wafer chuck (1) with the object to be coated (3) mounted on the wafer chuck (1).
The object to be coated (3) is suctioned and fixed, and the resist (
4) onto the surface of the object to be coated (3), and rotates the wafer chuck (1) at high speed to form a thin film of the resist (4) on the surface of the object to be coated (3). A resist coating apparatus characterized in that a plurality of the nozzles (2) are provided on an upper part of a wafer chuck (1).