JPS6281794A - Parts supply method using tape-shaped parts assembly - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is mainly used in an electronic component mounting machine that mounts electronic components such as chip resistors and chip multilayer capacitors onto substrates constituting electronic circuits. The present invention relates to a component supply method using a tape-shaped component assembly.

Conventional technology Regarding electronic component mounting machines, the prior art
A component supply method using a tape-shaped component assembly as shown in Japanese Patent No. 98 has been adopted.

As shown in FIG. 11, the tape-shaped component assembly P in this method is formed by forming a large number of component housing parts in one row with predetermined grooves in the tape body a, into which the electronic components C are inserted. At the same time, a sealing tape d is attached to the surface of the tape body a.
The structure is such that the electronic component C is held.

In the electronic component mounting machine, the tape-shaped component assembly P is intermittently fed in one direction. g is a tape-shaped parts assembly P
h is a tape peeling device that peels off the seal tape d and winds it up.

The electronic component C loaded into the component storage recess is adsorbed by a vacuum chuck (pickup means) i and taken out from the tape-shaped component assembly P.
It is mounted at a predetermined position on the board j by.

Problems to be Solved by the Invention As mentioned above, the conventional parts supply method has a structure in which the seal tape d stuck to the surface of the tape body a is peeled off before the pickup position. There was a problem in that the winding of the sealing tape d could become unstable, and the reliability of the pick-up operation of the electronic component C deteriorated. Furthermore, when replacing the tape-like parts assembly P, it is necessary to insert the sealing tape d into a tape peeling device, which increases the number of work steps. Furthermore, in a normal electronic component mounting machine, 5
It is configured such that 0 to 100 series of tape-shaped component aggregates P are arranged in parallel, and an electronic component C is selected from among these to be picked up, but in the conventional component supply method,
Means for solving the problem that tape peeling devices are required for the number of tape-like component assemblies P The present invention has a first invention and a second invention.

The first invention stores components in each of a large number of component storage recesses formed in the tape body, and also stores components on the top surface of the tape body.
While moving the tape-shaped parts assembly formed by disposing a sealing tape for holding the parts in the parts storage recess toward the parts pickup means, the parts pickup means sequentially picks up the parts in the parts storage recess. In the pick-up method, in the first step, an incision is made at a suitable location above the component storage recess of the seal tape, in the second step, the incision is enlarged to make it possible to pick up the component from the component storage recess, and in the third step, the component is removed. The present invention is characterized in that the parts are picked up by a pickup means.

The second invention stores components in each of a large number of component storage recesses formed in the tape body, and also stores components on the top surface of the tape body.
While moving a tape-shaped component assembly formed by disposing a sealing tape for holding the components in the component storage recess toward the component pickup means, the component pickup means sequentially picks up the components in the component storage recess. In the method, a tape-shaped component assembly is used in which an incision is formed in advance at a suitable position above the four component storage parts of the sealing tape, and in the first step, the incision is enlarged so that the component can be picked up from the four component storage parts. The second step is characterized in that the component is picked up by a component pickup means.

According to the first aspect of the invention, in the first step, the sealing tape is incised at a proper position above the component storage recess, and in the second step, the incision is enlarged so that the component can be picked up from the component storage recess. The process of peeling and winding the seal tape using a tape peeling device, which was necessary in the conventional example, is no longer necessary, and the parts can be pink-amplified by the parts pickup means in the third step.

According to the second aspect of the invention, a tape-shaped component assembly is used in which an incision is formed in advance at a proper position above the component storage recess of the seal tape, and in the first step, the incision is enlarged and the components are inserted into the component storage recess. Since it is in a state where it can be picked up more easily, the steps of peeling off the seal tape using a tape peeling device and winding it up, which were necessary in the conventional example, are no longer necessary, and the parts can be picked up by the parts pickup means in the second step. The second invention is characterized in that the incision step in the first invention is also unnecessary.

Embodiment FIGS. 1 to 6 show an embodiment of the first invention.

The tape-shaped component assembly 1 used in this embodiment stores electronic components (hereinafter referred to as components) 4 in each of a large number of component storage recesses 3 formed in a line with a predetermined pinch in a tape body 2. , a sealing tape 5 for holding the component 4 in the component storage recess 3 is attached to one upper surface of the tape body 2. The tape body 2 is composed of a thick basic tape 2a provided with through holes that form the four component storage parts 3, and a holding tape 2b that is adhered to the back surface of the basic tape 2a and forms the bottom surface of the component storage recess 3. It is also possible to use one in which the basic tape 2a and the holding tape 2b are integrally formed.

Further, as shown in FIG. 2, in an electronic component mounting machine in which feed holes 6 are formed at a predetermined pitch on the side edge of the tape body 2, the tape-shaped component assembly 1 is first Work is made to be absent one pitch at a time in the direction of the arrow in the figure. Then, in the first step A, the sealing tape 5 is incised at a proper position above the component storage recess by the incision means 8. Next, in a second step B, the incision 10 is enlarged by the incision enlarging means 9, so that the component 4 can be picked up from the component storage recess 3. Thereafter, in the third step C, the component 4 is picked up by the component pickup means 11 and mounted on the printed circuit board 12 at a predetermined position.The cutting means 8 used in the first step A is shown in FIGS.
As shown in the figure, a brace 8 equipped with a U-shaped cutter 8a
b, and moves up and down once between the intermittent ribs of one pitch in conjunction with the intermittent work of the tape-shaped parts assembly l. And the second
As shown in the drawings and FIG. 3, a U-shaped incision line (incision part) 10 is formed in the upper peripheral region of the four component storage parts 3 of the sealing tape 5.

The incision enlargement means 9 used in the second step B is shown in FIG.
As shown in FIGS. 5 and 6, the vacuum suction hole 9a
The tape peeling tube 9b is equipped with a tape peeling tube 9b, a pair of presser rollers 9C rotatably arranged on the left and right sides of the tape peeling tube 9b, and a lifting means 9d for moving the tape peeling tube 9b up and down in conjunction with the intermittence of the tape-shaped parts assembly 1. ing. Also, the tape peeling cylinder 9b
is a vacuum suction device (not shown) via the hose 9e.

), but a passage switching valve (not shown) is disposed in the middle of the connection.

This passage switching valve has the function of introducing vacuum pressure into the tape peeling cylinder 9b to make it into a suction state at one switching position, and introducing atmospheric air into the tape peeling cylinder 9b at the other switching position to put it into a non-suction state. operate

Thus, as shown in FIG. 6, the tape peeling tube 9b descends and enters a suction state against the sealing tape 5 of the tape-shaped component assembly 1 sent to the incision enlarging means 9, and the incision 10 is sucked. The surrounded part (peelable piece) 13 is sucked, the peelable piece 13 is folded as the tape-shaped component assembly 1 moves, the incision 10 is enlarged, and the component 4 can be picked up from the component storage recess 3. state. Thereafter, the tape peeling tube 9b goes into a non-suction state and rises. During the work of folding the peelable piece 13, the pair of presser rollers 9c move around and press the sides of the incision line of the seal tape 5, thereby smoothing out the work.

In this embodiment, the incision enlarging means 9 is configured using a vacuum suction force, but it is preferable to use a friction welding force (for example, a rubber fixing tube may be used in place of the tape peeling tube 9b). .

), etc.

The component pickup means 11 used in the third step C is
It is composed of a vacuum chuck having a suction nozzle 11a that utilizes vacuum pressure. The component 4 sucked by the suction nozzle lla is mounted on a predetermined position on the printed circuit board 12.Another embodiment of the first invention is shown in FIGS. 7 and 8.

In this embodiment, the sealing tape 5 of the tape-shaped component assembly 1 is formed of a heat-sensitive shrink film, and is oriented so that the direction of shrinkage is in the longitudinal direction X.

In the first step A, a cutout (cutout) 10 as shown in FIG. The incision is enlarged around the notch 10 (
This is due to heat-sensitive shrinkage of the seal tape 5. ), the component 4 becomes ready to be picked up from the component storage recess 3.

Although this embodiment has the above-mentioned features, the other configurations are basically the same as the embodiments shown in FIGS. 1 to 6, and therefore the description thereof will be omitted. As a heat-sensitive shrink film, a polyester film having a glass transition temperature in the range of 50°C to 150°C and oriented in the longitudinal direction X (a specific example is rPETJ-trade name manufactured by Toshi Co., Ltd.) can be adopted.

Similar to this example, a photosensitive shrink film (for example, a polyethyl acrylate film having a spiropyran structure on the side) and a light irradiation device, or a film that shrinks with a specific solution. films (such as collagen films) and specific melts? Fl? fl
It is also possible to employ a combination of a device (a device that dispenses a small amount of a oxalizing solution to a collagen film is suitable).

An embodiment of the second invention is shown in FIGS. 9 and 10.

In this embodiment, the incision means 8 in the embodiment shown in FIGS. 1 to 6 is omitted, and instead, an incision 10a is formed in advance at a suitable position above the component storage recess of the sealing tape 5a. It is characterized by using aggregate 1a.

In this embodiment, as shown in FIG.
An incision 10a consisting of a perforation line 10c and a perforation line 10c is formed in advance on the sealing tape 5a, and in the first step, the incision enlargement means 9 similar to the embodiment shown in FIGS. 4 is expanded to a state where it can be picked up from the component storage recess 3. In the second step E, the component 4 is picked up by a component pickup means 11 similar to the embodiment shown in FIGS. 1 to 6.

In the second invention, similarly to the embodiments shown in FIGS. 7 and 8, the seal tape 5 is formed of a heat-sensitive shrink film, a photo-sensitive shrink film, etc., and the cutout 10a is previously formed therein, and the first It is also possible to use an infrared ray irradiation device, a light ray irradiation device, or the like as the incision enlarging means 9 during the process.

The present invention (first invention and second invention) can be configured in various ways other than those shown in the above embodiments. For example, as the incision means 8 used in the first step A of the first invention, a needle incision device, a thermal melting device, etc. can be used, and the incision part 10
The shape of is also not limited to that shown in the above embodiment. Also the first
As the incision enlargement means 9 used in the second step B of the invention or the first step of the second invention, various devices other than those shown in the above embodiments can be used, and the incision enlargement direction can also be the longitudinal direction. For example, it is also possible to set it in a direction perpendicular to the ward direction.

Effects of the Invention Both the first invention and the second invention can eliminate the need for winding the seal tape using a tape peeling device, which was conventionally necessary, and solve the problem of reduced reliability due to poor winding. In addition, there is no need to set the sealing tape in the tape peeling device when replacing the tape-shaped parts assembly, so there is an effect that the number of work steps can be reduced and work efficiency can be increased. By using a tape-like parts assembly in which incisions are formed in advance, the present invention also has the effect that the incision step required in the first invention can be omitted.

It should be noted that the incision means and incision enlargement means in the first invention and the incision enlargement means in the second invention do not need to be arranged in a one-to-one relationship with respect to the tape-shaped component assembly;
It is also possible to use one means in common for 0 to 100 tape-shaped component assemblies, and in this case, the apparatus can be significantly simplified.

[Brief explanation of drawings]

FIG. 1 is a vertical sectional side view showing an example of an apparatus for carrying out the method of the first invention, FIG. 2 is a perspective view of the main parts thereof, and FIG. 3 is a plan view of a tape-shaped parts assembly used therein. FIG. 4 is a perspective view showing one example of an incision means, and FIG. 5 is an example of an incision enlargement means.
A perspective view showing an example, FIG. 6 is an enlarged longitudinal side view showing the effect,
FIG. 7 is a longitudinal sectional side view showing another example of the apparatus for carrying out the method of the first invention, FIG. 8 is a perspective view of the main parts thereof, and FIG.
A longitudinal side view showing 41 examples of an apparatus for carrying out the method of the invention,
FIG. 10 is a perspective view of the main parts thereof, and FIG. 11 is a longitudinal sectional side view showing an apparatus for carrying out the conventional method. 1.1a-・-・-・-1--------------
−−−−1−−−−・Tape-shaped parts assembly 2−・−・−
・−・−・・−・・−・−・−・−・・−・・−
・・・Tape body 3-・・−・−・−・−・−・−・−
・---m-・・・One component storage recess 4・・−・−−
111----1-------------1---Parts 5.5a----------
・・・・・−・・−・−・−・Seal tape 8−−−−
−−・−・−・・−・−・−・−−−−１・−−−−
---All opening means 9---------------------- Incision enlargement means 10. 10a--・--・-1---------・
−・−Incision 11− ・−・−・−−−−1・
−・−・・・・−・−・・−・・・・Parts pickup means. Agent: Patent Attorney Toshio Nakao 1 person: 10...M
h Figure 4

Claims (2)

[Claims] (1) A tape shape in which components are stored in each of a number of component storage recesses formed in the tape body, and a sealing tape is provided on the top surface of the tape body to hold the components in the component storage recesses. In the method of sequentially picking up the components in the component storage recess by the component pickup means while moving the component assembly toward the component pickup means, in the first step, the sealing tape is incised at an appropriate position above the component storage recess; A method for supplying components using a tape-shaped component assembly, characterized in that in a second step, the incision is enlarged so that the component can be picked up from the component storage recess, and in a third step, the component is picked up by a component pickup means. (2) A tape shape in which components are stored in each of a number of component storage recesses formed in the tape body, and a sealing tape is provided on the top surface of the tape body to hold the components in the component storage recesses. In the method of sequentially picking up the components in the component storage recess by the component pickup means while moving the component assembly toward the component pickup means, an incision is previously formed at an appropriate position in the upper part of the component storage recess of the sealing tape. A tape-shaped component assembly using a tape-shaped component assembly, in which the incision is enlarged in a first step so that the component can be picked up from the component storage recess, and the component is picked up by a component pickup means in a second step. Parts supply method using parts assembly.