JPS6281800A - Mounting state inspecting system for electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of Pressure Work 1-] The present invention relates to a method for inspecting the installation state of electronic components.
In particular, chip parts installed on the printed circuit board 1-,
Conductor chip parts, IC, LSI package, resistor,
The present invention relates to a method for inspecting the mounting state of electronic components that can efficiently inspect the mounting state of components such as capacitors on printed circuit boards.

[Prior Art] A system for inspecting the mounting condition of an electronic component, such as the mounting position, cross-section, mounting angle, etc., on a printed circuit board 1 of an electronic component is a system that irradiates the entire component with a predetermined light to inspect the component. There are those that collect an entire image using an image sensor or the like and perform image analysis on this image for inspection, and those that use ultra-A waves or the like for inspection.

[Problems to be solved] In the case of conventional methods that collect the entire image of the part using an image sensor) and analyze the image, the data processing [
If there are many I[ and M(products), a large amount of data processing is involved, which slows down the processing and makes it impossible to perform inspections in 1 minute.

In addition, even when sensing with ultrasonic waves, etc., depending on the type of part, the resolution may be low, making it impossible to perform accurate inspection, increasing the number of misrecognized parts, and requiring special processing. do.

[Purpose of the Invention] This invention has been made in view of the problems of the prior art. The first objective is to provide a method for inspecting the installation state of electronic components that can detect electronic components and their mounting positions, as well as their misalignment.

[Means for Solving the Problems] The means in the method for inspecting the mounting state of electronic components of the present invention to achieve the above 1-1 objective are as follows:
Electricity 1≦ in a given direction for electronic components attached to
Electrons by irradiating a light beam that creates a shadow on the item? A<Characteristic outlines of shadows and reflective parts of the product are taken at a plurality of locations, and the mounting state of electronic components on the board 1 is determined from the data of the plurality of taken outlines.

[Operation] With this configuration, it is possible to recognize electronic components using a plurality of outline data that characterizes the electronic components, and feature point data processing is possible, even when the number of electronic components to be inspected increases. It is also possible to calculate the installation position of electrical components on the board, the deviation of their angle, and the position of the center point from the positional relationship of multiple characteristic external locations, making it possible to inspect the installation state with high precision. can.

As a result, it is possible to reduce the amount of data processing involved in inspecting the installation status of products using electronic iW, and even with a small amount of data, it can be processed efficiently, and a wide variety of parts can be inspected in a single time with i+J capability. be.

[Example Code] An example of the present invention will be described in detail below with reference to the drawings.

FIG. 1(a) is a detailed diagram of a component detection optical system for chip components in an embodiment in which the method for inspecting the mounting state of electronic components of the present invention is applied to an inspection device for chip/roofing products;
FIG. 1(b) is a top view of the structure of the tip of the objective optical system as seen from the top side, FIG. 2 is a schematic diagram of the chip component inspection apparatus, and FIG. 3(a).

(b) is a cross-sectional view of the I-I portion in FIG. 1(b) and a corresponding side view from the side, and FIG. 4 is a functional block diagram of the image processing device portion. figure,
5(a)-(C) to FIG. 8(a)-(C) are explanatory diagrams of the relationship between detection of the boundary line and light irradiation, respectively;
FIGS. 9(a) to 9(e) are explanatory diagrams of the relationship between detection of the characteristic outline and light irradiation, respectively.

In FIG. 2, 20 is a component detection optical system, and 21
is the solid-state imaging camera, 22 is an objective optical system placed in the door, and an x-y table 23 is placed in the door, and the printed circuit board 25 is placed on the X-Y table 231-. is set up.

Inspection of the mounting device for the chip components mounted thereon, its deviation, etc. is performed by processing image data obtained from the solid-state imaging camera 21 in the image processing device 24, and the mounting position of the component is inspected. is calculated by the image processing device 24 performing arithmetic processing based on the image data and the position data obtained from the XY table 23.

As shown in FIG. 1(a), the objective optical system 22 includes a cylindrical housing 1 to which a solid-state imaging camera 21 is fixed, and a lens barrel 2 is arranged from above inside the housing 1. Lens 3 below. The optical filters 4 are then fixed one after another.

Note that these housings 1. Lens barrel 2. The centers of the lens 3 and the optical filter 4 are set to coincide with the optical axis of the solid-state imaging camera 21.

A fiber fixing ring 12 is inserted into the tip of the housing 1.
have. The objective optical system 22 itself supports its housing 1 so that the tip of the fiber fixing ring 12 is positioned approximately 101 points from the surface of the printed circuit board 25 placed on the X-Y table 231-. It is held by an arm (not shown).

Now, as shown in FIG. 1(b), the X-Y table 23
On the front end side of the housing 1 facing the camera, six optical fibers are provided as a light projector that emits light in a specific direction. That is, the first optical fiber cable 5. and second optical fiber cables 6 are respectively arranged at diagonal positions,
The third and fourth fiber optic cables 7.8 each
- left and right with respect to the Y table 23, and the fifth and sixth
Optical fiber cables 9 and 10 are provided in front and behind the X-Y table 23, respectively.

Here, the third. 4th. Fifth. The sixth optical fiber cables 7.8.9.10 are arranged at intervals of 90' when viewed from above, and the distal ends of the sixth optical fiber cables 7, 8, 9, and 10 are arranged at intervals of 90' when viewed from the top. 3. 4th. Fifth. Like the sixth optical fiber cables 7.8, 9.10, they are arranged at an angle of 45° when viewed from the plane.

The tip sides of these optical fiber cables 5 and 6 are shown in Figure 3 (
As seen in a) and (b), the through hole 1 of the housing 1
a, la through fixing plates 1b, lb, and the optical fibers 5ay6a are fixed to fiber fixing rings 12, respectively.
The through holes 12a, 12a maintain a specific inclination angle (for example, in the range of 50'' to 600'').

Moreover, the optical fibers 5a and 6a protruding from the distal end sides of the first and second optical fiber cables 5.6 have their distal ends attached to other optical fiber cables (the installation angle of inclination is 20° to 25° as will be described later). It is installed at a large inclination angle (about 50° to 60°) compared to the
As seen in (a) and (b), its tip protrudes a little longer than other optical fiber cables. As a result, the diagonal corners of the parts to be inspected on the printed circuit board 25'' are sufficiently irradiated with the light beam.

On the other hand, the other 3. 4th. Fifth. As shown in FIG.
Similarly, the tip of the optical fiber cable is inserted into the through holes 1a, 1a+... of the housing 1 through the fixing plates 1b, 1b,
The optical fibers 7a, 8a, 9a,
loa is the through hole 12 of the fiber fixing ring 12, respectively.
a, 12a to maintain a specific angle (the range of 20° to 25°).

These first to sixth optical fiber cables 5,6°7.8
, 9.10, as represented by the fourth optical fiber cable 8 in FIG.
The intermediate portion thereof is fixed via the optical fiber cables 5, 6, 7, 8, 9, 10, and the rear end side thereof is provided with strobe light sources 13, 13, . ... (only one is shown, the others are omitted).

Here, the solid-state imaging camera 21 has a built-in two-dimensional image sensor (X-Y image sensor) and an amplifier circuit, and generates an image obtained from the objective optical system 22 as an analog signal. A/1 of the image processing device 24] is sent to the converter 30.

On the other hand, the image processing device 24 includes an A/D converter 30 that receives an image signal from the solid-state imaging camera 21 and an image data buffer 31 that temporarily stores data from the A/D converter 30. The data in the image data buffer 31 is sent to the microprocessor (MPU) via the bus 32.
The data is transferred to memory 34 under the control of 33. Then, predetermined processing is performed on these image data according to a predetermined program stored in the memory 34, which will be described later.

Here, in the recognition program area 35 of the memory 34, programs are stored that broadly divide chip components to be inspected and individually recognize them as chip components in the following five states.

(1) Recognition program for rectangular chip components that are entirely light in color ■35a0 (2) Recognition program for rectangular chip components that are entirely dark in color ■35b0 (3) Square chip in which electrodes are bright and other parts are dark Parts recognition program ■35c.

(4) Recognition program for rectangular chip components with leads such as transistors ■35d0 (5) Recognition program for cylindrical chip components ■35e0 Then, start one of these programs and read the data of the components on the printed circuit board 25 and including its location data,
An inspection processing program 34a that defines the inspection order is stored in the memory 34.

Here, this inspection processing program 34a and each of the five programs define the processing order for chip component recognition, and access various data areas 36 and various table areas 37 for the programs to determine the shape of the chip component. 9
Data such as position, orientation, and boundary line feature parameter data corresponding to the boundary line data are obtained, and predetermined processing described later is executed.

The image processing device 24 also includes a keyboard 40 and an X-Y
X-Y stage drive circuit 4 that drives and controls the stage 23
1, strobe drive circuit 42, screen memory 43, and C
RT display 44 and keyboard 4
0, the strobe drive circuit 42 and the XY stage 23 are connected to interface circuits 38, 39 . bus 3
2 to the MPU 33, and the MPU 33 transfers predetermined data to the screen memory 43 and stores predetermined information in the C
Control is performed to send and display the data on the RT display 44.

As shown in FIG. 4, the image processing device 24 having the above configuration includes a substrate positioning processing means 51, a strobe drive means 52, an image data reading means 53, a window processing means 54, a boundary line position detection means 55, Functional means such as the component type determining means 56, the component position and direction operator stage 579, and the component shift amount determining means 58 are realized by the MPU 33 and various programs stored in the memory 34.

Here, the board positioning processing means 51 is realized in the inspection processing program 34a, and accesses the data storage 6f] area 36a (a part of the various data areas 36) to obtain information on the printed board position and the shape of the component. get.

Here, the form information is information consisting of five form identification information corresponding to the five recognition states (corresponding to the five recognition programs) and the mounting orientation of the parts.

Further, the window processing means 54 performs window processing, which will be described later, on the image data detected in accordance with the five recognition programs in order to individually recognize the chip components in the five states.

Furthermore, the boundary line position detection means 55 detects the boundary line characteristic parameter table 37a (various table areas 3
7), and calculate the position of the boundary line within the window from its feature parameters. The component type determining means 56 refers to the component type table 37b (a part of the various table areas 37) and determines the type of the component.

On the other hand, the component position and direction operator stage 57 generates a size table 37 corresponding to the component type based on the type data from the component type determining means 56 and the data from the boundary line position detection stage 55.
C (a part of the various table areas 37) is l 1j ((), the component size corresponding to the type is determined, and data on the mounting position and angle of the component with respect to the printed circuit board 25 are calculated.

The determining means 58 refers to the data storage area 36a that stores the position and shape of the printed circuit board parts, and calculates the position and direction of the parts using the above-mentioned data.
The amount of misalignment of the component and the direction of the misalignment are calculated from the installation position and angle data calculated in , and it is determined whether or not these misaligned electric currents are greater than a predetermined value to determine whether the component is suitable for installation. Determine whether or not.

Note that the window processing means 54 and the first stage of boundary line position detection 55
, the component type means 56, and the component position and direction calculation means each operate by starting one of the five programs that individually recognize the five types of chip components described in (1) to (5) above. The component shift amount determining means 58 is realized by the inspection processing program 34a.

Now, when a certain chip component to be inspected comes under 1=c of the objective optical system 22, the image processing device 24
); (2) Drives the strobe light source 13 determined by the stored form identification information and direction. Then, a light beam is irradiated in a predetermined direction from the tip of the corresponding optical fiber, and image data is collected from the solid-state imaging camera 21. Note that the solid-state imaging camera 21 collects image data once or twice, and the image processing device 24 processes the image data once or twice.

Next, the image processing device 24 that has obtained the image data at the mounting position of a certain chip component performs the five-dimensional image processing according to one of the recognition modes (1) to (5) above for the chip component corresponding to that position. A predetermined recognition program corresponding to the chip component selected from among the three programs 35a to 35d is started, and based on the position data of the XY stage 23, the presence or absence of the chip component on the printed circuit board 25-1- is determined. Recognizes the type, location, and type of chip components.
Calculate the position and inclination of the chip components according to various programs and data corresponding to the orientation, etc.
Execute the settings. Then, based on the measured position data, it calculates and outputs the installation misalignment of the component [the crossroads], and also checks whether it
1. Inspect whether the parts are installed properly or not.

When the recognition and inspection of a chip component is completed in this manner, the image processing device 24 refers to the component data regarding the printed circuit board 25 in the memory 34 and determines the position of the next chip component at f[ of the target optical system 22]. The xy stage 23 is driven so that it comes down. Then, when the next chip component to be inspected comes directly under the objective optical system 22, the strobe light source I3 is driven in the same way as determined by the identification form and orientation of the chip component, and a predetermined beam is emitted from the tip of the corresponding optical fiber. A light beam will be emitted in the direction.

Next, the same chip component recognition processing, position measurement, and inspection processing as described above are performed.

Here, the operation of the capacity and stage of the image processing device 24 when executing the above-mentioned component recognition 9 position measurement and inspection processing will be explained in detail. First, in response to a command signal from the keyboard 40, The processing device 24 operates its MPU 33 to start the inspection program 34a.

By starting this inspection processing program 34a, the board positioning processing means 51 obtains the printed circuit board component position and form information from the memory 34, and based on the printed circuit board component position information, the The Y stage 23 is controlled to position the first chip component of the printed circuit board 25 at the fifth position of the objective optical system 22, and its position data is stored in a predetermined area on the memory 34.

When this positioning is completed, the substrate positioning processing means 51 drives the seven strobe drive stages 52 in accordance with the form data of the chip component to cause the strobe light source 13 to emit light in a specific direction, and to emit light from the corresponding optical fiber. Irradiation is performed according to a predetermined sequence, image data of the chip components on the printed circuit board 25 is captured by the solid-state imaging camera 21, and the data is stored in the image data buffer 31.

Next, the image data reading means 53 reads these image data and stores them in a specific area of the memory 34.

Next, the window processing means 54 is activated, reads out the image data from the memory 34, and performs window processing on the image data. The window processing stage 54 processes the above-mentioned (1) to (5) of the chip components obtained from the substrate positioning processing means 51.
5 (a) to (c) to 8 (a) to (C), and FIG. One of the window processes shown in (a) to (e) is performed to extract only image data at a specific location.

Next, these image data corresponding to each window are processed by the boundary line position detection means 55 to invert the position (edge position) data of the boundary line between the component and the board, that is, black and white, based on the boundary line parameter data. It is calculated as a boundary line data string or a characteristic outline data string indicating the position of the object, and is sent to the component type determining means 56.

The component type determining means 56 refers to the component type table 37b in the memory 34 based on this boundary line position data for each window and the strobe light emission sequence data obtained from the board positioning processing stage 51, and determines whether a specific chip component is selected. determine something. The data of this chip component is transmitted from the component type determining means 56 to the CRT display 44.
The data is output to and displayed, or output to and stored in the memory 34 or an external storage device.

Further, the boundary line position data from the boundary line position detection means 55 is sent to the component position and direction calculation means 57. The component position and direction operator stage 57 uses this position data, information on the component type determined by the component type determining means 56, and information on the current position of the printed circuit board 25-L sent from the board positioning processing means 51. Based on this information and its orientation information (from the form information), the actual mounting position and orientation on the printed circuit board 25 are calculated by referring to the size table 37c corresponding to the type of component in the memory 34.

These data calculated in this manner are then sent to the component deviation M determination T stage 58. When the component misalignment 1 occurs, the determining means 58 reads out the original mounting position and direction of the printed circuit board component from the data storage area 36d, and determines +li
Calculate the amount of installation deviation and the direction of the deviation between the installation position and angle data listed in i, and compare the installation standard deviation river and this calculated deviation thicket, and determine if the difference is less than a predetermined value - 1 - or not, and determine whether or not the installation of the part is appropriate.

These pupil deviations and their suitability are output from the component deviation amount determining means 58 to the CRT display 44 for display, or output to the memory 34 or an external storage device and stored therein.

As described above, the type of part is recognized, the position and direction of the part is measured, and the part is inspected. When this is completed, the component displacement M determining means 58 activates the board positioning processing means 51 in order to recognize, measure, and inspect the next component on the printed circuit board 25''. Then, the printed circuit board 25 is positioned by the substrate positioning processing means 51 by moving the X-Y table 23 so that the next chip component is located directly in front of the objective optical system 22.

In this way, both the image processing device 24 and the X-Y table 2
3. Recognize parts while synchronizing with U, position i1!
ll settings, and then execute the inspection.

Note that when recognizing a specific chip component, the memory 3
4. Necessary for starting the strobe drive means 52, window processing means 53, and boundary line position detection means 55 according to the specification from the keyboard 40 and performing the target recognition processing without referring to the form information of the parts in step 4. recognition program,
One of the recognition programs 35a to 35d may be selected in response to the command.

Furthermore, if the chip component to be inspected is unspecified, these recognition programs can be sequentially activated to sequentially recognize the chip component.

Next, a description will be given of how the image processing device 24 performs recognition processing according to the five recognition programs.

I: The whole part is brightly colored, and the knob part (reflection from the electrode and part body is 1 minute).

For parts with bright colors as a whole, please refer to Figure 5 (a).
), (b), the first. second optical fiber 5,
By sequentially irradiating diagonal strobe light Lt + L2 from 6 to 6 at a predetermined timing, the shadow part caused by the reflection from the chip component part and its electrode part and the light rays generated around it, Window processing means 54
After performing window processing, the relationship shown in Figure 5 (C) is w.
, -w6, the image of the reflected portion including this shadow is detected at six locations (multiple points) to obtain boundary line data for each.

The data of each window detected in this way is stored in a specific area of the memory 34, and is stored in the boundary line position detection means 55.
The position of the boundary line is determined by
The presence or absence of a knob, the type of the part, and the part itself are recognized, and further, the position and orientation of the part are determined by the part position and direction calculation means 57.

■: The entire body is dark colored except for the electrode part.
Only the electrodes are reflected and shine).

1) As in 1f, for chip parts that are dark colored except for the electrodes, as shown in Figures 6(a) and (b),
1st. Oblique strobe light L from the second optical fibers 5 and 6
1 and L2 are sequentially irradiated at a predetermined timing, and the window processing means 54 performs window processing on the reflection from the electrode portion of the chip component and the shadow portion caused by the light rays generated around the electrode portion of the chip component. With the relationship shown in Figure 6(e), the image of the reflected part including this shadow is detected at 6 locations (multiple points) using the detection window (detection area) of w, -W, 5, and each After obtaining the boundary line data, the same process as in (2) above is executed.

Here, the positions of the windows W3 to W6 are Wl.

Calculation of electrode position by W2 window is determined from a private residence.

■: The whole chip part is a bright color (when the color of the printed circuit board is bright).

For chip parts that are entirely dark colored as shown in FIGS. 7(a) and 7(b), 1. The oblique strobe lights Lt + L2 are sequentially irradiated from the second optical fibers 5 and 6 at predetermined timings to eliminate reflections from the electrode portions of the chip components (non-reflection state) and those occurring in the surrounding areas. The part of the reflection generated from the light ray is subjected to window processing by the window processing means 54, and as shown in FIG. 7(C), W,
- Using the detection window (detection area) of W6, detect the image including the reflected part from the board side at 6 locations (multiple points), obtain data for each boundary line, and then perform the same process as above be done.

■: Items with lead wires such as transistors.

For chip components such as transistors shown in FIGS. 8(a) and 8(b), which have lead wires in the left and right or up and down directions, optical fibers in the direction corresponding to the lead wire direction, e.g. 3. Strobe light from the fourth optical fiber 7.8; 3. L4 is sequentially irradiated at a predetermined timing, and the reflection from the electrode portion of the chip component and the shadow portion caused by the light rays generated in the surrounding area are subjected to window processing using 10 stages 54 of window processing. Figure 8 (
W7~W seen in C)? The detection window (detection area) detects the image including the reflected portion from the lead wire side at three locations (multiple points) corresponding to the lead wire, obtains data for each boundary line, and performs the following steps as described above. Similar processing is performed.

■: For circular chip parts.

In the case of circular chip parts as shown in FIGS. 9(a) and 9(b), the left and right or -L
Vertical optical fibers, for example 3rd and 4th optical fibers 7
．． The strobe light LJILq is sequentially irradiated from 8 to 8 at a predetermined timing, and the window processing means 54 performs window processing on the shadows caused by the reflection from the electrode portion of the chip component and the light rays generated in the surrounding area. Then, the video waveform S is obtained according to the relationship shown in FIG. 9(C).
Using the windows WIO and Wll (detection area) as shown in figure (d), the image including the reflected portion from the upper corner is detected at two locations (multiple points) at both ends, and one piece of data is collected for each of the two ends. After that, the same process as in (2) above is executed.

Incidentally, the inclination of such parts is determined by the windings WIO, W whose position is shifted to the phase fi, as shown in FIG. 9(e).
ll (4' 3 out region), the position of its center is ',
'> 11, the slope O is obtained.

By the way, in this embodiment, the optical fiber light projection system is sunk in a uniform state at the tip of the χ/l object optical system, and the objective optical system and solid-state imaging camera are Therefore, the angle of the objective optical system with respect to the optical axis of the camera, etc.
It has the advantage that it is easy to set the distance, etc., and to center the symmetrical position of the optical fiber.

Although 1- has been explained above, in the embodiment, FIGS. 9(a) to (
With the exception of e), window processing is performed mainly on the boundary line of the part, but the scope is not limited to the boundary line, and it goes without saying that it can be applied to the outline of the part in general.
1S products are not limited to chip parts.

In addition, for recognition of childless parts and recognition of the types of nine products, it is sufficient to recognize the part with one of them by starting five recognition programs including window processing that sequentially detects each feature. . Therefore, configuration information related to window processing is not required in advance.

In the embodiment, instead of arranging a plurality of optical fibers, it goes without saying that one optical fiber may be moved and installed in each direction for use.

Furthermore, it goes without saying that the types of recognition forms or the types of recognition programs for detecting features are not limited to the five mentioned in the embodiment.

[Effects of the Invention] As can be understood from the following explanation, the present invention irradiates electronic components mounted on a board with a light beam that creates a shadow of the electronic component in a predetermined direction. The characteristic outline of the shadow and reflective part of one electronic component is collected at multiple locations, and the installation status of the electronic component on the board is determined from the data of these multiple outlines. Electronic components can be recognized using multiple outline data that characterizes electronic components, and feature point data processing is possible. From the positional relationship of the parts, it is possible to calculate the mounting position of the electric component on the board; δ or its angular deviation, as well as the position of its center point, etc., making it possible to inspect the mounting state with high precision.

As a result, it is possible to reduce the amount of data processing required when inspecting the installation status of city parts, and even with a small amount of data, it can be processed efficiently, making it possible to inspect a wide variety of parts in a medium amount of time.

4. Explanation of Drawings FIG. 1(a) shows an example of a chip component inspection system in which the electronic component mounting state inspection method of the present invention is applied to a chip component inspection device. Detailed diagram of component detection optical system, 1st
Figure (b) is a 1-haku nj diagram of the structure of the tip of the objective optical system seen from the do side, Figure 2 is a schematic diagram of the chip component inspection device, and Figure 3 (a).

(b) are I-I in FIG. 1(b), respectively.
Cross-sectional view of m < minute and corresponding view from below゛11
Figure 4 of the drawing is part 11! 5(a), 5(b) and 5(c), which are functional block diagrams of the I image processing device part, are respectively explanatory diagrams of the relationship between boundary line detection and light irradiation;
Figures (a), (b), and (c) are explanatory diagrams of the relationship between detection of the boundary line and light irradiation for a chip component that is closed except for the electrode portion, and Figures 7 (a) and (c), respectively. b) and (
c) is an explanatory diagram of the relationship between detection of the boundary line and light irradiation for a chip component that is entirely dark, and Fig. 8 (a)
).

(b) and (C) are explanatory diagrams of the relationship between the detection of the boundary line of a chip component having a lead wire portion and the radiation of the light beam 11 ((()), respectively. ) are explanatory diagrams of the relationship between the detection of the outline of a circular chip component and the irradiation of the light beam, and FIGS. 9(d) and (e), respectively.
) are explanatory diagrams of the window processing.

■...Housing, 2...Mirror surface, 3...Lens,
4... Optical filter, 5-10... Optical fiber, 1
3... Strobe light source, 12... Fiber fixing ring, 12b... Open 1-1 space, 20... Component detection optical system, 21... Solid-state imaging camera, 22... Objective optical system , 23...X-Y table, 24... Image processing device for image data, 25... Printed circuit board.

33... Microprocessor (MPU), 34...
Memory, 51...Substrate positioning processing means, 52...
Strobe driving means, 53... 7 stages of image data reading;
54... Window processing means, 55... Boundary line position detection means, 56... Part type determination means, 57... Part position and direction calculation means, 58... Part shift acid determination means.

Patent applicant Tokyo Electron Ltd. agent
Patent Attorney Kaji Yama Kore Patent Attorney 10 Yamaki Fuji Riki Figure 1 (CI) Figure 3 (b) -'''---2--] 1.

-1--J Figure 5 (Q) Figure 5 (b) Figure 6 (Q) Figure 6 (Q) Figure 6 (Q) Figure 6 (Q) !-L F Fig. 7(b) Fig. 8(b) Fig. 8(C) *911ffi(Q) Fig. 9(b) Fig. 9(C) Piece

Claims (6)

[Claims] (1) The electronic component mounted on the board is irradiated with a light beam that creates a shadow of the electronic component in a predetermined direction, and characteristic outlines of the shadow and reflected portion of the electronic component are collected at multiple locations. . A method for inspecting the mounting state of electronic components, characterized in that the mounting state of the electronic components on the board is determined from the collected data of the plurality of outline lines. (2) The electronic component mounting state inspection method according to claim 1, wherein the characteristic outline is a boundary line of the electronic component. (3) The electronic component is a chip component, and the irradiation direction of the light beam is multiple directions, and the type of the chip component can be determined by a combination of a specific direction among the multiple directions and the collected data of the corresponding boundary line. 3. The method for inspecting the mounting state of an electronic component according to claim 1 or 2, wherein the mounting state is determined by determining the position of the electronic component. (4) The electronic component is a plurality of types of chip components, and the irradiation direction of the light beam is a plurality of directions, and a specific direction among the plurality of directions is selected corresponding to the type of the chip component. Claim 1, characterized in that the type of the chip component is determined based on a plurality of combinations of boundary line data corresponding to the irradiation direction, and the mounting state is determined by calculating the amount of mounting deviation thereof. A method for inspecting the installation state of electronic components as described in item 1 or 2. (5) The electronic component according to claim 3 or 4, wherein the light beam is irradiated from an optical fiber, and the irradiation direction is set depending on the installation position of the optical fiber. Installation condition inspection method. (6) The light beam is generated by a strobe, and the installation positions of the optical fibers are one pair at the front and back of the device, one pair at the left and right, and one pair at an intermediate position between the front and rear and the left and right.
The electronic device according to claim 5, wherein each of the pairs of optical fibers in the front, rear, left, and right directions emit light beams simultaneously, and the optical fibers installed at the intermediate positions each independently emit light beams. Parts installation condition inspection method.