JPH0568880B2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field]

The present invention is an electronic component installation condition inspection device used to detect the installation condition of various electronic components such as chip components, semiconductor chip components, ICs, LSI packages, resistors, and capacitors installed on a printed circuit board. Regarding.

[Conventional technology]

Conventionally, systems that inspect the mounting condition of electronic components, such as the mounting position on the printed circuit board, the amount of deviation from the original position, and the mounting angle,
Some methods are known, such as those that irradiate a predetermined light onto the entire part, collect an overall image of the part using an image sensor, etc., and analyze this image for inspection, and those that use ultrasonic waves, etc. for inspection. ing.

[Problems to be Solved by the Invention] Conventional methods that collect an entire image of a part using an image sensor and perform image analysis require a large amount of data to be processed. However, there are disadvantages such as slow processing and insufficient inspection. Additionally, when sensing with ultrasonic waves, etc., depending on the type of component, the resolution may drop and insufficient inspection may be performed, resulting in a high rate of component misrecognition.
Since ultrasonic waves are used as the detection medium, there are drawbacks such as the need for special processing. Therefore, this invention requires less data processing and
It is an object of the present invention to provide an electronic component mounting state inspection device that can efficiently inspect the mounting state of electronic components such as the mounting position.

[Means to solve the problem]

The electronic component installation state inspection device of the present invention includes:
An imaging camera (solid-state imaging camera 21) installed directly above the electronic component on a board (printed circuit board 25) having the electronic component whose mounting state is to be inspected to take an image of the electronic component, and on the optical axis of this imaging camera. At least two parts diagonally above the electronic component while avoiding
Optical fiber cables 5 and 6 are installed at locations and emit strobe light; a strobe light source 13 is installed corresponding to the optical fiber cable and emits the strobe light; and the strobe light source is selectively operated. light source control means (strobe drive means 52) for irradiating the electronic component with the strobe light from at least two different irradiation directions through the optical fiber cable; and irradiation of the strobe light controlled by the light source control means. a window processing means 54 for receiving image data obtained from the imaging camera by imaging the electronic component and extracting image data at a specific location from the image data; Comparing the image data obtained by the window processing means with a storage means (memory 34) that stores corresponding form information and the form information read from this storage means to determine the mounting state of the electronic component. The present invention is characterized in that it includes a determining means (component deviation amount determining means 58).

[Effect]

With this configuration, the imaging camera is installed directly above the electronic components, and strobe light is selectively irradiated from at least two positions displaced from the optical axis of the imaging camera, and the benefits obtained by the irradiation are obtained. By capturing images from electronic components that are being inspected using an imaging camera, electronic components can be recognized using multiple outline data that characterizes the electronic component, and feature point data processing is possible. Even if the number of parts increases, it is possible to calculate the mounting position of the electronic component on the board or its angle deviation, as well as the position of the center point, etc. from the positional relationship of multiple characteristic external parts, and inspect the mounting state with high precision. I can do it. Therefore, the amount of data to be processed in inspecting the mounting state of electronic components can be reduced, and even with a small amount of data, it can be processed efficiently, and a wide variety of components can be inspected in a short time.

【Example】

Hereinafter, one embodiment of the present invention will be described in detail using the drawings. FIG. 1a is a detailed view of an optical system for detecting a chip component in an embodiment of the electronic component mounting state inspection device of the present invention when applied to a chip component inspection device, and FIG. , Fig. 2 is a plan view of the structure of the tip of the objective optical system as seen from below.
Schematic diagram of chip parts inspection equipment, Figure 3 a, b
are a cross-sectional view taken along the line - in FIG. 1b, a corresponding plan view seen from below, and a
The figure shows a functional block diagram of the image processing device.
Figures 5 a to 8 a to c are diagrams showing the relationship between detection of the boundary line and light irradiation, respectively, and Figures 9 a to e are diagrams of the relationship between detection of the characteristic outline and light irradiation, respectively. It is a figure showing a relationship. In FIG. 2, 20 is a component detection optical system, 21 is its solid-state imaging camera, 22 is an objective optical system placed below it, and an X-Y table 23 is placed below it. A printed circuit board 25 is placed on the XY table 23. Then, to inspect the mounting position of the chip components mounted thereon, the amount of deviation thereof, etc., image data obtained from the solid-state imaging camera 21 is sent to the image processing device 24.
The mounting position of the component is calculated by the image processing device 24 performing arithmetic processing based on the image data and the position data obtained from the XY table 23. As shown in FIG. 1a, the objective optical system 22 has a cylindrical housing 1 to which a solid-state imaging camera 21 is fixed.
is arranged, and a lens 3 and an optical filter 4 are fixed in this order below. The centers of the housing 1, lens barrel 2, lens 3, and optical filter 4 are set to coincide with the optical axis of the solid-state imaging camera 21. A fiber fixing ring 12 is inserted into the tip of the housing 1, and the fiber fixing ring 12 has an opening space 12b through which reflected light from the component passes. The objective optical system 22 itself supports its housing 1 so that the tip of the fiber fixing ring 12 is positioned approximately 10 mm from the surface of the printed circuit board 25 placed on the X-Y table 23. It is held by an arm (not shown). Now, as shown in FIG. 1b, six optical fibers are provided at the front end of the housing 1 facing the X-Y table 23 as a projector for emitting light in a specific direction. That is, the first fiber optic cable 5 and the second fiber cable 6 are arranged at diagonal positions, and the third and fourth fiber optic cables 7 and 8 are arranged left and right, respectively, with respect to the X-Y table 23. , and fifth and sixth optical fiber cables 9 and 10 are provided in front and behind the X-Y table 23, respectively. Here, the third, fourth, fifth, and sixth optical fiber cables 7, 8, 9, and 10 are arranged with their distal ends spaced at 90° intervals when viewed from the plane, and the first and sixth optical fiber cables 7, 8, 9, and
The second optical fiber cables 5 and 6 have their distal ends at an angle of 45° when viewed from the plane, similarly to the third, fourth, fifth, and sixth optical fiber cables 7, 8, 9, and 10, respectively. It is arranged without. The tip sides of these optical fiber cables 5 and 6 are
As shown in FIGS. 3a and 3b, the optical fibers 5a, 6a are fixed to the through holes 1a, 1a of the housing 1 via the fixing plates 1b, 1b, and the optical fibers 5a, 6a are fixed to the through holes 12a, 12a of the fiber fixing ring 12, respectively. It is held at a certain tilt angle (e.g. in the range of 50° to 60°). Moreover, the optical fibers 5a protruding from the distal ends of the first and second optical fiber cables 5, 6,
6a, the tip of which is attached to another optical fiber cable (its installation angle is 20° to 25° as described later).
The fiber optic cable is attached at a larger angle of inclination (50° to 60°) than the optical fiber cable, and its tip protrudes a little longer than other optical fiber cables, as shown in FIGS. 3a and 3b. As a result, the corner of the component to be inspected on the printed circuit board 25 on the target line is sufficiently irradiated with the light beam. On the other hand, the other third, fourth, fifth, and sixth optical fiber cables 7, 8, 9, and 10 are shown in FIG.
As shown in the figure, the state is slightly tilted from horizontal (for example,
Similarly, the ends of the optical fiber cables are fixed to the through holes 1a, 1a, ... of the housing 1 via the fixing plates 1b, 1b, and the optical fibers 7a, 8a, 9a, 10a are They are each held at a specific angle (in the range of 20° to 25°) by through holes 12a, 12a of the fiber fixing ring 12. These first to sixth optical fiber cables 5,
As represented by the fourth optical fiber cable 8 in FIG. The middle part is fixed, and the rear end side is connected to strobe light sources 13, 13, ... (only one is shown, others are omitted) corresponding to these optical fiber cables 5, 6, 7, 8, 9, 10. It is connected. Here, the solid-state imaging camera 21 has a built-in two-dimensional image sensor (X-Y image sensor) and an amplifier circuit, and generates an image obtained from the objective optical system 22 as an analog signal, which is then sent to the image processing device. 24 A/D converters 20 and send out. On the other hand, the image processing device 24 includes the solid-state imaging camera 2
1, and an image data buffer 31 that temporarily stores the data from the A/D converter 30. The data in the image data buffer 31 is transferred to the bus 32. The data is transferred to a memory 34 under the control of a microprocessor (MPU) 33 via the data processor. Then, predetermined processing is performed on these image data according to a predetermined program stored in the memory 34, which will be described later. Here, the recognition program area 35 of the memory 34
Stored in the program are programs for broadly dividing chip parts to be inspected and individually recognizing them as chip parts in the following five states. (1) A recognition program 35a for rectangular chip parts whose entire surface is brightly colored. (2) Recognition program 35b for rectangular chip parts whose entire surface is dark-colored. (3) Recognition program 35c for rectangular chip parts in which electrode parts are bright and other parts are dark. (4) Recognition program 35d for rectangular chip parts with leads such as transistors. (5) Recognition program for cylindrical chip parts 35
e. An inspection processing program 34a is stored in the memory 34 that starts one of these programs and defines an inspection order, including data on parts and their position data on the printed circuit board 25. Here, this inspection processing program 34a and each of the five programs define the processing order for chip component recognition, and access various data areas 36 and various table areas 37 for the programs to determine the shape of the chip component. , position, orientation, boundary line feature parameter data corresponding to the boundary line data, etc. are obtained, and predetermined processing described later is executed. The image processing device 24 also includes an X-Y stage drive circuit 41 that drives and controls the keyboard 40 and the X-Y table 23, a strobe drive circuit 42, a screen memory 43, and a CRT display 44. The strobe drive circuit 42 and the X-Y table 23 are connected to the MPU 33 via interface circuits 38 and 39 and the bus 32, respectively, and the MPU 33 transfers the data to a predetermined data screen memory 43 and stores the predetermined information. of
Control is performed to send and display the data on the CRT display 44. Image processing device 24 having the above configuration
As shown in FIG.
2. Functional means such as image data reading means 53, window processing means 54, boundary line position detection means 55, part type determination means 56, part position and direction calculation means 57, and part deviation amount determination means 58 are installed in the MPU 3.
3. Realized by various programs stored in the memory 34. Here, the substrate positioning processing means 51 is realized in the inspection processing program 34a, and is implemented in the data storage area 36a (various data areas 3
6) to obtain printed circuit board position and component form information. Here, the form information is information representing five form identification information corresponding to the five recognition states (corresponding to the five recognition programs) and the mounting orientation of the parts. Further, the window processing means 54 is configured to individually recognize the chips in the five states described above.
Window processing, which will be described later, is performed on the image data detected in accordance with the two recognition programs. Further, a boundary line position detection means 55, a memory 34
The position of the boundary line within the window is calculated from the characteristic parameters by referring to the area of the boundary line characteristic parameter table 37a (part of the various table areas 37). The component type determining means 56 refers to the component type table 37b (a part of the various table areas 37) and determines the type of the component. On the other hand, the size table 37c (a part of the various table areas 37) corresponding to the part type is referred to from the part position and direction calculating means 57, the type data from the part type determining means 56, and the data from the boundary line position detecting means 55. Then, the component size corresponding to the type is obtained, and data on the mounting position and angle of the component with respect to the printed circuit board 25 are calculated. Component shift amount determination means 58, data storage area 36a that stores printed circuit board component positions and shapes
With reference to , the amount of mounting deviation of the component and the direction of the deviation are calculated from the above data and the data of the mounting position and angle calculated by the component position and direction calculation means 57, and the amount of deviation is calculated. It is determined whether or not the value is greater than or equal to a predetermined value, and it is determined whether or not the attachment of the part is appropriate. The window processing means 54, the boundary line position detection means 55, the component classification means 56, and the component position and direction calculation means individually recognize the chip components in the five states (1) to (5) above. Each of these is realized by starting one of the five programs, and the component deviation amount determination means 58 is executed by the inspection processing program 34.
This is realized by a. Now, when a certain chip part to be inspected comes directly under the objective optical system 22, the image processing device 24 drives the strobe light source 13 determined by the above-mentioned five form identification information and orientation of the chip part. Then, a light beam is irradiated in a predetermined direction from the tip of the corresponding optical fiber, and image data is collected from the solid-state imaging camera 21. Note that the fixed imaging camera 21 collects image data once or twice, and the image processing device 24 processes the image data once or twice. Next, the image processing device 24 that has obtained the image data at the mounting position of a certain chip component selects the chip component corresponding to that position according to one of the recognition modes (1) to (5) above. Two programs 35a~
A predetermined recognition program corresponding to the chip part selected from 35d is started, and X-Y
Based on the position data of the table 23, the presence or absence and type of chip components on the printed circuit board 25 are recognized, and further, according to various programs and data corresponding to the type, position, orientation, etc. of the chip components,
The position and inclination of the chip parts are calculated and the measurements are carried out. Then, based on the measured position data, the amount of installation deviation of the component is calculated and output, and it is determined whether the amount of deviation is less than a predetermined value to check whether the installation of the component is appropriate. conduct. When the recognition and inspection of the chip component is completed, the image processing device 24 refers to the component data regarding the printed circuit board 25 in the memory 34 and moves the chip component so that the next chip component position is directly below the target optical system 22. Drive the X-Y table 23. Then, when the next chip component to be inspected comes directly under the objective optical system 22, the strobe light source 13 is driven in the same way, and the strobe light source 13 is driven in the same way, and the strobe light source 13 is driven from the tip of the corresponding optical fiber. A light beam will be emitted in a predetermined direction. Next, the chip component recognition process, position measurement, and inspection process similar to those described above are performed. Here, to specifically explain the operation of each means of the image processing device 24 when executing the above-mentioned parts recognition, position measurement, and inspection processing, first, the image processing device 24
operates its MPU 33 and starts the inspection program 34a and the like. By starting this inspection processing program 34a, the substrate positioning processing means 5
1 obtains the printed circuit board component position and form information from the memory 34, and based on the printed circuit board component position information, performs the X-Y stage drive circuit 41 via the
The table 23 is controlled to position the first chip component on the printed circuit board 25 directly below the objective optical system 22, and its position data is stored in a predetermined area on the memory 34. Upon completion of this positioning, the substrate positioning processing means 51 drives the strobe drive means 52 to emit light from the strobe light source 13 in a specific direction in accordance with the form data of the chip component, and directs the light beam from the corresponding optical fiber in a predetermined direction. The image data of the chip components on the printed circuit board 25 is captured by the solid-state imaging camera 21, and the data is stored in the image data buffer 31. Next, the image data reading means 53 reads these image data and stores them in a specific area of the memory 34. Next, the window processing means 54 is activated, reads out the image data from the memory 34, and performs window processing on the image data. The window processing means 54 performs a fifth process, which will be described later, on the obtained image data for the form corresponding to one of the recognition types (1) to (5) of the chip component obtained from the board positioning processing means 51. Performing one of the window processes shown in Figures a to c to Figures 8 a to c and Figures 9 a to c,
Extract only image data from a specific location. Next, these image data corresponding to each window are processed by the boundary line position detection means 55 to invert the position (edge position) data of the boundary line between the component and the board, that is, black and white, based on the boundary line parameter data. It is calculated as a boundary line data string or a characteristic outline data string indicating the position of the object, and is sent to the component type determining means 56. The component type determining means 56 refers to the component type table 37b in the memory 34 based on this boundary line position data and the strobe light emission sequence data obtained from the board positioning processing means 51 for each window, and determines whether the window is a specific chip component. Determine. The chip component data is outputted from the component type determining means 56 to the CRT display 44 for display, or outputted to the memory 34 or an external storage device and stored therein. Further, the boundary line position data from the boundary line position detection means 55 is sent to the component position and direction calculation means 57. The component position and orientation calculation means 57 uses this position data, information on the component type determined by the component type determination means 56, and information on the current position of the printed circuit board 25 and its orientation sent from the board positioning processing means 51. Based on the information (from the form information), the size table 37c corresponding to the type of component in the memory 34 is referred to, and the printed circuit board 25 is
The actual mounting position and direction on the top are calculated. These data calculated in this way are then sent to the component deviation amount determining means 58. A component displacement amount determining means 58 stores the original mounting position and direction of the printed circuit board component in the data storage area 36a.
The amount of installation deviation and the direction of the deviation between the above-mentioned installation position and angle data are calculated, and the installation standard deviation amount and this calculated deviation amount are compared and the difference is determined as a predetermined value. It is determined whether or not the above is true, and it is determined whether or not the installation of the part is appropriate. The amount of deviation and its suitability are output from the component deviation amount determining means 58 to the CRT display 44 for display, or output to the memory 34 or an external storage device and stored therein. As described above, the type of part is recognized, the position and direction of the part is measured, and the inspection is performed. When this is completed, the component shift amount determining means 58 activates the board positioning processing means 51 in order to recognize, measure, and inspect the next component on the printed circuit board 25. Then, the printed board 25 is positioned by the board positioning means 51 by moving the XY table 23 so that the next chip component is located directly below the objective optical system 22. In this way, the image processing device 24 and the XY table 23 perform component recognition, position measurement, and inspection while being synchronized with each other. In addition, when recognizing specific chip parts,
The strobe driving means 5 is operated according to the specification from the keyboard 40 without referring to the form information of the parts in the memory 34.
2. Activate the window processing means 53 and the boundary line position detection means 55, and select one recognition program necessary for performing the target recognition process from among the recognition programs 35a to 35d according to the command. It may be possible to do so. Furthermore, if the chip parts to be inspected are unspecified, these recognition programs can be sequentially activated to sequentially recognize the chip parts. Next, a description will be given of how the image processing device 24 performs recognition processing according to the five recognition programs. : Chip parts that are brightly colored as a whole (those with sufficient reflection from the electrodes and the part itself). For chip parts that are brightly colored as a whole, diagonal strobe lights L ₁ and L ₂ are sequentially applied at predetermined timing from the first and second optical fibers 5 and 6, as shown in FIGS. 5a and 5b. so that it is irradiated,
The window processing means 54 performs window processing on the shadow portions caused by the light rays generated on the chip component surface, the reflection from the electrode portions thereof, and the periphery of the chip components, thereby forming W 1 to W ₁ in the relationship shown in FIG. 5c.
The detection window (detection area) of _W6 detects the image of the reflected area including this shadow at six locations (multiple points) to obtain boundary line data for each. The data of the detected window is stored in a specific area of the memory 34 and read out by the boundary line position detecting means 55 to determine the position of the boundary line, based on this boundary line area data from each window. Then, the presence or absence of each component chip, the type of component, and the component itself are recognized, and furthermore, the component position and orientation calculation means 57 determines the location and orientation of the component. : A chip whose entire part is dark except for the electrodes (however, only the electrodes are reflective and shiny). Similarly to the above, for chip parts that are dark in color except for the electrode portions, oblique strobe light L ₁ is applied from the first and second optical fiber cables 5 and 6, as shown in FIGS. 6a and 6b. _. , Figure 6c
Using the detection windows (detection areas) of W ₁ to W ₆ as shown in the figure, the image of the reflected area including this shadow is detected at six locations (multiple points), and data for each boundary line is obtained. Thereafter, the same processing as described above is executed. Here, the positions of the windows W ₁ to _{W 6} are W ₁ ,
This is determined from the calculation results of the electrode position using the _W2 window. : Chip parts that are entirely dark colored (if the printed circuit board is light colored). As shown in FIGS. 7a and 7b, a chip component having a dark color as a whole is irradiated with diagonal strobe light L ₁ and L ₂ sequentially at a predetermined timing from the first and second optical fibers 5 and 6. As shown in FIG. With the relationship shown in
With the detection window (detection area) of W ₁ to W ₆ ,
The image including the reflected portion from the board side is detected at six locations (multiple points), data on each boundary line is obtained, and the same processing as described above is executed thereafter. : Items with lead wires such as transistors. As shown in FIGS. 8a and 8b, for chip components such as transistors that have lead wires in the left and right or up and down directions, optical fibers, such as third and fourth The strobe lights L ₃ and L ₄ are sequentially irradiated from the optical fibers 7 and 8 at a predetermined timing to eliminate reflections from the electrodes of the chip components and shadows caused by these light rays generated in the surrounding areas. ,
The window processing means 54 performs window processing, and the detection windows (detection areas) W ₇ to _{W 9} shown in FIG. point) to obtain data for each boundary line, and then the same process as described above is executed. : For circular chip parts. As shown in FIGS. 9a and 9b, in the case of a circular chip component, the strobe light L is emitted from left and right or up and down optical fibers, for example, third and fourth optical fibers 7 and 8, so as to match the longitudinal direction of the chip component. ₃ , L ₄
are sequentially irradiated at a predetermined timing, and the window processing means 54 performs window processing on the shadow portion caused by the reflection from the electrode portion of the chip component and the light rays generated in the surrounding area. A video waveform S is obtained with the relationship shown in Figure c, and windows W ₁₀ and W ₁₁ are formed as shown in Figure 9D.
(detection area), the image including the reflected portion from the upper corner is detected at two locations (multiple points) at both ends, respective reflection data are obtained, and the same processing as described above is executed thereafter. Note that the slope of such a part is the 9th
As shown in Figure e, the inclination θ is obtained by calculating the position of the center of the windows W ₁₀ and W ₁₁ (detection areas) whose positions are shifted from each other. By the way, in this embodiment, the optical fiber projection system is provided as a unit at the tip of the objective optical system, and the objective optical system and the solid-state imaging camera are made into independent units. This has the advantage that it is easy to set the angle, distance, etc. of the objective optical system and to set the symmetrical position of the optical fiber. As explained above, in the embodiment, FIGS.
Except for the case shown in e, window processing is performed mainly on the boundary line of the part, but the target is not limited to the boundary line, and of course it can be applied to the outline of the part in general, and the part is a chip part. It is not limited to. Furthermore, in recognizing the presence or absence of a component and recognizing the type of component, it is sufficient to recognize the component with one of five recognition programs, including window processing that sequentially detects the characteristics of each component. Therefore, form information related to window processing is not required in advance. In the embodiment, a plurality of optical fibers are arranged, but it goes without saying that one optical fiber may be moved and installed in each direction for use. Furthermore, it goes without saying that the types of recognition forms or the types of recognition programs for detecting features are not limited to the five mentioned in the embodiment.

【Effect of the invention】

As explained above, according to the present invention, with respect to an electronic component mounted on a board, the camera is installed at at least two locations diagonally above the electronic component, avoiding the optical axis of the imaging camera installed directly above the electronic component. A strobe light is irradiated at least twice in different irradiation directions through an optical fiber cable, and the electronic components irradiated with the strobe light are captured by an imaging camera from directly above, and the electronic components are mounted on the board based on the image data. Since the status is determined, the irradiation direction of the strobe light can be easily controlled by selectively controlling the strobe light source, and the amount of data processing required to determine the installation status of electronic components can be significantly reduced. The mounting state of electronic components, such as the mounting position and angular deviation thereof, can be determined quickly, efficiently, and with high precision.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment of the electronic component mounting condition inspection device of the present invention, and a is a detailed view of a component detection optical system for chip components in an embodiment applied to the chip component inspection device; b is a plan view of the structure of the tip of the objective optical system seen from below, Fig. 2 is a schematic diagram showing the chip component inspection device, and Fig. 3 is
Fig. 1b is a cross-sectional view of the minus part and a corresponding plan view showing the lower side, Fig. 4 is a functional block diagram showing the image processing device part, and Fig. 5 is a diagram showing boundary line detection and light irradiation. Figure 6 is a diagram showing the relationship between detection of the boundary line and optical irradiation for a chip component that is dark except for the electrode portion, Figure 7
FIG. 8 is a diagram showing the relationship between the detection of the boundary line and light irradiation for a chip part that is entirely dark; FIG. FIG. 9 is a diagram showing the relationship between the detection of the outline of a circular chip component and the irradiation of a light beam, as well as the window processing thereof. DESCRIPTION OF SYMBOLS 1... Housing, 2... Lens barrel, 3... Lens, 4... Optical filter, 5-10... Optical fiber, 13... Strobe light source, 12... Fiber fixing ring, 12b... Opening space, 20... Component detection optical system, 21... Fixed imaging camera, 22...
Objective optical system, 23...X-Y table, 24...
Image processing device for image data, 25...Printed circuit board, 33...Microprocessor (MPU), 34
...Memory, 51...Substrate positioning processing means, 5
2... Strobe drive means (light source control means), 53
...Image data reading means, 54...Window processing means, 55...Border line position detection means, 56...
Component type determination means, 57...Component position and direction calculation means, 58...Component shift amount determination means.

Claims (1)

[Scope of Claims] 1. An imaging camera installed directly above the electronic component on a board having the electronic component whose mounting state is to be inspected to take an image of the electronic component; an optical fiber cable installed diagonally above the electronic component in at least two locations to irradiate the strobe light; and an optical fiber cable installed in correspondence with the optical fiber cable;
a strobe light source that emits the strobe light; a light source control means that selectively operates the strobe light source to irradiate the electronic component with the strobe light from at least two different irradiation directions through the optical fiber cable; Window processing means receives image data obtained from the imaging camera by imaging the electronic component irradiated with the strobe light controlled by the control means, and extracts image data of a specific location from the image data; , a storage means storing form information corresponding to the electronic component to be inspected; and comparing the form information read from the storage means with the image data obtained by the window processing means. An apparatus for inspecting the mounting state of an electronic component, comprising: determining means for determining the mounting state of the electronic component.