JPS6282571U - - Google Patents
Info
- Publication number
- JPS6282571U JPS6282571U JP1985175124U JP17512485U JPS6282571U JP S6282571 U JPS6282571 U JP S6282571U JP 1985175124 U JP1985175124 U JP 1985175124U JP 17512485 U JP17512485 U JP 17512485U JP S6282571 U JPS6282571 U JP S6282571U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- eyelet
- opening
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は同上をプリント基板に取り付けた後にリード
線をはんだ付けしている状態を示す断面図、第３
図は本考案の他の実施例を示す斜視図、第４図は
同上をプリント基板に取り付けた後にリード線を
はんだ付けしている状態を示す断面図、第５図は
従来例のプリント基板への取り付け状態を示す断
面図、第６図は他の従来例を示す斜視図、第７図
は同上をプリント基板に取り付けた後リード線の
はんだ付け状態を示す断面図、第８図は同上のリ
ード線のはんだ付け後のはんだ状態を示す断面図
、第９図はさらに他の従来例のプリント基板への
取付状態を示す断面図である。
１ははとめ、１ａは胴部、１ｂは底部、１ｅは
外周面、２はプリント基板、３は突起である。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a cross-sectional view showing the state in which the lead wires are soldered after the same as above is attached to the printed circuit board.
The figure is a perspective view showing another embodiment of the present invention, Figure 4 is a sectional view showing the lead wires being soldered after the above is attached to a printed circuit board, and Figure 5 is a conventional example of a printed circuit board. 6 is a perspective view showing another conventional example, FIG. 7 is a sectional view showing the soldering state of the lead wire after the same as above is attached to the printed circuit board, and FIG. 8 is a sectional view showing the same as above in the attached state. FIG. 9 is a cross-sectional view showing the state of soldering of the lead wires after soldering, and FIG. 9 is a cross-sectional view showing the state of attachment to a printed circuit board in another conventional example. 1 is an eyelet, 1a is a body part, 1b is a bottom part, 1e is an outer peripheral surface, 2 is a printed circuit board, and 3 is a protrusion.
Claims (1)
太径の底部を形成し、上記胴部の開口部をプリン
ト基板の銅箔面からプリント基板に穿孔した取付
孔に挿通し開口部をかしめてプリント基板に固着
されるはとめにおいて、上記底部の外周面を端部
方向にいくほどに拡開したテーパ面として成るは
とめ。 (2) 上記胴部の開口部の周縁に複数の突起を突
設して成る実用新案登録請求の範囲第１項記載の
はとめ。[Scope of Claim for Utility Model Registration] (1) A bottom portion having a diameter larger than the outer diameter of the body is formed on the bottom side of the bottomed cylindrical body, and the opening of the body is formed from the copper foil surface of the printed circuit board. An eyelet that is inserted into a mounting hole drilled in a printed circuit board and fixed to the printed circuit board by caulking the opening, the eyelet having an outer peripheral surface of the bottom part as a tapered surface that widens toward the end. (2) The eyelet set forth in claim 1 of the utility model registration claim, which comprises a plurality of protrusions protruding from the periphery of the opening of the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175124U JPS6282571U (en) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175124U JPS6282571U (en) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282571U true JPS6282571U (en) | 1987-05-26 |
Family
ID=31114150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985175124U Pending JPS6282571U (en) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282571U (en) |
-
1985
- 1985-11-14 JP JP1985175124U patent/JPS6282571U/ja active Pending