JPS6282573U - - Google Patents
Info
- Publication number
- JPS6282573U JPS6282573U JP1985175126U JP17512685U JPS6282573U JP S6282573 U JPS6282573 U JP S6282573U JP 1985175126 U JP1985175126 U JP 1985175126U JP 17512685 U JP17512685 U JP 17512685U JP S6282573 U JPS6282573 U JP S6282573U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- protrusion
- attaching
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図ａは同上をプリント基板に取り付けた後にデイ
ツピングしたときのはんだ状態を示す断面図、同
図ｂは同上にリード線をはんだ付けしたときのは
んだ状態を示す断面図、第３図ａは第２図ａの要
部の拡大断面図、同図ｂは第２図ｂの要部の拡大
断面図、第４図ａは従来例を示す斜視図、同図ｂ
は同図ａを反転させた斜視図、第５図は同上のプ
リント基板への取付状態を示す斜視図、第６図ａ
は同上をプリント基板に取り付けた後にデイツピ
ングしたときのはんだ状態を示す断面図、同図ｂ
は同上にリード線をはんだ付けしたときのはんだ
状態を示す断面図、第７図ａは第６図ａの要部の
拡大断面図、同図ｂは第６図ｂの要部の拡大断面
図である。
１ははとめ、１ａは胴部、１ｂは底部、２はプ
リント基板、２ａは銅箔面、２ｂは部品面、４は
突起、５は挿入孔、６はリード線、７ははんだで
ある。
Fig. 1 is a perspective view showing one embodiment of the present invention;
Figure a is a cross-sectional view showing the soldered state when the above is attached to a printed circuit board and soldered, Figure b is a cross-sectional view showing the soldered state when a lead wire is soldered to the same, and Figure 3 a is a cross-sectional view showing the soldered state when the lead wire is soldered to the same. Figure 4a is an enlarged sectional view of the main part of Figure a, Figure b is an enlarged sectional view of the main part of Figure 2b, Figure 4a is a perspective view of the conventional example, Figure b
is a perspective view of the same figure a, which is reversed, FIG.
Figure b is a cross-sectional view showing the soldering state when the above is attached to a printed circuit board and then soldered.
is a sectional view showing the soldered state when a lead wire is soldered to the same as above, FIG. 7a is an enlarged sectional view of the main part of FIG. 6a, and FIG. It is. 1 is an eyelet, 1a is a body, 1b is a bottom, 2 is a printed circuit board, 2a is a copper foil surface, 2b is a component surface, 4 is a protrusion, 5 is an insertion hole, 6 is a lead wire, and 7 is a solder.
Claims (1)
底部が形成されたはとめをプリント基板にリード
線をはんだ付けするため上記底部がプリント基板
の銅箔面側となるようにプリント基板に固着する
はとめのプリント基板への取付構造において、上
記底部のプリント基板側に接触する面の外周に突
起を形成し、該突起が挿入される挿入孔をプリン
ト基板に穿孔して成ることを特徴とするはとめの
プリント基板への取付構造。 The bottom of the bottomed cylindrical body has a bottom with a diameter larger than the outside diameter of the body.In order to solder the lead wire to the printed circuit board, make sure that the bottom is on the copper foil side of the printed circuit board. In the structure for attaching a grommet to a printed circuit board, which is fixed to the printed circuit board, a protrusion is formed on the outer periphery of the bottom surface that contacts the printed circuit board side, and an insertion hole into which the protrusion is inserted is bored in the printed circuit board. A structure for attaching an eyelet to a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175126U JPS6282573U (en) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175126U JPS6282573U (en) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282573U true JPS6282573U (en) | 1987-05-26 |
Family
ID=31114154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985175126U Pending JPS6282573U (en) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282573U (en) |
-
1985
- 1985-11-14 JP JP1985175126U patent/JPS6282573U/ja active Pending